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| SYSTEM | |
| MB FORM FACTOR | Mini-ITX |
| CPU | Intel® LGA1700 12/13/14th Gen Socket Processor (Formerly Alder Lake-S, TDP 65W) |
| CHIPSET | Intel® Q670E |
| MEMORY | 2 x DDR5 4800MHz, Dual Channel SO-DIMM, up to 96GB Actual memory support depends on the specific CPU and model |
| BIOS | AMI Flash ROM |
| WATCHDOG TIMER | 255 Levels |
| SECURITY | TPM2.0 (Optional) |
| DIMENSION (W X D) | 170.0 (W) x 170.0 (D) mm (6.7″ x 6.7″) |
| OS SUPPORT | Windows® 11 (64bit) Windows® 10 (64bit) Linux |
| POWER | |
| POWER REQUIREMENT | DC-in 12~36V |
| POWER ON MODE | AT / ATX |
| CONNECTOR | DC Jack |
| DISPLAY | |
| GPU | Intel® HD Graphics |
| LVDS | 1 x LVDS (Max. Resolution: 1920 x 1200 @60Hz, Co-lay eDP) |
| DP | 2 x DP1.4a (Max Resolution: 4096 x 2304@60Hz) |
| HDMI | 2 x HDMI 2.0b (Max Resolution: 4096 x 2160@60Hz) |
| MULTIPLE DISPLAY | Support 4 Displays |
| AUDIO | |
| CODEC | Realtek Audio Codec |
| COMBO | 1 x Combo Audio Jack for Line-Out / Mic-In |
| AMPLIFIER | 3W |
| LAN | |
| ETHERNET | 1 x RJ45 for Intel® I226-V 2.5GbE 1 x RJ45 for Intel® I226-LM 2.5GbE |
| USB PORT | |
| USB | 4 x USB 3.2 Gen 2x1 (10Gbps, Formerly USB 3.1 Gen 2) Internal Header for 2 x USB 3.2 Internal Header for 4 x USB 2.0 |
| SERIAL PORT | |
| COM | Internal Header for 2 x RS-232/422/485 Internal Header for 4 x RS-232 |
| INTERNAL I/O | |
| GPIO | 8-Bit |
| SMBUS | Yes |
| ADDITIONAL | 1 x LVDS (co-layout eDP) 1 x Chassis Intrusion 1 x Audio Header 1 x AT Mode Selection |
| STORAGE | |
| SATA | 2 x SATA III 1 x SATA Power Connector |
| RAID | RAID 0/1 |
| EXPANSION | |
| M.2 | 1 x M-Key 2242 (PCIe Gen.4 x4/SATA interface) support NVMe 1 x M-Key 2280 (PCIe Gen.3 x4/SATA interface) support NVMe 1 x E-Key 2230 (USB 2.0/PCIe x1) Support CNVio for Wi-Fi 1 x B-Key 3042/3052 (USB3.1/USB2.0/PCIe x1) for 4G/5G module |
| PCIe | 1 x PCIe x16 (Gen.4) |
| SIM | 1 x SIM Card Slot |
| ENVIRONMENT & CERTIFICATION | |
| SHOCK | 15G, 11ms duration |
| VIBRATION | 1 Grms/ 5~ 500Hz/ Operation |
| OPERATING TEMPERATURE | 0°C ~ 60°C (32°F ~ 140°F) |
| STORAGE TEMPERATURE | -20°C ~ 85°C (-4°F ~ 185°F) |
| OPERATING HUMIDITY | 10 ~ 90% Relative Humidity, Non-condensing |
| CERTIFICATION | CE/FCC Class A LVD |
| ESG DECLARATION | EU RoHS China RoHS REACH |
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| PART NUMBER | DESCRIPTION | QTY |
| MI215Q6700 Series | MI215Q6700 Series M/B | 1 |
| F04-MB-098-F | I/O Shield | 1 |
| G01-COM-H2M22-1F | COM Cable | 2 |
| G01-SATA3-BL-1F | SATA III Cable | 1 |
| G01-PW4PS-2S-323F | SATA Power Cable | 1 |
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| PART NUMBER | MI215Q6700-A1 | MI215Q6702-A1 |
| CPU | Intel® Socket LGA1700 CPU | Intel® Socket LGA1700 CPU |
| SECURITY | TPM2.0 | |
| POWER REQUIREMENT | DC-in 12~36V | DC-in 12~36V |
| GPU | Intel® HD Graphics | Intel® HD Graphics |
| LVDS | 1 x LVDS/eDP | 1 x LVDS/eDP |
| DP | 2 x DP | 2 x DP |
| HDMI | 2 x HDMI | 2 x HDMI |
| MULTIPLE DISPLAY | Support 4 Displays | Support 4 Displays |
| ETHERNET | 2 x 2.5GbE | 2 x 2.5GbE |
| USB | 4 x USB 3.2 Gen 2 | 4 x USB 3.2 Gen 2 |
| USB | 2 x USB 3.2 Gen 1 | 2 x USB 3.2 Gen 1 |
| USB | 4 x USB 2.0 | 4 x USB 2.0 |
| COM | 4 x RS-232 | 4 x RS-232 |
| COM | 2 x RS-232/422/485 | 2 x RS-232/422/485 |
| SATA | 2 x SATA III | 2 x SATA III |
| M.2 | 1 x M-Key 2242 | 1 x M-Key 2242 |
| M.2 | 1 x M-Key 2280 | 1 x M-Key 2280 |
| M.2 | 1 x E-Key 2230 | 1 x E-Key 2230 |
| M.2 | 1 x B-Key 3042/3052 | 1 x B-Key 3042/3052 |
| PCIE | 1 x PCIE x16 | 1 x PCIE x16 |
| SIM | 1 x SIM Card Slot | 1 x SIM Card Slot |
| OPERATING TEMPERATURE | 0°C ~ 60°C (32°F ~ 140°F) | 0°C ~ 60°C (32°F ~ 140°F) |
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注意：所有規格如有更改，恕不另行通知。