Performance
4 x 2.5GbE Fanless Embedded System by Intel® 13th Gen Core™ i5-1335UE Processor Features
- Powered by Intel® 13th Gen Core™ i5-1335UE Processor (Raptor Lake, 15W TDP)
- High-Speed Networking: 4 x 2.5GbE LAN for reliable, fast connectivity
- High-Performance Memory: Supports DDR5 4800MHz SO-DIMM
- Enhanced Security: Integrated fTPM with optional discrete TPM
Performance
Fanless Embeded System onboard with Intel® 13th Gen Core™ i5-1335U/1335UE Features
- Onboard with Intel® 13th Gen Core™ i5-1335U/1335UE (Formerly Raptor Lake-P, TDP 15W)
- High-Speed Networking: 2 x 2.5GbE for fast and reliable connectivity
- Storage & Expansion: 1 x SATA III, 1 x M.2 E-Key, 1 x B+M Key paired with 1 x Nano SIM Slot
- Flexible Storage: 1 x M.2 M-key 2242/2280 (SATA III), 1 x M.2 M-key 2280
- Comprehensive I/O: 4 x RS485/422/232, 3 x USB 3.2 Gen 2, 4 x USB 2.0, 2 x RJ45
- Versatile Mounting: Supports desktop, wall mount, and DIN rail installation
Performance
Fanless Embedded Box PC with Intel® Celeron® Processor J Series (formerly Elkhart Lake)
Features
1. 1 x DDR4 3200/2933MHz up to 32GB
2. 1 x HDMI2.0b
3. 2 x 2.5GbE. 4 x COM, 4 x USB 3.2 Gen.1, 2 x USB2.0
4. 1 x SATA3 , 1 x M.2 M key (SATA) , 1 x M.2 E key (PCI-Ex1+USB2.0 Interface)
5. MB support DC-in 12V
6. Support Fan less cooling design, TPM2.0 (optional)
Performance
Fanless Embedded Box PC with Intel® Celeron® Processor J Series (formerly Elkhart Lake)
Features
1. 1 x DDR4 3200/2933MHz up to 32GB
2. 1 x HDMI
3. 6 x 2.5GbE, 3 x RS232, 1 x RS485/422/232, 2 x USB 3.2 Gen.1
4. 1 x SATAIII (6Gb/s), 1 x M.2 M key (2242, SATA)
5. MB support 12V DC-in, PoE Support 9-36V DC-in
6. Support Fanless cooling design, TPM2.0 (optional)
Performance
Intel® Alder Lake-S Chip, Support LGA1700 CPU, DDR4 up to 64GB, Support 12~19V DC-in
Features
1. Intel® 12th/13th/14th LGA1700 Socket Core I3,I5,I7 Pentium Processor (Max 35W) ; Intel® Alder Lake-S H610 Chip
2. 2 x DDR4 3200MHz up to 64GB
3. 2 x Realtek® RTL8111H GbE
4. 1 x SATA III (6Gb/s), 1 x M.2 (M key 2242/2280, NVMe)
5. 1 x M.2 E key(2230, CNVi/PCI-Ex1/USB2.0)
6. 2 x RS232, 2 x RS232/422/485 (Support 5V/12V TTL), 4 x USB3.2 (Gen1), 2 x USB2.0
7. 1x HDMI, 1x DP
8. Support Fanless cooling design
9. 12~19V DC-in
Performance
Fanless Embedded System featuring Intel® 13th Gen Core™ i5-1335U Processor supports DC-in 12~36V Features
- Efficient Performance: Powered by Intel® Processor i5-1335U (Raptor Lake-P) with 15W TDP.
- Quad Display Support: Dual HDMI and Dual DP for 4K Resolution.
- Advanced Memory: Supports up to 64GB DDR5 via 2 SO-DIMM slots.
- High-Speed Networking: Dual 2.5GbE Ports for Fast, Stable Connections
- Comprehensive I/O: 4 USB 3.2 Gen2, 6 USB 2.0, and 5 COM Ports for Versatile Connectivity
- Flexible Storage & Expansion: 2 M.2 M-key, 1 M.2 E-key, 1 M.2 B-key, and 1 SIM card slot for enhanced expansion.
- Security Ready: Optional TPM 2.0 for added security.
- Wide Power Support: Wide DC input range (12-36V) for diverse installation environments.
Performance
Fanless System, Intel® Q670E Chipset, supporting LGA 1700 socket for 12th/13th/14th Gen processors, with up to 96GB DDR5 memory
Features
● Supports Intel® 12th/13th/14th Gen Processors: Compatible with Alder Lake-S and Raptor Lake-S LGA1700 Socket.
● Powered by Intel® Q670E Chipset: For high performance and system reliability
● DDR5 Memory: 2x 4800MHz/5600MHz SO-DIMM up to 96GB.
● Quad-Display Support: 2x HDMI and 2x DP ports
● Dual 2.5GbE Ethernet Ports: Faster networking and data transfers.
● Versatile Expansion Slots: 2x M-key, 1x E-key, 1x B-key for SSD, Wi-Fi, and cellular modules; 1x PCIe x16(Gen4)
● Comprehensive I/O: 2x RS232/422/485, 4x RS232, 4x USB 3.2 Gen 2, 4x USB 2.0.
● Power Supply: DC19V/120W adapter for reliable power delivery
Performance
Intel® 10/11th LGA 1200 Socket Comet Lake-S Processor, DDR4 2933MHz up to 64GB
Features
1. Intel® 10/11th LGA 1200 Socket Comet Lake-S Processor
2. 2* Dual CH DDR4 2933MHz SO-DIMM up to 64GB
3. 8* USB, 2* RJ45,1* Line-out, 1* Mic, 1* DP, 2* HDMI, 4* COM (Max)
4.1* M.2 M-key 2280, 1* M.2 E-key 2230, 1* M.2 B-key 3042/3052
5. Support TPM2.0 (option)
6. Dimensions: 224 * 199 * 63 mm
7. DC19V/ 120W Adapter
Performance
Intel® Kaby Lake-U Processor, Support two DDR4 2133MHz up to 32GB
Features
1. Intel® Kaby Lake-U Processor
2. Support 2* SO-DIMM DDR4-2133 ,up to 32GB memory
3. 1* Full size Mini-PCIe shared with mSATA, 1* Half size Mini-PCIe, 1* mSATA shared with full size Mini-PCIe
4. 4* USB2.0, 4* USB3.0, 1* HDMI, 1* DP, 2* RJ45, 4* COM (Max), 1* MIC, 2* Line-out
5. DC-12V_60W Adapter
6. TPM 2.0 (option)
Performance
Intel® Elkhart Lake J6412 CPU, DDR4 up to 32GB, 6* 2.5GbE, support 12V DC-in
Features
1. Intel® Elkhart Lake J6412 Processor
2. Support 1* DDR4 3200 up to 32GB
3. 6* Intel® I225-V 2.5GbE
4. 1* M.2 M-key (2242, SATA/PCIe Gen.3x2 interface) support NVMe
5. 1* M.2 E-key (2230, USB2.0/PCIe Gen.3 x1 interface)
6. 1* M.2 B-key (3042, USB3.1/PCIe Gen.3 x1 interface)
7. 1* USB3.1 (Gen.2), 1* USB2.0, 3* COM, 1* HDMI, 1* RS232(RJ45 TYPE)
8. Fan-less cooling design
9. Adapter DC12V_60W
Performance
AMD RYZEN V1605B Processor, Support DDR4 2400MHz up to 32GB, Support 4* 4K Display, support wide voltage for Multiple Manufacturing application
Features
1. AMD RYZEN V1605B 2.0GHz/QC Core Processor
2. 2* DDR4 2400MHz up to 32GB
3. 1* 2.5”SATA, 1* M.2 E-key, 1* M.2 M-key, 1* M.2 B-key
4. Support 4* DP
5. 2* COM (Max : 6* COM), 2* LAN, 2* USB3.2, 4* USB2.0, 1* Line in, 1* Line out, 1* Mic
6. Mini ITX Form Factor (170 *170 mm)
7. Support TPM2.0 (optional)
8. DC12~28V input
Performance
Fanless embedded system with Intel® J6412 processor supports DC-in 12~36V and wide temperature range 20°C ~ 70°C Features
- Efficient Processing: Powered by Intel® J6412 SoC Processor (Elkhart Lake, TDP 10W)
- Triple Display Support: Equipped with 3 x DisplayPort outputs supporting 4K resolution
- Comprehensive I/O: Includes 2 x USB 3.2 Gen2, 4 x USB 2.0, and 1 Phoenix Port (1 GPIO, 2 RS232/422/485)
- Storage & Expansion: Optional eMMC, 1 x M.2 E-Key, 1 x M.2 M-Key, 1 x M.2 B-Key, and 1 SIM card slot
- Compact Fanless Design: Supports Wall Mount and DIN Rail for Space-Saving Installation
- Wide Range DC-In: Supports 12~36V input for versatile power options
Performance
Compact Fanless Embedded System with Intel® J6412/6210 Processor, supports DC-in 12~36V and wide temperature range 20°C ~ 60°C Features
- Efficient Processing: Powered by Intel® J6412/6210 SoC Processor (Elkhart Lake, TDP 10W/6.5W)
- Triple Display Support: Equipped with 3 x DisplayPort outputs supporting 4K resolution
- Comprehensive I/O: Includes 2 x USB 3.2 Gen2, 4 x USB 2.0, and 1 Phoenix Port (1 GPIO, 2 RS232/422/485)
- Storage & Expansion: Optional eMMC, 1 x M.2 E-Key, 1 x M.2 M-Key, 1 x M.2 B-Key, and 1 SIM card slot
- Compact Fanless Design (Only 27mm Height): Supports Wall Mount and DIN Rail for Space-Saving Installation
- Wide Range DC-In: Supports 12~36V input for versatile power options
Performance
Compact Fanless Embedded System with Intel® J6210 Processor, supports DC-in 12~36V and wide temperature range 20°C ~ 60°C Features
- Efficient Processing: Powered by Intel® J6210 SoC Processor (Elkhart Lake, TDP 6.5W)
- Triple Display Support: Equipped with 3 x DisplayPort outputs supporting 4K resolution
- Storage & Expansion: Optional eMMC, 1 x M.2 E-Key, 1 x M.2 M-Key, 1 x M.2 B-Key, and 1 SIM card slot
- Compact Fanless Design (Only 27mm Height): Supports Wall Mount and DIN Rail for Space-Saving Installation
- Enhanced Security: Optional TPM 2.0
- Wide Range DC-In: Supports 12~36V input for versatile power options
Performance
Intel® Elkhart Lake J6412 CPU, DDR4 up to 32GB, 12V DC-in
Features
1. Intel® Elkhart Lake J6412 2.0GHz/QC Core MCP Processor (Turbo 2.6GHz)
2. Support DDR4 3200/2933 up to 32GB
3. 2* Intel ® I225-V 2.5GbE
4. 1* SATA III (6Gb/s), 1* M.2 M key (NVMe/SATA)
5. 1* M.2 E key (support WIFI/BT Module)
6. 1* M.2 B key (support 4G/5G Module)
7. 1* VGA, 1* HDMI
8. 2* USB3.1(Gen.1), 4* USB2.0, 2* RS485, 2* RS232
9. Fanless cooling design
10. 12V DC-in
Performance
Intel® Bay Trail 2930 SoC Processor, Support Wide Voltage 90~240 AC in
Features
1. Intel® Bay Trail N2930 SoC Processor
2. Single Channel DDR3L 1333MHz SDRAM up to 8GB
3. 2 * GbE, 4 * 100M PoE LAN
4. 1 * USB3.0, 5 * USB2.0
5. M/B Form Factor : 3.5” (148x102mm)
6. Support Wide Voltage 90~240 AC in
Performance
Fanless Compact Box PC with Intel® Braswell N3160 Features
- Powered by Intel® Celeron® N3160 Processor (Braswell, TDP 6W)
- Dual Display: Supports HDMI and DP outputs
- Expandable Connectivity: 1 x SATA, 1 x M.2 (M-key 2242), 1 x mini-PCIe slot for add-ons
- Comprehensive I/O: 6 x USB, 5 x COM, HDMI, DP, dual LAN, MIC, and Line-Out
- Wide Power Range: DC 9~36V input
- Versatile Mounting: Fanless compact design supports Wall Mount and DIN rail installation
- Optional TPM 2.0 support
Performance
Fanless System with Intel® 8th/9th Gen CPU, H310 Chipset, 12–24V DC-in Support Features
- Powered by Intel® 8th/9th Gen LGA1151 Socket Processor (Coffee Lake, Max 35W)
- Dual Channel DDR4, up to 32GB
- Dual Networking: 1 x GbE, 1 x 2.5GbE for fast, reliable connections
- Versatile Display Options: 1 x HDMI (4K), 1 x VGA, and Optional eDP (4K) for flexible display setups
- Comprehensive I/O: 4 x RS232, 4 x USB 3.0
- Storage & Expansion: 1 x SATA III (6Gb/s), 1 x M.2 M-key, 1 x M.2 E-Key, and 1 x PCIe x4 slot
- Wide Voltage Power Input: 12–24V DC-in for industrial applications
Performance
Fanless embedded system with Intel® LGA1151 CPU supports triple display and DC-in 9~24V Features
- Powered by Intel® LGA1151 Socket 6th & 7th Generation Pentium, Core i3, i5, and i7 Processors (TDP 35W).
- Supports Dual DDR4 SODIMM Up to 32GB
- Dual GbE Ethernet Ports provide high-speed and reliable networking
- Triple Display Support: 1 x HDMI, 2 x DP, with 4K resolution capability
- Comprehensive I/O: 4 x USB 3.0, 2 x USB 2.0,6 x COM Ports
- Fanless black aluminum enclosure with support for wall mounting and DIN rail mounting
Performance
Intel® LGA1151 CPU, DDR4 2400/2666MHz up to 64GB
Features
1. Fanless Black Aluminum Enclosure
2. Support Intel LGA1151 Coffee Lake Processors
3. Supports DDR4 2400/2666MHz SODIMM up to 64GB
4. Supports up to 3 Displays, 1* HDMI, 2* DP
5. 1* 2.5” SATAIII 6Gb/s Internal Drive bay
6. 1* M.2(M-key, 2242/2260/2280, Support NVMe) slot for SSD
7. Support onboard TPM 2.0
Performance
Compact Fanless Embedded System with Intel® Processor J3455 Features
- Powered by Intel® Celeron® Processor J3455 (Apollo Lake, TDP 10W)
- Dual Display Support: 2 HDMI outputs for flexible 4K connectivity
- Comprehensive I/O: 4 USB 3.0, 2 COM, 2 RJ45, and 1 audio combo for MIC and Line Out
- Two Expansion I/O Doors: Supports flexible daughter card integration
- Flexible Daughter Card: Options for 8 LAN, 8 COM, 4 USB 3.0, or 32-bit GPIO ports
- Versatile Mounting Options: Wall mount and DIN rail clip for easy installation
Performance
Compact Fanless System with Intel® LGA1200 Socket 10th/11th Gen Processor and H470 Chipset Features
- Powered by Intel® LGA1200 10th/11th Gen Socket Processor (Comet Lake-S, TDP 35W)
- Dual Display Support: 1 x DP and 1 x HDMI for 4K Resolution
- Comprehensive I/O: 3 x USB 3.2 Gen2, 1 x USB 3.2 (Type-C), 4 x USB 2.0, 1 x GbE, 1 x COM
- Storage and Expansion: 1 x SATA III, 1 x M.2 M-key, and 1 x M.2 E-key
- Supports Wall Mount for Easy Installation
- Optional TPM 2.0 Support
Performance
Fanless Barebone with Intel® LGA1200 10th/11th Gen Socket Processor Features
- Intel® LGA1200 Socket: Supports 10th/11th Gen Pentium, Core i3/i5/i7 processors, up to 35W
- 4K Resolution Display: Dual HDMI and 1 DP output
- Comprehensive I/O: 4 USB 3.2, 2 USB 2.0, 2 RJ45, 4 COM ports, and a 2.5" HDD tray
- Enhanced Expansion: Includes M.2 M-Key, M.2 E-Key, and M.2 B-Key with SIM card slot
- Wide Power Input: DC-in 12–28V for diverse installation needs
- Flexible Installation: Supports wall mount and DIN rail clip for space-saving setups
Performance
Compact Fanless Embedded System with Intel® Celeron® Processor J1900 Features
- Powered by Intel® Celeron® Processor J1900 (Bay Trail, TDP 10W)
- Dual Display Support: HDMI and VGA outputs for flexible connectivity
- Comprehensive I/O: 1 USB 3.0, 3 USB 2.0, 1 COM, 2 RJ45, 1 MIC, and 1 Line Out
- Two Expansion I/O Doors: Enables Flexible Daughter Card Integration
- Flexible Daughter Card: Configurable options for 8 LAN, 8 COM, 4 USB 3.0, or 32-bits GPIO port
- Versatile Mounting Options: Supports wall mount and DIN rail clip for easy installation
Performance
Intel® Bay Trail SoC Processor, support wide temperature, 9~24V DC-in
Features
1. Intel® Bay Trail SoC Processor (Default: J1900)
2. Support 1 * SO-DIMM DDR3L-1333MHz up to 8GB
3. All-aluminum body, produced by casting process
4. Operating Temperature: -40 ~ 70° C
5. 9~24V DC-in (Lockable type)
Performance
Intel® Coffee Lake-S Chip, Support LGA1151 CPU, DDR4 up to 32GB, Support 12~36V DC-in
1. Intel® LGA1151 Socket Core I3,I5,I7 Pentium Processor (Max 35W)
2. Intel® Coffee Lake-S H310 Chip
3. Support Dual Channel DDR4 2133MHz up to 32GB
4. Support MXM Type A/B VGA Card(Type A or B, Max 75W)
5. 1* M.2 E key Support CNVi, 1* M.2 B key Support 3G/4G Module
6. 1* RS232 ( Support 5V/12V TTL), 4* USB3.1, 1* GbE, 4* HDMI, 2* DP, 1* eDP (By MXM)
7. 12~36V DC-in
Performance
Fanless System with Intel® E3940 SoC Processor, Supporting -40 ~ 70°C and 9~36V DC-in Features
- Powered by Intel® Celeron® Processor E3940 (Apollo Lake, TDP 10W)
- Isolated I/O: 1 x 16-bit Isolated GPIO and 2 x Isolated RS485
- Comprehensive I/O: 4 x USB 3.0, 4 x COM, 1 x VGA, 1 x HDMI, 2 x RJ45, and 1 x SIM Card Slot
- Supports Wall Mount and DIN Rail Clip for Easy Installation
- Wide-Range Power Input: 9~36V DC-in (Phoenix Terminal Connector)
- Wide Operating Temperature: -40 ~ 70°C for Different Industrial Applications
Performance Legacy
New Model: BFTADN1-N97-N or BFDADN1-N97-N
Intel® Apollo Lake SoC Processor, DDR3L SODIMM up to 8GB
1. Intel® Apollo Lake SoC Processor
2. Support 1 * SO-DIMM DDR3L , up to 8GB memory
3. 2 * USB2.0, 4 * USB3.0, 2 * DP, 2 * RJ45, 1 * SD, 1 * RS232 (RJ45 type)
4. DC-12V_60W FSP Adapter
New Model: BFTADN1-N97-N or BFDADN1-N97-N