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| SYSTEM | |
| MB FORM FACTOR | Mini-ITX |
| CPU | Intel® LGA1700 12/13/14th Gen Socket Processor (Formerly Alder Lake-S, TDP 65W) |
| CHIPSET | Intel® H610/H610E |
| MEMORY | 2 x DDR5 4800MT/s SO-DIMM, up to 96GB 2 x DDR5 5600MT/s SO-DIMM, up to 64GB (Intel® 13th/14th Gen CPU) |
| BIOS | AMI 256Mb Flash ROM |
| WATCHDOG TIMER | 255 Levels |
| SECURITY | TPM2.0 |
| DIMENSION (W X D) | 170.0 (W) x 170.0 (D) mm (6.7″ x 6.7″) |
| OS SUPPORT | Windows® 11 (64bit) Windows® 10 (64bit) Linux |
| POWER | |
| POWER REQUIREMENT | ATX Power Supply |
| POWER ON MODE | AT / ATX |
| CONNECTOR | 24+4-pin ATX PWR |
| DISPLAY | |
| GPU | Intel® UHD Graphics |
| LVDS | 1 x LVDS (Max. Resolution: 1920 x 1200 @60Hz, Co-lay eDP) |
| DP | 1 x DP1.4a (Max Resolution: 4096 x 2304@60Hz) |
| HDMI® | 1 x HDMI® 2.0b (Max Resolution: 4096 x 2160@60Hz) |
| VGA | 1 x VGA (Max Resolution: 1920 x 1080 @60Hz) |
| MULTIPLE DISPLAY | Support 3 Displays |
| AUDIO | |
| CODEC | Realtek Audio Codec |
| Line-in | 1 x Audio Jack for Line-In |
| Line-out | 1 x Audio Jack for Line-Out |
| MIC-in | 1 x Audio Jack for MIC-In |
| LAN | |
| ETHERNET | 1 x RJ45 for Intel® I219-V GbE 1 x RJ45 for Intel® I226-V 2.5GbE |
| USB PORT | |
| USB | 2 x USB 3.2 Gen 2x1 (10Gbps, Formerly USB 3.1 Gen 2) 2 x USB 3.2 Gen 1x1 (5Gbps, Formerly USB 3.1 Gen 1) 2 x USB 2.0 Internal Header for 3 x USB 2.0 |
| SERIAL PORT | |
| COM | 1 x DB-9 for RS-232/422/485 1 x DB-9 for RS-232 Internal Header for 4 x RS-232 |
| INTERNAL I/O | |
| GPIO | 8-Bit |
| SMBUS | Yes |
| ADDITIONAL | 1 x Chassis intrusion 1 x PS/2 1 x Audio Header |
| STORAGE | |
| SATA | 4 x SATA III |
| EXPANSION | |
| M.2 | 1 x M-key 2280 (PCIe Gen.3 x4 interface) support NVMe 1 x E-Key 2230 (USB 2.0/PCIe 3.0 x1) Support CNVi 1 x B-key 3042 (PCIe Gen.3 x1 interface) support 4G Module |
| PCIe | 1 x PCIe x16 (Gen.4) |
| SIM | 1 x SIM Card Slot |
| ENVIRONMENT & CERTIFICATION | |
| SHOCK | 15G, 11ms duration |
| VIBRATION | 1 Grms/ 5~ 500Hz/ Operation |
| OPERATING TEMPERATURE | 0°C ~ 60°C (32°F ~ 140°F) |
| STORAGE TEMPERATURE | -20°C ~ 85°C (-4°F ~ 185°F) |
| OPERATING HUMIDITY | 10 ~ 90% relative humidity, non-condensing |
| CERTIFICATION | CE/FCC Class A LVD |
| ESG DECLARATION | EU RoHS China RoHS REACH |
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| PART NUMBER | DESCRIPTION | QTY |
| MI225H6100 Series | MI225H6100 Series M/B | 1 |
| F04-MB-073-1F | MI225 I/O Shield | 1 |
| G01-SATA3-BL-1F | SATA Cable | 1 |
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| PART NUMBER | MI225H6100-A1 | MI225H6102-A1 |
| CPU | Intel® Socket LGA1700 CPU | Intel® Socket LGA1700 CPU |
| SECURITY | TPM2.0 (dTPM) | |
| POWER REQUIREMENT | ATX Power Supply | ATX Power Supply |
| GPU | Intel® UHD Graphics | Intel® UHD Graphics |
| LVDS | 1 x LVDS/eDP | 1 x LVDS/eDP |
| DP | 1 x DP | 1 x DP |
| HDMI | 1 x HDMI® | 1 x HDMI® |
| VGA | 1 x VGA | 1 x VGA |
| MULTIPLE DISPLAY | Support 3 Displays | Support 3 Displays |
| ETHERNET | 1 x GbE | 1 x GbE |
| ETHERNET | 1 x 2.5GbE | 1 x 2.5GbE |
| USB | 2 x USB 3.2 Gen.2 | 2 x USB 3.2 Gen.2 |
| USB | 2 x USB 3.2 | 2 x USB 3.2 |
| USB | 5 x USB 2.0 | 5 x USB 2.0 |
| COM | 5 x RS-232 | 5 x RS-232 |
| COM | 1 x RS-232/422/485 | 1 x RS-232/422/485 |
| SATA | 4 x SATA III | 4 x SATA III |
| M.2 | 1 x M-Key 2280 | 1 x M-Key 2280 |
| M.2 | 1 x E-key 2230 | 1 x E-key 2230 |
| M.2 | 1 x B-Key 3042 | 1 x B-Key 3042 |
| PCIE | 1 x PCIE x16 | 1 x PCIE x16 |
| SIM | 1 x SIM Card Slot | 1 x SIM Card Slot |
| OPERATING TEMPERATURE | 0°C ~ 60°C (32°F ~ 140°F) | 0°C ~ 60°C (32°F ~ 140°F) |
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注意：所有規格如有更改，恕不另行通知。