SoC-1145G7E
Intel® Tiger Lake Processor, 12~24V DC in, 2*DDR4 DRAM, expandable system with cableless and fanless design Features With the development of IOT, industrial automation needs faster and more stable equipment, so Intel Tiger Lake processor is used as the core. In response to different installation occasions and different interface requirements, by choosing different expansion cards, the needs of most users can be met.
SoC-1145G7E
11th Gen. Intel® Tiger Lake-UP3 SoC Processors, support up to 4* independent 4K HDR Displays or 1* 8K SDR Displays, M.2 PCIE 4.0 x4 supports NVME, 4* COM, 4* USB3.2(Gen2), 1* 2.5GbE, 1* GbE Features 1. Intel® Tiger Lake-UP3 SoC Processor (TDP 12~28W) 2. 2* DDR4-3200MHz SO-DIMM up to 64GB 3. 1* Intel® i219-LM 1.0GbE, 1* Intel i225-V 2.5GbE 4. 2* HDMI, 2* DisplayPort, 1* eDP, 1* LVDS 5. 4* COM (COM1/COM2 support RS232/422/485), 4* USB3.2 (Gen.2), 4* USB2.0 6. 1* M.2 M-key 2242/2280, PCIe 4.0 x4 interface support NVME 7. 1* M.2 E-key 2230, USB2.0/PCIe x1 interface support CNVi 8. 1* SATAIII (6Gb/s) 9. MF05V22 / MF05V92 : Onboard TPM 2.0 (option)
SoC-1145G7E
Intel® Tiger Lake-UP3 Processor, Support DDR4 3200MHz up to 64GB Features 1. Intel® Tiger Lake-UP3 SoC Processor (TDP 15W) 2. 2* DDR4 3200MHz SO-DIMM up to 64GB 3. 1* Intel i219-LM GbE, 1* Intel i225-V 2.5GbE 4. 1* M.2 M-key 2242/2280 support NVMe, 1* M.2 E-key 2230 Support CNVi, 1* M.2 B-key 3042/3052 5. 2* HDMI, 2* DP1.4 (from USB3.2 (Gen.2) Type-C) 6. Support Fanless cooling design 7. TPM 2.0 (option)
SoC-1145G7E
11th Gen. Intel® Tiger Lake-UP3 SoC Processors, support up to 4* independent 4K HDR or 1* 8K Displays, M.2 PCIe 4.0 x4 supports NVMe, 1* RS232, 2* USB3.2 (Gen. 2) Type-A, 1* USB3.2 (Gen. 2) Type-C, 2* USB3.2 (Gen. 2) Type-C support DP1.4 display, 1* 2.5GbE, 1* GbE Features 1. Intel® Tiger Lake-UP3 SoC Processor (TDP 15W) 2. 2* DDR4 3200MHz SO-DIMM up to 64GB 3. 1* Intel i219-LM 1.0GbE, 1* Intel i225V 2.5GbE 4. 2* HDMI, 2* DP1.4 (from USB3.2 (Gen.2) Type-C) 5. 1* RS232, 2* USB3.2 (Gen.2) Type-A, 1* USB3.2 (Gen.2) Type-C supports USB only, 2* USB3.2 (Gen. 2) Type-C support DP1.4 display 6. 1* M.2 M-key 2242/2280 (PCIe4.0 x4/SATAIII interface) support NVMe, 1* SATAIII 7. 1* M.2 E-key 2230 (USB2.0/PCIe x1 interface) support CNVi 8. 1* M.2 B-key 3042/3052 (USB3.1/USB2.0/PCIe 4.0x1 interface)
SoC-1145G7E
11th Gen. Intel® Tiger Lake-UP3 SoC Processors, support up to 4* independent 4K HDR Displays, M.2 PCIe 4.0 x4 supports NVMe, 1* COM, 3* USB3.2 (Gen2), 2* USB Type-C, 1* 2.5GbE, 1* GbE Features 1. Intel® Tiger Lake-UP3 SoC Processor (TDP 12~28W) 2. 2* DDR4-3200MHz SO-DIMM up to 64GB 3. 1* Intel i219-LM 1.0GbE, 1* Intel i225V 2.5GbE 4. 2* HDMI, 2* DP1.4 (from Type-C), 1* eDP 5. 1* RS232, 3* USB3.2 (Gen.2), 5* USB2.0, 2* USB 3.2 (Gen. 2) Type-C support DP1.4 display output 6. 1* M.2 M-key 2242/2280, PCIe 4.0 x4/SATA interface support NVMe, 1* SATAIII (6Gb/s) 7. 1* M.2 E-key 2230, USB2.0/PCIe x1 interface support CNVi, 1* M.2 B-Key 3042/3052, USB3.1/USB2.0/PCIe x1 interface 8. MF10-22 / MF10-92: Onboard TPM 2.0 (option)
EOL
New Model: MF05V Series 11th Gen. Intel® Tiger Lake-UP3 SoC Processors, support up to 4* independent 4K HDR Displays or 1* 8K SDR Displays, M.2 PCIE 4.0 x4 supports NVME, 4* COM, 4* USB3.2(Gen2), 1* 2.5GbE, 1* GbE Features 1. Intel® Tiger Lake-UP3 SoC Processor (TDP 12~28W) 2. 2* DDR4-3200MHz SO-DIMM up to 64GB 3. 1* Intel® i219-LM 1.0GbE, 1* Intel® i225-LM 2.5GbE 4. 2* HDMI, 2* DisplayPort, 1* eDP, 1* LVDS 5. 4* COM (COM1/COM2 support RS232/422/485), 4* USB3.2 (Gen.2), 4* USB2.0 6. 1* M.2 M-key 2242/2280, PCIe 4.0 x4 interface support NVME 7. 1* M.2 E-key 2230, USB2.0/PCIe x1 interface support CNVi 8. MF05-22: Onboard TPM 2.0 (option) New Model: MF05V Series