SoC-N97

BFDADN1-N97-N

Fanless Embedded Box PC with Intel® Processor N-series Features 1. 1* DDR5 4800MHz SODIMM Slot, up to 32GB 2. 2* HDMI 2.0b, 1* Type C DP1.4a 3. 2* 2.5GbE 4. 1* RS485/422/232, 3* RS232 5. 1* USB 3.2 Gen2, 6* USB2.0, 1* USB3.2 Type C 6. 1* M.2 2280 M-key, 1* M.2 2230 E-key, 1* M.2 3042 B-key 7. MB support Wide DC Input 12-28V 8. Support 64GB eMMC & TPM2.0 (Optional)  Certification

Mini-ITX with Intel® Processor N-series Processors Coming Soon Features 1. 1* DDR5 SODIMM Slot, up to 32GB 2. 2* HDMI 2.0b, 1* Type-C DP, 1* LVDS/eDP 3. 2* 2.5GbE 4. 1* USB 3.2 Gen2, 1* USB3.2 Gen2 Type-C, 6* USB2.0 5. 1* RS232/422/485, 5* RS232, 1* RJ11 (co-lay RS232) 6. 1* M.2 2242/2280 M-key, 1* M.2 2230 E-key, 1* M.2 3042/3052 B-key 7. 1* SATAIII 8. DC Input 12~28V  Certification

SoC-Others

ADPIE8AIHLB

PCIe x8 Slot / 2* HAILO-8 AI processor Features 1. 2* Hailo-8™ AI processor 2. Enabling real-time, low latency and high-efficiency AI inferencing on edge devices 3. Powered by 2* 26 TOPS Hailo-8™ AI Processor with best-inclass power efficiency 4. Precautions : ADPIE8AIHLB cannot be sold separately, it must be used together with the MI3H motherboard.

Socket-R680E

HB652I3H Series

Intel R680E Chipset support LGA 1700 socket for the 13th Gen i9/i7/i5/i3 processor, support DDR5-5600MHz up to 64GB Features 1. Intel® 13th LGA1700 Socket Processor 2. 2* DDR5 5600MHz SO-DIMM up to 64GB 3. 2* 10/100/1000/2500 Base-T Ethernet Ports 4. 2* M.2 M-key, 1* M.2 E-key, 1* M.2 B-key 5. Hailo-8 expansion card , up to 52/104 TOPS 6. 1* HDMI, 2* RS232/422/485, 4* RS232, 8* USB3.2(Gen.2),2* USB2.0 7. Dimensions: 306* 199* 79 mm 8. Adapter DC19V/120W  Certification

SoC-Others

ADPIE8AIHLA

PCIe x8 Slot / 2* HAILO-8 AI Processor Features 1. 2* Hailo-8™ AI Processor 2. Enabling real-time, low latency and high-efficiency AI inferencing on edge devices 3. Powered by 2* 26 TOPS Hailo-8™ AI Processor with best-inclass power efficiency 4. Precautions : ADPIE8AIHLA cannot be sold separately, it must be used together with the MA3H motherboard.

Socket-R680E

HB190MA3H-R680 Series

AI Edge Server with options of 52 TOPs and 104 TOPs AI PCIe Module. Intel® R680E chipset supports LGA 1700 socket for 12 th /13 th Core™ i9/i7/i5/i3 Pentium® Processor with DDR5 4800MHz up to 128GB memory. Features 1. Intel® 13th LGA1700 Socket Processor 2. Intel® R680E Chipset 3. 4* DDR5 4800MHz Long-DIMM up to 128 GB 4. Hailo-8 expansion card, up to 52/104 TOPS 5. 2* 2.5GbE, 8* USB3.2 (Gen.2), 1* HDMI 6. 4* SATAIII support HOT SWAP 7. Dimensions: 480* 430* 177mm 8. ATX 500W POWER  Certification

Socket-H110

LA31-H110 Series

Intel® Sky Lake-S H110 chipset, supports LGA1151 CPU, On board DDR4 up to 16GB Features 1. Intel® LGA1151 Socket supports 6/7th Gen Core Processor 2. Intel® Sky Lake-S H110 3. On board 8GB DDR4 Dram (Max 16GB) 4. 1* Intel® i225-V 2.5GbE, 1* Intel® i219-LM GbE 5. 1* M.2 M-Key (2242/2280,SATAIII) 6. 4* SATA III (6Gb/s,SATA4 Co-lay M Key) 7. 1* DVI-D, 1* HDMI, Output 8. 2* RS232/422/485, 4* RS232, 4* USB3.0, 6* USB2.0 9. 16bit GPIO 10. Support Onboard TPM2.0 (option) 11. 24 + 4 Pin ATX Power Input 12. ATX Form Factor (305x220mm)  Certification

Intel® Alder Lake-N SoC Processor with DDR5 up to 32 GB, provide optional 64GB eMMC onboard, Support three M.2 slots, two 2.5GbE ports , triple displays, ten USB ports, 12~28V wide-voltage DC-in Features 1. Intel® Alder Lake-N SoC Processor (TDP 12W) 2. 1* DDR5 4800MHz SO-DIMM up to 32GB 3. 2* Intel i225V 2.5GbE 4. 2* HDMI 2.0b, 1* eDP (co layout LVDS), 1* LVDS w/Inverter 5. 1* SATAIII (6Gb/ s), 6* COM, 1* USB3.2 (Gen.2) Type-A, 8* USB 2.0, 1* USB Type-C (ALT mode) 6. 1* M.2 M-key(2280) support NVMe, 1* M.2 E-key(2230) support CNVi, 1* M.2 B-key(3042/3052) support 4G/5G module 7. Support 12~ 28 V DC-in 8. Support Onboard TPM2.0 (optional) Certification

Socket-B760

LA34-B7600 Series

ATX size with 12th/13th Gen. LGA1700 Socket Processor, Intel® Alder lake-S B760 chipset, DDR5 up to 64GB, 2* M.2 M-key, 1* M.2 E-key, support 4 display Features 1. Intel® 12th/13th LGA1700 Socket Processor (Max.125W TDP) 2. Intel® Alder Lake-S B760 Chip 3. 2* DDR5 4800MHz UDIMM up to 64GB 4. 1* VGA, 1* HDMI, 1* DP, 1* LVDS/EDP(Option) 5. 1* 2.5GbE, 1* GbE 6. 6* COM, 6* USB3.2 (Gen.1), 6* USB2.0, 2* USB2.0 Type-A (Vertical) 7. 2* M.2 M-key (2280, NVMe, PCI-Ex2/PCI-Ex4 Interface), 1* M.2 E-key (2230, CNVi/PCI-Ex1 Interface) 8. 1* PCI-Ex16 (Gen.4), 2* PCI-Ex4 (Gen.3), 4* PCI 9. Onboard TPM2.0(Option) 10. ATX Power  Certification

Socket-H610E

LA34-H6100 Series

ATX size with 12th/13th Gen. LGA1700 Socket Processor, Intel® Alder lake-S H610/H610E chipset, DDR5 up to 64GB, 1* M.2 M-key, 1* M.2 E-key, support 3 display Features 1. Intel® 12th/13th LGA1700 Socket Processor (Max.125W TDP) 2. Intel® Alder Lake-S H610/H610E Chip 3. 2* DDR5 4800MHz UDIMM up to 64GB 4. 1* VGA, 1* HDMI, 1* DP, 1* LVDS/EDP(Option) 5. 1* 2.5GbE, 1* GbE 6. 6* COM, 4* USB3.2 (Gen.1), 6* USB2.0, 2* USB2.0 Type-A (Vertical) 7. 1* M.2 M-key (2280, NVMe, PCI-Ex2 Interface), 1* M.2 E-key (2230, CNVi Interface) 8. 1* PCI-Ex16 (Gen.4), 2* PCI-Ex4 (Gen.3), 4* PCI 9. Onboard TPM2.0(Option) 10. ATX Power  Certification

SoC-J6412

LI36 Series

Mini ITX size with Elkhart Lake J6412 SoC Processor, DDR4 up to 32GB, 6* 2.5GbE, support 3 display Features 1. Intel® Elkhart lake J6412 SoC Processor (2.0GHz/QC) 2. 1* DDR4 3200MHz SO-DIMM up to 32GB 3. 6* 2.5 GbE (LAN3/4/5/6 Support PoE, 802.3af/at compliance) 4. 2* USB3.2 (Gen.1), 4* USB2.0 5. 4* COM (COM1: RS232 for RJ45, COM2: RS232/422/485, COM3/4: RS232) 6. 1* M.2 M-key (2242 SATA interface), 1* SATAIII 7. Onboard TPM2.0 (Option) 8. On board 64GB eMMC (Optional) 9. 12V DC-in12V DC-in  Certification

Intel® 11th Tiger Lake-UP3 Core SoC Processor, DDR4 up to 32GB, 1* GbE, 1* RJ11, support triple display Features 1. Intel® 11th Tiger Lake-UP3 SoC Processor (6305E 1.8GHz/DC) 2. 1* DDR4 3200MHz SO-DIMM up to 32GB 3. 1* HDMI, 1* LVDS/eDP, 1* eDP 4. 1* Realtek® RTL8111H GbE 5. 4* USB3.2 (Gen.1), 7* USB2.0, 3* RS232, 1* RJ11 6. 1* M.2 M-key (2242/2280, PCIe x4), 1* M.2 E-key (2230), 1* SATAIII 7. Onboard TPM2.0 (Option) 8. 12-24V DC-in  Certification

Intel® 11th Tiger Lake-UP3 Core SoC Processor, DDR4 up to 32GB, 2* GbE, support triple display Features 1. Intel® 11th Tiger Lake-UP3 SoC Processor (Default: 6305E 1.8GHz/DC) 2. 1* DDR4 3200MHz SO-DIMM up to 32GB 3. 1* HDMI, 1* LVDS/eDP, 1* eDP 4. 2* Realtek® RTL8111H GbE 5. 4* USB3.2 (Gen.1), 5* USB2.0, 9* COM (COM4/5 Support RS232/422/485) 6. 1* M.2 M-key (2242/2280, PCIe x4), 1* M.2 E-key (2230), 1* SATAIII 7. Onboard TPM2.0 (Option) 8. 12-24V DC-in  Certification

SoC-1335U

HB650I24 Series

Intel® 13th Raptor Lake-P Processor, DDR5 5200MHz up to 64GB Features 1. Intel® 13th Raptor Lake-P Processor 2. 2* DDR5 5200MHz SO-DIMM up to 64GB 3. 10* USB, 2* RJ45,1* Audio, 2* HDMI, 5* COM 4. 1* M.2 M-key 2280, 1* M.2 M-key 2242, 1* M.2 E-key 2230, 1* M.2 B-key 3042/3052 5. Support TPM2.0 (option) 6. Dimensions: 224 * 199 * 63 mm 7. Adapter DC19/120W  Certification

Socket-H610

LI32-H6100 Series

Intel® 12/13th Core i9/i7/ i5 /i3, Celeron & Pentium® LGA1700 Socket Processor, DDR5 up to 64GB, support 3 display Features 1. Intel® 12/13th LGA1700 Socket Processor (Max.65W TDP) 2. Intel® Alder Lake-S H610 chipset 3. 2* DDR5 5600MHz/4800MHz UDIMM up to 64GB 4. 2* HDMI, 1* VGA 5. 2* REALTEK® RTL8111H GbE 6. 4* USB3.2 (Gen.1), 8* USB2.0, 10* COM(RS232, COM1/2 Co-lay 422/485) 7. 1* M.2 M-key 2242/2280(PCI-Ex4), 1* M.2 E-key 2230, 2* SATAIII 8. Onboard TPM2.0(Option) 9. ATX Power  Certification

SoC-1335UE

MI24 Series

Slim Mini-ITX with Intel® 13th Raptor Lake-P i5-1335UE/i5-1335U SoC Processor, 15W TDPs, Dual DDR5 5200MHz Features 1. Intel® 13th Raptor Lake-P i5-1335UE/i5-1355U SoC Processor 2. 2* DDR5 5200MHz SO-DIMM up to 64GB 3. 2* M.2 M-key, 1* M.2 E-key for WiFi, 1* M.2 B-key for 4G/5G module, 1* SIM card, 1* PCIe Gen.3 x1 4. 2* HDMI, 1* LVDS (co-lay eDP) 5. 4* RS232, 2* RS232/422/485, 1* SATAIII, 2* USB3.2 (Gen.2), 2* USB3.2 (Gen.2) Type-C support DP ALT mode and PD 5V/3A, 7* USB2.0 6. Onboard TPM2.0 (option) 7. Support JetBIOS back up tool 8. 12~24V DC-in  Certification

SoC-1135G7

LE30 Series

Intel® 11th Gen. Tiger Lake-UP3 SoC Processors, M.2 PCIe 4.0 x4 support NVMe, 4* USB3.2, 2* 2.5GbE Features 1. Intel® Tiger Lake-UP3 SoC Processor (TDP 12~28W) 2. 1* DDR4-3200MHz SO-DIMM up to 32GB 3. 2* Intel i225-V 2.5GbE 4. 1* VGA,1* HDMI2.0b, 1* eDP, 1* 24-bits LVDS 5. 2* RS232, 2* RS232/422/485, 2* USB3.2 (Gen2), 2* USB3.2 (Gen1), 2* USB2.0 6. 1* M.2 M-key (2242/2280, 1* M.2 E-key(2230), 1* M.2 B-key (3042/3052), 1* SATAIII (6Gb/s) 7. 2* Mixture Header (2* UART, 3* USB2.0, 1* LPC, 1* GPIO(8bit), 1* PCI-Ex1) 8. Onboard TPM 2.0 (option) 9. 12~24V DC-in  Certification

SoC-Others

JADM2M2G5DL

M.2 M-key 2280 2.5GbE LAN Card Features 1. ASMEDIA ASM1806 2. 2* Intel® I225-V 2.5GbE 3. M.2 M key 2280 size

SoC-Others

JADM2ECAN

M.2 E-key 2230 CAN Card Features 1. FINTEK F81604N 2. FINTEK F81251S 3. Support 2* CAN 4. Support optical isolation ±58V 5. Industrial Temperature (-30°C to +80°C) 6. Compliant with EN61000-4-2 (ESD) Air-15kV, Contact-8kV 7. M.2 E key 2230 size

Socket-Q670E

HB651I215 Series

Intel® Q670E Chipset support LGA 1700 socket for the 12th/13th Gen i9/i7/i5/i3 processor, support DDR5 up to 64GB Features 1. Intel® 12/13th (Alder Lake-S/Raptor Lake-S) LGA1700 Socket Processor 2. Intel® Q670E chipset 3. 2* DDR5 4800MHz/5600MHz SO-DIMM up to 64GB 4. 2* 2.5GbE Ethernet Ports 5. 2* M.2 M-key, 1* M.2 E-key, 1* M.2 B-key 6. Single PCI Express x16 (Gen.4) 7. 2* HDMI, 2* DP support Quad displays 8. 2* RS232/422/485, 4* RS232, 4* USB3.2 (Gen.2), 4* USB2.0 9. Dimensions: 306 * 199 * 79 mm 10. Adapter DC19V/120W  Certification

Socket-Q470E

LI21-Q470E Series

Intel® Comet Lake-S Q470E chipset, support LGA1200 processor (Max. 65W), DDR4 up to 64GB Features 1.Intel® LGA1200 Socket supports 10/11th Gen. Core Processor (Max 65W) 2. Intel® Comet Lake-S Q470E chipset 3. 2* DDR4 3200/2933MHz up to 64GB 4. 1* Intel®i226-V 2.5GbE, 1* Intel® i219-LM GbE 5. 1* M.2 M-Key (PCI-Ex4), 1* M.2 E-Key (CNVi/PCI-Ex1/USB2.0), 1* M.2 B-Key (PCI-Ex1/USB3.2/USB2.0) 6. 1* SATA III (6Gb/s), 1* PCI-E x16 slot 7. 1* DP (Co-lay VGA), 2* HDMI, 1* LVDS/eDP Output 8. 2* RS232/422/485, 4* RS232, 6* USB3.2 (Gen1), 4* USB2.0 9. Support Onboard TPM2.0 (LI21-Q470E2, option) 10. 12-28V DC-in 11. Thin Mini-ITX Form Factor (170x170mm)  Certification

Socket-H420E

LI21-H420E Series

Intel® Comet Lake-S H420E chipset, support LGA1200 processor (Max. 65W), DDR4 up to 64GB Features 1.Intel® LGA1200 Socket supports 10/11th Gen. Core Processor (Max 65W) 2. Intel® Comet Lake-S H420E chipset 3. 2* DDR4 2933/2666MHz up to 64GB 4. 1* Intel®i226-V 2.5GbE, 1* Intel® i219-LM GbE 5. 1* M.2 M-Key (PCI-Ex4), 1* M.2 E-Key (CNVi/PCI-Ex1), 1* M.2 B-Key(USB3.2/USB2.0) 6. 1* SATA III (6Gb/s), 1* PCI-E x16 slot 7. 1* DP (Co-lay VGA), 2* HDMI, 1* LVDS/eDP Output 8. 2* RS232/422/485, 4* RS232, 4* USB3.2 (Gen1), 4* USB2.0 9. Support Onboard TPM2.0 (LI21-H420E2, option) 10. 12-28V DC-in 11. Thin Mini-ITX Form Factor (170x170mm)  Certification

SoC-J3455

HBJC142I12-345B

Intel® Apollo Lake J3455 SoC Processor, DDR3L up to 8GB Features 1. Intel® Apollo Lake J3455 SoC Processor (TDP 10W) 2. 1* DDR3L 1866MHz SO-DIMM slot up to 8GB 3. 2* USB2.0, 4* USB3.0, 1* HDMI, 1* VGA, 2* RJ45 4. 1* TPM2.0 (option) 5. M/B Form Factor: Thin Mini ITX (170x170mm) 6. DC-12V_60W Adapter  Certification

Socket-H610

LI25-H6100L Series

170x170mm size with 12/13th Intel® Core™ i9/i7/ i5 /i3, Celeron, Pentium® LGA1700 Socket Processor, DDR4 up to 64GB, support 3 display, 2* RJ45, 6* COM Features 1. Intel® 12/13th LGA1700 Socket Processor (Max. 65W TDP) 2. Intel® Alder Lake-S H610 Chipset 3. 2* DDR4 3200MHz UDIMM up to 64GB 4. 1* HDMI, 1* DP, 1* LVDS or eDP 5. 2* GbE 6. 2* USB3.2 (Gen.2), 2* USB3.2(Gen.1), 5* USB2.0, 6* COM 7. 1* M.2 M-key, 2242/2280(PCI-Ex4), 1* M.2 E-key, 2230, 2* SATAIII (6Gb/s) 8. Onboard TPM2.0 (Option) 9. 19V DC-in  Certification

Socket-H610

LI25-H6100 Series

170x170mm size with 12/13th Intel® Core™ i9/i7/ i5 /i3, Celeron, Pentium® LGA1700 Socket Processor, DDR4 up to 64GB, support 3 display Features 1. Intel® 12/13th LGA1700 Socket Processor (Max. 65W TDP) 2. Intel® Alder Lake-S H610 Chipset 3. 2* DDR4 3200MHz UDIMM up to 64GB 4. 1* HDMI, 1* DP, 1* LVDS or eDP 5. 1* GbE 6. 2* USB3.2 (Gen.2), 2* USB3.2(Gen.1), 5* USB2.0 7. 1* M.2 M-key, 2242/2280(PCI-Ex4), 1* M.2 E-key, 2230, 2* SATAIII (6Gb/s) 8. Onboard TPM2.0 (Option) 9. 19V DC-in  Certification

Socket-Q670E

MI215Q6700 Series

Intel Q670E Chipset support LGA 1700 socket for the Intel® 13th/12th Gen (Raptor Lake-S/Alder Lake-S) i9/i7/i5/i3 processor, support DDR5-5600MHz/4800MHz up to 64GB, Support Max. 65W TDPs under 180A Features 1. Intel® 13th/12th LGA1700 Socket Processor (Max. 65W TDPs under 180A) 2. 2* DDR5 5600MHz/4800MHz SO-DIMM up to 64GB 3. 2* 10/100/1000/2500 Base-T Ethernet 4. 2* M.2 M-key support NVMe, 1* M.2 E-key supports CNVio, 1* M.2 B-key supports 4G/5G module, Single PCI Express x16(Gen.4) support Max. 70W 5. 2* HDMI, 2* DP, 1* LVDS/eDP support Quad displays 6. 2* RS232/422/485, 4* RS232, 4* USB3.2(Gen.2), 2* USB3.2 (Gen.1), 4* USB2.0 7. 2* SATAIII ports up to 6Gb/s support RAID 0/1 8. Support JetBIOS SW back up tool 9. Support onboard TPM2.0 option (Only MI215Q6702 Series) 10. Support wide voltage 12V~36V DC-in  Certification

Socket-R680E

MI215R6800 Series

Intel R680E Chipset support LGA 1700 socket for the Intel® 13th/12th Gen (Raptor Lake-S/Alder Lake-S) i9/i7/i5/i3 processor, support DDR5-5600MHz/4800MHz up to 64GB, Support Max. 65W TDPs under 180A Features 1. Intel® 13th/12th LGA1700 Socket Processor (Max. 65W TDPs under 180A) 2. 2* DDR5 5600MHz/4800MHz SO-DIMM up to 64GB 3. 2* 10/100/1000/2500 Base-T Ethernet 4. 2* M.2 M-key support NVMe, 1* M.2 E-key supports CNVio, 1* M.2 B-key supports 4G/5G module. Single PCI Express x16(Gen.4) support Max. 70W 5. 2* HDMI, 2* DP, 1* LVDS/eDP support Quad displays 6. 2* RS232/422/485, 4* RS232, 4* USB3.2(Gen.2), 2* USB3.2 (Gen.1), 4* USB2.0 7. 2* SATAIII ports up to 6Gb/s support RAID 0/1 8. Support JetBIOS SW back up tool 9. Support onboard TPM2.0 option (Only MI215R6802 Series) 10. Support wide voltage 12V~36V DC-in  Certification

Socket-H610

MI215H6100 Series

Intel H610/H610E Chipset support LGA 1700 socket for the 13th/12th Gen (Raptor Lake-S/Alder Lake-S) i9/i7/i5/i3 processor, support DDR5 up to 64GB, Support Max. 65W TDPs under 180A Features 1. Intel® 13th/12th LGA1700 Socket Processor (Max. 65W TDPs under 180A) 2. 2* DDR5 5600MHz/4800MHz SO-DIMM up to 64GB 3. 2* 10/100/1000/2500 Base-T Ethernet Ports 4. 1* M.2 M-key, 1* M.2 E-key supports CNVio, 1* M.2 B-key supports 4G/5G module, Single PCI Express x16(Gen.4) support Max. 70W 5. 2* HDMI, 2* DP, 1* LVDS/eDP support Triple displays 6. 2* RS232/422/485, 4* RS232, 2* USB3.2(Gen.2), 1* USB3.2 (Gen.1), 3* USB2.0 7. 2* SATAIII ports up to 6Gb/s 8. Support JetBIOS SW back up tool 9. Support onboard TPM2.0 option (Only MI215H6102 Series) 10. Support wide voltage 12V~36V DC-in  Certification

Socket-H610E

LM26 Series

Intel® 12/13th Gen. LGA1700 Socket Processor, 2* DDR4 3200MHz UDIMM up to 64GB, support 3 display Features 1. Intel® 12/13th LGA1700 Socket Processor (Max.125W TDP) 2. Intel® Alder Lake-S H610E / H610 Chip 3. 2* DDR4 3200MHz UDIMM up to 64GB 4. 1* VGA, 1* HDMI, 1* DP 5. 2* 2.5GbE, 1* GbE 6. 10 or 6* COM, 3* USB3.2 (Gen.1), 7* USB2.0, 1* USB2.0 Type-A (Vertical) 7. 1* M.2 M-key, 2242/2280 (PCI-Ex4), 1* M.2 M-key, 2242/2280 (SATA), 1* M.2 B-key, 3042/3052,1* M.2 E-key, 2230, 4* SATAIII 8. 1* PCI-Ex16 (Gen.4), 1* PCI-Ex4 (Gen.3), 2* PCI 9. Onboard TPM2.0 (Option) 10. ATX Power  Certification

Socket-Q670E

HBJC150I225 Series

Intel® 12th/13th Gen (Alder Lake-S/Raptor Lake-S) LGA1700 Socket Processor, 2*DDR5 up to 64GB Features 1.Intel® 12/13th LGA1700 Socket Processor (Max. 65W TDPs) 2. Intel® Alder Lake-S Q670E/H610 Chipset 3. 2* DDR5 4800MHz/5600MHz SO-DIMM up to 64GB 4. 8* USB, 2* RJ45, 1* MIC, 1* Line-out, 1* Line-in, 2* COM, 1* DP, 1* HDMI, 1* VGA 5. Onboard TPM2.0 (optional) 6. 1U FLEX 400W Power  Certification