HBFDF04V

嵌入式系統，板載Intel® Celeron® 處理器 J6412（原 Elkhart Lake，TDP 10W），支援 12~24V 寬電壓輸入

特點

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SYSTEM
MB FORM FACTOR	3.5"
CPU	Onboard Intel® Celeron® Processor J6412 (Formerly Elkhart Lake, TDP 10W)
CHIPSET	Intel® SoC
MEMORY	2 x DDR4 3200MHz, Dual Channel SO-DIMM, up to 32GB
BIOS	AMI Flash ROM
SECURITY	TPM2.0 (Optional)
OS SUPPORT	Windows® 11 (64bit) Windows® 10 (64bit) Linux
POWER
POWER REQUIREMENT	DC-in 12~24V 60W Adapter: AC90~240V, DC12V/5.0A
DISPLAY
GPU	Intel® HD Graphics, shared memory
HDMI®	2 x HDMI (Max Resolution: 4096 x 2160@60Hz)
LAN
ETHERNET	2 x RJ45 for Intel® I226-V 2.5GbE
SYSTEM I/O
REAR PANEL I/O	3 x USB 3.2 Gen 2 3 x USB 2.0 2 x HDMI 2 x RJ45 1 x Audio ( Line out, MIC Combo) 1 x DC Jack
FRONT PANEL I/O	2 x USB 2.0 2 x COM 1 x Power Switch 1 x Reset Button 1 x Power LED 1 x HDD LED 1 x MIC-in 1 x Line-out
STORAGE
SATA	1 x 2.5” SATA Device (support 2.5” HDD with a height ≤ 10mm)
eMMC	eMMC 64GB (optional)
EXPANSION
M.2	1 x M-Key 2242/2280 (SATA/PCIe 3.0 x2) Support NVMe 1 x E-Key 2230 (USB 2.0/PCIe 3.0 x1) 1 x B-key 3042 (USB2.0/USB3.1)
SIM	1 x SIM Card Slot
MECHANICAL
MOUNTING	Wall Mount, DIN Rail Clip
DIMENSIONS (W x D x H)	193.0 (W) x 142.4 (D) x 62.0 (H) mm (7.6" x 5.6" x 2.44")
CONSTRUCTION	Aluminum Front Bezel + Metal Chassis
ENVIRONMENT & CERTIFICATION
SHOCK	15G, 11ms duration
VIBRATION	1 Grms/ 5~ 500Hz/ Operation
OPERATING TEMPERATURE	0°C ~ 50°C (32°F ~ 122°F)
STORAGE TEMPERATURE	-40°C ~ 85°C (-40°F ~ 185°F)
OPERATING HUMIDITY	10 ~ 95% @ 40°C, Non-condensing
CERTIFICATION	CE/FCC Class A LVD
ESG DECLARATION	EU RoHS China RoHS ErP

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PART NUMBER	DESCRIPTION	QTY
HBFDF04V	HBFDF04V Series Barebone	1
L01AS053-F	Adapter 12V-60W	1
Change according to shipping area	Power Cord	1
LCSCHBFDXXX-F	Screw Pack	1
HCS3XXDINRAILPS-F	DIN RAIL Kits	1
HCSFDMWM01B-F	WALL MOUNT	1
J05-ANT-GX57245-F	Antenna 2G4/5G (Wifi only)	1
HNSCOMWFCB375NF-F	M.2 ac WiFi card(WIFI only)	1

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