SoC-1135G7

SoC-1135G7

LE30 Series

Intel® 11th Gen. Tiger Lake-UP3 SoC Processors, M.2 PCIe 4.0 x4 support NVMe, 4* USB3.2, 2* 2.5GbE Features 1. Intel® Tiger Lake-UP3 SoC Processor (TDP 12~28W) 2. 1* DDR4-3200MHz SO-DIMM up to 32GB 3. 2* Intel i225-V 2.5GbE 4. 1* VGA,1* HDMI2.0b, 1* eDP, 1* 24-bits LVDS 5. 2* RS232, 2* RS232/422/485, 2* USB3.2 (Gen2), 2* USB3.2 (Gen1), 2* USB2.0 6. 1* M.2 M-key (2242/2280, 1* M.2 E-key(2230), 1* M.2 B-key (3042/3052), 1* SATAIII (6Gb/s) 7. 2* Mixture Header (2* UART, 3* USB2.0, 1* LPC, 1* GPIO(8bit), 1* PCI-Ex1) 8. Onboard TPM 2.0 (option) 9. 12~24V DC-in  Certification

SoC-1135G7

HPC170C-DCP1135G7

Aluminum Die-Cast Panel PC series, 17.0" TFT Fanless Touch Panel Computer with Intel® Tiger Lake i5-1135G7 2.4GHz Quad Cores Processor Features 1. 17.0" 350 nits TFT LCD with LED backlight 2. 10 points Multi Capacitive Touch 3. Support Open frameless design 4. A true Flat, easy to clean front surface with edge to edge design 5. Front IP65 for protection against water and dust 6. Aluminum Die-Cast Panel PC series, support for easy HDD and DARM installation 7. Support Cable less design 8. 12 36V DC input Support, with Electrical Over Stress(EOS), OVP design 9. VESA Support 100x100mm  Certification

SoC-1135G7

HPC270C-DCP1135G7

Aluminum Die-Cast Panel PC series, 27.0" TFT Fanless Touch Panel Computer with Intel® Tiger Lake i5-1135G7 2.4GHz Quad Cores Processor Features 1. 27.0" 300 nits TFT LCD with LED backlight 2. LG in-cell 10-points Multi Capacitive Touch 3. A true Flat and Slim Design, Clear Image, support Cover-Glass Elimination 4. Front IP65 for protection against water and dust 5. Support for easy HDD and DARM installation 6. Aluminum Die-Cast Panel PC series, support Cable less design 7. 12-36V DC-input Support, with Electrical Over Stress(EOS), OVP design 8. VESA Support 100x100mm Certification  Certification

SoC-1135G7

HPC150C-DCP1135G7

Aluminum Die-Cast Panel PC series, 15.0" TFT Fanless Touch Panel Computer with Intel® Tiger Lake i5-1135G7 2.4GHz Quad Cores Processor Features 1. 15.0”350 nits TFT LCD with LED backlight 2. 10-points Multi Capacitive Touch 3. Support Open frameless design 4. A true Flat, easy-to-clean front surface with edge-to-edge design 5. Front IP65 for protection against water and dust 6. Aluminum Die-Cast Panel PC series, support for easy HDD and DARM installation 7. Support Cable less design 8. 12-36V DC-input Support, with Electrical Over Stress(EOS), OVP design 9. VESA Support 100*100mm  Certification

SoC-1135G7

JLZ0FV-90 Series

Intel® Gen. 11 Tiger Lake-UP3 SoC Processor, 1135G7 chipset, M.2 PCIe 4.0 x4 supports NVMe, 4* COM, 2* USB3.2 (Gen2), 1* GbE, 1* 2.5GbE Features 1. Intel® Tiger Lake-UP3 SoC Processor (TDP 12~28W) 2. 2* DDR4 3200MHz SO-DIMM up to 64GB 3. 1* Intel i219-LM GbE, 1* Intel i225-V 2.5GbE 4. 1* HDMI2.0, 1* eDP, 1* LVDS 5. 2* RS232, 2* RS232/422/485, 2* USB3.2 (2代), 5* USB2.0 6. 1* SATAIII, 1* SIM card slot 7. 1* M.2 M-key (2242/2280), PCIe 4.0 x4 interface supports NVMe 8. 1* M.2 E-key (2230), USB2.0/PCIe x1 interface supports CNVi 9. 1* M.2 B-key (3042/3052/6570), USB3.2/USB2.0 /PCIe x1 interface supports 4/5G Module 10. 1* Mixture Header (2* UART, 2* USB2.0, 1* LPC, 1* GPIO) 11. Onboard TPM 2.0 (JLZ0FV-92 option) 12. 12~36V DC-in  Certification

SoC-1135G7

HPC215C-DCP1135G7

Aluminum Die-Cast Panel PC series, 21.5" TFT Fanless Touch Panel Computer with Intel® Tiger Lake i5-1135G7 2.4GHz Quad Cores Processor Features 1. 21.5” 250 nits TFT LCD with LED backlight 2. 10-points Multi Capacitive Touch 3. Support Open frameless design 4. Aluminum Die-Cast Panel PC series, Easy HDD and DARM installation, cableless design 5.12-36V DC-in, with Electrical Over Stress (EOS) and OVP design 6. Front bezel meets IP65-rated protection 7. VESA Support 100x100mm  Certification

SoC-1135G7

HPC156C-DCP1135G7

Aluminum Die-Cast Panel PC series, 15.6" TFT Fanless Touch Panel Computer with Intel® Tiger Lake i5-1135G7 2.4GHz Quad Cores Processor Features 1. 15.6” 250 nits TFT LCD with LED backlight 2. 10-points Multi Capacitive Touch 3. Support Open frameless design 4. A true Flat, easy to clean front surface with edge to edge design 5. Front IP65 for protection against water and dust 6. Aluminum Die-Cast Panel PC series, support for easy HDD and DRAM installation 7. Support Cable less design 8. 12~36 V DC input Support, with E l ectrical Over Stress (EOS), OVP design 9. VESA Support 100x100mm  Certification

SoC-1135G7

N11 Series

Intel® Tiger Lake-UP3 Processor, support DDR4 3200MHz up to 64GB Features 1. Intel® 11th Gen. Tiger Lake-UP3 SoC Processor 2. 2* DDR4 3200MHz SO-DIMM up to 64GB 3. Rich and complete connection interface, supports 4 sets of 4K HDR or 1* 8K output 4. 3* internal M.2 expansion slots for various applications  Certification

SoC-1135G7

HPC150R-DCP1135G7

15.0" TFT Fanless Touch Panel Computer with Intel® Tiger Lake i5-1135G7 2.4GHz Quad Cores Processor Features 1. 15.0” 350 nits TFT LCD with LED backlight 2. 5 Wire Resistive Touch/Anti-Reflection Protection Glass 3. Support Open frameless design 4. Easy HDD and DARM installation, cableless design 5.12-36V DC-in, with Electrical Over Stress (EOS) and OVP design 6. Front bezel meets IP65-rated protection  Certification

SoC-1135G7

JLZ0F-90 Series

New Model: JLZ0FV-90 Series Intel® Gen. 11 Tiger Lake-UP3 SoC Processor, 1135G7 chipset, M.2 PCIe 4.0 x4 supports NVMe, 4* COM, 2* USB3.2 (Gen1), 2* GbE Features 1. Intel® Tiger Lake-UP3 SoC Processor (TDP 12~28W) 2. 2* DDR4 3200MHz SO-DIMM up to 64GB 3. 1* Intel i219-LM GbE, 1* Intel i211AT GbE 4. 1* HDMI2.0, 1* eDP, 1* LVDS 5. 2* RS232, 2* RS232/422/485, 2* USB3.2 (Gen1), 5* USB2.0 6. 1* SATAIII, 1* SIM card slot 7. 1* M.2 M-key (2242/2280), PCIe 4.0 x4 interface supports NVMe 8. 1* M.2 E-key (2230), USB2.0/PCIe x1 interface supporst CNVi 9. 1* M.2 B-key (3042/3052/6570), USB3.2/USB2.0 /PCIe x1 interface supports 4/5G Module 10. 1* Mixture Header (2* UART, 2* USB2.0, 1* LPC, 1* GPIO) 11. Onboard TPM 2.0 (JLZ0F-92 option) 12. 12~36V DC-in  New Model: JLZ0FV-90 Series  Certification