Others
AiSEMI multi - AI Thermal Imaging Multi-person Temperature Screening System
Features
1. AI Face Recognition and Tracking Technology
2. Infrared Thermal Imaging Technology
3. Support Advertisement Mode
4. Synchronous Temperature Screening for 8~10 People
5. Wide-ranging non-contact Temperature Screening
6. Abnormal Warning Function
7. HBJC921R3288-2H System is required
Access Control System
AiSEMI ONE LITE - Smart Temperature Screening and Digital Signage System
Features
1. World Premiere Smart Temperature Screening and Digital Signage System with VOx (Vanadium Oxide) Sensor Element
2. Temperature Screening at 1.5m in 0.6 second
3. Support High Temperature Warning
4. 10.1″ Display and Digital Signage System
5. Support Advertisement Mode
Access Control System
AiSEMI one vox - Smart Attendance and Temperature Screening System
Features
1. World Premiere Smart Attendance System and Temperature Screening System with VOx (Vanadium Oxide) Sensor Element
2. Fast Response, High Accuracy and Good Temperature Stability
3. On-Premise Network to Secure Personal Data
4. Efficient Attendance System
5. Face Recognition Access Control System
6. Support Multi-door (6 doors) Access Control Management
7. 10.1" Welcome Board and Signage
8. 10,000 Face Database and 100,000 Measurement Data Capacity
9. Support Multi-Factor Authentication
9 Support Multi-Factor Authentication
AMD Processor
AMD™ RYZEN™ Embedded V-Series V1605B CPU, DDR4 up to 32GB
Features
1. AMD™ RYZEN™ V1605B 2.0GHz/QC Core Processor
2. 2* DDR4 2400MHz up to 32GB
3. 2* Realtek® RTL8111H GbE
4. 2* SATA III (6Gb/s), 1* M.2 M key (PCIe x2)
5. 4* DP(DP0 Co-lay eDP, DP1 Co-lay LVDS)
6. 2* RS232/422/485, 4* RS232, 2* USB3.2 (Gen1), 8* USB2.0
7. 1* M.2 E key, 1* M.2 B key support 4G/5G Module
8. 12~28V DC-in
9. MINI ITX Form Factor (170 *170 mm)
10. JLI1U-22 support TPM2.0 (option)
SoC-N6210
New Model: JPIC-ADN1
PICO-ITX size Motherboard with Intel® Elkhart Lake Processor, support DDR4 up to 32GB, 1* M.2 (M-key), 1* M.2 (E-key), support dual display (1* HDMI and 1*eDP)
Features
1. Intel® Elkhart Lake SoC Processor
2. 1* DDR4 3200MHz SO-DIMM up to 32GB
3. 1* HDMI, 1* eDP
4. 1* COM, 2* USB3.1 (Gen.2) Type-A, 2* USB2.0, 1* USB3.1 (Gen.2) Type-C
5. 1* M.2 M-key 2242 (SATA/PCIe Gen.3 x2 interface) support NVME, 1* M.2 E-key 2230 (USB2.0/PCIe Gen.3 x1 interface)
6. Onboard 64GB eMMC option (MP01-62104)
7. 12V DC-in
New Model: JPIC-ADN1
Intel® Mobile SoC Processor
5.5" Motherboard with Intel® Gen 11 SoC Processor, Triple Display Support, and 12-36V Wide Range DC Input Features
- Powered by Intel® Core i5-1135G7 SoC Processor (Tiger Lake)
- Enhanced Memory Capacity: 2 x DDR4 3200MHz SO-DIMM up to 64GB
- Dual High-Speed Networking: 1 x Intel® i219-LM GbE and 1 x Intel® i225-V 2.5GbE
- Triple Display Support: HDMI 2.0, eDP, and LVDS for versatile display options
- Comprehensive I/O Ports: 2 RS232, 2 RS232/422/485, 2 USB3.2 Gen2, 5 USB2.0, and 1 Mixture Header
- Storage & Expansion: 1 x SATA III, 1 x M.2 M-Key, 1 x M.2 E-Key, 1 x M.2 B-Key
- Wide Power Input: 12~36V DC-in for industrial-grade applications
Intel® Mobile SoC Processor
5.5" Motherboard with Intel® Gen 11 SoC Processor, Triple Display Support, and 12-36V Wide Range DC Input Features
- Powered by Intel® 6305E SoC Processor (Tiger Lake, TDP 15W)
- Enhanced Memory Capacity: 2 x DDR4 3200MHz SO-DIMM up to 64GB
- Dual High-Speed Networking: 1 x Intel® i219-LM GbE and 1 x Intel® i225-V 2.5GbE
- Triple Display Support: HDMI 2.0, eDP, and LVDS for versatile display options
- Comprehensive I/O Ports: 2 RS232, 2 RS232/422/485, 2 USB3.2 Gen2, 5 USB2.0, and 1 Mixture Header
- Storage & Expansion: 1 x SATA III, 1 x M.2 M-Key, 1 x M.2 E-Key, 1 x M.2 B-Key
- Wide Power Input: 12~36V DC-in for industrial-grade applications
Intel® Mobile SoC Processor
Intel® Whiskey Lake-U CPU, DDR4 up to 64GB, 1* GbE, 1* 2.5GbE, support Wide Voltage 12~36V DC-in
Features
1. Intel® 8th Gen Whiskey Lake-U 1.6GHz/QC Core MCP Processor
2. 2* DDR4 2400MHz, up to 64GB
3. 1* Intel®I219LM GbE, 1* Intel® i225-V 2.5GbE
4. 1* SATA III (6Gb/s), 1* M.2 (M-key), 1* M.2 E-key Support CNVi, 1* M.2 B-key Support 4G/5G Module
5. 1* HDMI/DP + 1* eDP
6. 2* RS232/422/485, 2* USB3.0, 3* USB2.0
7. 12~36V DC in
8. 3.5” Form Factor (146 *102 mm)
9. JLF0DV-42 support TPM2.0 (option)
Intel® Mobile SoC Processor
Intel® Comet Lake-U Celeron 5205U CPU, DDR4 up to 64GB, 1* GbE, 1* 2.5GbE, support Wide Voltage 12~36V DC-in
Features
1. Intel® 10th Gen Comet Lake Celeron 5205U 1.9GHz/DC Core MCP Processor
2. 2* DDR4 2400MHz, up to 64GB
3. 1* Intel®I219LM GbE, 1* Intel® i225-V 2.5GbE
4. 1* SATA III (6Gb/s), 1* M.2 (M-key), 1* M.2 E-key Support CNVi, 1* M.2 B-key Support 4G/5G Module
5. 1* HDMI/DP + 1* eDP
6. 2* RS232/422/485, 2* USB3.0, 3* USB2.0
7. 12~36V DC in
8. 3.5” Form Factor (146 *102 mm)
9. JLF0DV-E2 support TPM2.0 (option)
Intel® Desktop Socket Processor
Intel® LGA1151 CPU, DDR4 2400/2666MHz up to 64GB
Features
1. Fanless Black Aluminum Enclosure
2. Support Intel LGA1151 Coffee Lake Processors
3. Supports DDR4 2400/2666MHz SODIMM up to 64GB
4. Supports up to 3 Displays, 1* HDMI, 2* DP
5. 1* 2.5” SATAIII 6Gb/s Internal Drive bay
6. 1* M.2(M-key, 2242/2260/2280, Support NVMe) slot for SSD
7. Support onboard TPM 2.0
Intel Atom® Processor
Compact Fanless Embedded System with Intel® Processor J3455 Features
- Powered by Intel® Celeron® Processor J3455 (Apollo Lake, TDP 10W)
- Dual Display Support: 2 HDMI outputs for flexible 4K connectivity
- Comprehensive I/O: 4 USB 3.0, 2 COM, 2 RJ45, and 1 audio combo for MIC and Line Out
- Two Expansion I/O Doors: Supports flexible daughter card integration
- Flexible Daughter Card: Options for 8 LAN, 8 COM, 4 USB 3.0, or 32-bit GPIO ports
- Versatile Mounting Options: Wall mount and DIN rail clip for easy installation
ARM-based System
Rockchip® RK3399 ARM SoC, 1* HDMI®, 2* USB3.0, 6* USB2.0, 1* RJ45
Features
1. Rockchip® ARM Cortex A72 (Dual core) + Cortex A53 (Quad core) RK3399 SoC Processor
2. Onboard 2GB 1333MHz DDR3L DRAM
3. Onboard 16GB EMMC
4. 1* HDMI®, 2* USB3.0, 6* USB2.0, 1* GbE, 1* Audio Jack, 1* DC Jack, 1* Power Button
5. M/B Form Factor: 3.5” SBC (148x102mm)
6. 1* 12V DC in
7. Support Android 7.1, Debian9.0
ARM-based System
Embedded ARM System with Rockchip® RK3399 SoC Processor Features
- Powered by Rockchip® ARM Cortex A72 + A53 RK3399 Processor
- Onboard 2GB DDR3L 1333MT/s Memory and 16GB eMMC Storage (up to 64GB)
- Rich I/O Interface: 2 x USB 3.0, 6 x USB 2.0, 2 x RS232
- Expandable with Micro SD Slot and SIM Card Socket
SoC-1135G7
21.5" fanless touch panel PC powered by Intel® Core™ i5-1135G7 processor, supports wide voltage DC-in 12~36V Features
- 21.5" 250 nits TFT LCD with LED backlight, 10-point multi-touch capacitive display
- Supports Open Frameless design
- Powered by Intel® Core™ i5-1135G7 (11th Gen Tiger Lake-U, 15W TDP)
- Supports an additional display via 1 x HDMI® port
- 12-36V DC Input with Electrical Overstress (EOS) and OVP Protection
- VESA Mount Support (100x100 mm)
Intel Atom® Processor
Intel® Elkhart Lake SoC processor, DDR4 up to 32GB, 2* HDMI, 12~24V DC-in
Features
1. Intel® Elkhart Lake SoC Processor (Default: J6412)
2. Support 1* DDR4 3200MHz SO-DIMM up to 32GB
3. Support 8* USB, 2* RJ45, 4* COM, 2* HDMI
4. All-aluminum body, produced by casting process
5. Support DC12~24V input
Networking Legacy
New Model: BFTADN1-N97-N or BFDADN1-N97-N
4 LAN Ports Fanless Network Appliance with Intel® Elkhart Lake SoC processor
Features
1. Intel® Elkhart Lake SoC Processor, Default: J6412
2. 1* 260-pin Dual-channel DDR4 3200MHz SODIMM Up to 32GB
3. 1* COM (RS232/422/485), 1* USB3.1 Gen.2, 3* USB2.0
4. 4* Intel® i225V 2.5GbE
5. 1* M.2 M-key, 2242/2280 (SATA/PCIe Gen.3 x2) support NVMe, 1* M.2 E-key, 2230 (USB2.0/PCIe Gen.3 x1), 1* M.2 B-key, 3042/3052 (USB3.1), 1* SIM card slot
New Model: BFTADN1-N97-N or BFDADN1-N97-N
Intel® Mobile SoC Processor
4 LAN Ports Fanless Network Appliance with Intel Skylake/Kaby Lake U-Series SoC Processor
Features
1. Intel® Skylake/Kabylake U-Series SoC Processor, Default: 3955U
2. 1* 260-pin Dual-channel DDR4 2133MHz SODIMM Up to 16 GB
3. 4* Ethernet Ports
4. 1* Full size Mini-SATA Socket (SATA + USB Signal)
5. 2* Mini PCIe Slots (1* full size, 1* half size)
6. 1* SIM card holder
7. Supports on board TPM2.0 (option)
8. 1* RS232 Console, 2* USB3.0, 2* USB2.0
SoC-3955U
New Model: HBJC150I225 or HBJC153I23
Desktop 4 /6 LAN Ports Network Appliance with Intel Skylake/Kabylake U-Series SoC Processor
Features
1. Intel® Skylake/Kabylake U-Series SoC Processor
2. 1* DDR4 2133MHz SODIMM Up to 16GB
3. 4 or 6 Ethernet Ports
4. 1* Full size Mini-SATA Socket (SATA + USB Signal)
5. 2* Mini PCIe Slots (1* full size, 1* half size)
6. Supports on board TPM2.0 (option)
7. 1* RS232 Console, 2* USB3.0
New Model: HBJC150I225 or HBJC153I23
Intel Atom® Processor
1U Rackmount with Intel® SoC Processor, Up to 10 LAN Port for networking and edge computing Features
- Powered by Intel® Celeron® J6412 Processor (Elkhart Lake) for efficient performance.
- Advanced Networking: 6 x RJ45 ports for Intel® I226-LM 2.5GbE.
- Optional Expansion: Support for 4-port PCIe LAN card or dual ByPass LAN card.
- Comprehensive I/O: Includes USB 3.1 Gen 2, USB 2.0, HDMI, RS232, 2 COM ports, and GPIO for diverse connectivity.
- Versatile Storage: M.2 M-key (2242), 2.5" SATA, plus optional 64GB eMMC for enhanced storage options.
- Expandable Design: M.2 E-key (2230) and B-key (3042) slots with SIM support for additional functionality.
- Reliable Power: 1U 250W FLEX power design ensures stable and optimal performance.
Intel Atom® Processor
Compact Fanless Embedded system with Intel® J6412 SoC processor supporting Wide temperature operation from -20°C to 60°C Features
- Powered by Intel® J6412 SoC Processor (Elkhart Lake)
- Triple Display Support: 2 x HDMI and 1 x DP for flexible and high-quality visuals
- Dual 2.5GbE Ethernet Ports: High-speed and reliable networking
- Comprehensive I/O: 2 x USB 3.2 Gen2, 2 x USB 3.2 Gen2 Type-C, and 1 x USB 2.0
- Optional Features: TPM module and onboard eMMC for customizable configurations
- Compact Fanless Design with Wall-Mount Compatibility: Optimized for Space-Saving
Intel Atom® Processor
3.5" Motherboard with Intel SoC CPU, Dual 2.5GbE LAN, M.2 B-key with SIM slot, and 9–36V DC-in Features
- Powered by Intel® SoC Processor (Apollo Lake)
- 1 x DDR3L 1866MHz SO-DIMM, up to 8GB
- Dual 2.5GbE Networking: Reliable, high-speed connectivity
- Versatile Display Options: 1 x HDMI®, 1 x eDP, 1 x LVDS for adaptable configurations
- Comprehensive I/O: 2 x COM, 3 x USB 3.1 Gen 1, 3 x USB 2.0
- Flexible Storage & Expansion: 1 x M.2 M-key 2242, 1 x SATA III, 1 x M.2 B-key 3042 with SIM card slot
- Additional Expansion: 1 x Full-size Mini-PCIe (USB/PCIe)
- Wide Range Power Input: DC-in 9–36V, built for demanding industrial applications
Socket-Q370
Mini-ITX Embedded Motherboard, Intel® 8th/9th Generation Core™ i7/ i5 /i3, Pentium® LGA1151 Socket Processor, 9~36V DC-in Power
Features
1. Intel® 8th/9th LGA 1151 Socket Core i7/i5/i3/ Pentium/Celeron Processor (Max. 65W TDP)
2. 2* DDR4 2400/2666MHz SO-DIMM up to 64GB
3. 1* GbE, 1* 2.5GbE
4. 1* HDMI (option with DP), 2* DP, 1* eDP
5. 2* COM (RS232/422/485), 6* USB3.1 (Gen.2), 4 * USB2.0
6. 1* PCIe x4 slot, 1* M.2 (M-Key 2242/2260/ 2280, support NVMe), 1* M.2 (E-key 2230)
7. 2* SATA III (6Gb/s) support RAID 0, 1
8. Support onboard TPM 2.0 (optional)
9. 9~36V DC-in Power Solution
Socket-C246
Mini-ITX Embedded Motherboard, Intel® 8th/9th Generation Core™ i7/ i5 /i3, Pentium® LGA1151 Socket Processor, 9~36V DC-in Power
Features
1. Intel® 8th/9th LGA 1151 Socket Core i7/i5/i3/ Pentium/Celeron Processor (Max. 95W TDP)
2. 2* DDR4 2400/2666MHz SO-DIMM up to 64GB support ECC
3. 1* GbE, 1* 2.5GbE
4. 1* HDMI (option with DP), 2* DP, 1* eDP
5. 2* COM (RS232/422/485), 6 * USB3.1 Gen.2, 4 * USB2.0
6. 1* PCIe x4 slot, 1* M.2 (M-Key 2242/2260/ 2280, support NVMe), 1* M.2 (E-key 2230)
7. 2* SATA III (6Gb/s) support RAID 0, 1
8. Support onboard TPM 2.0 (optional)
9. 9~36V DC-in Power Solution
Intel Atom® Processor
Compact Fanless System with Intel® Celeron® J6412 and Quad 2.5GbE LAN Features
- Powered by Intel® J6412 SoC Processor for Efficient Performance (Elkhart Lake)
- High-Speed Networking: 4 x 2.5GbE for Robust and Reliable Connections
- Flexible Memory Support: 1 x DDR4 3200MHz SODIMM, Expandable up to 32GB
- Comprehensive I/O: 2 x USB 3.1, 1 x HDMI®, and 1 x COM (RJ45 type)
- Storage & Expansion: 1 x M.2 M-Key 2242, 1 x M.2 E-Key 2230, and 1 x M.2 B-Key 3042
- Enhanced Security: Supports optional TPM 2.0 for Emproved Data Protection
- Compact Fanless Design: Space-saving Design with Wall-mount Compatibility
Intel Atom® Processor
Mini-ITX Motherboard with Intel® Celeron® Processor J6412 and Intel® SoC Chipset Features
- Powered by Intel® Celeron® Processor J6412 (Formerly Elkhart Lake, TDP 10W)
- High-Speed Networking: 6 x 2.5GbE Ethernet ports for enhanced connectivity
- Flexible Storage Options: 1 x SATA III, 1 x M.2 M-key (SATA/PCIe Gen.3 x2) with NVMe support
- Expandability: 1 x M.2 E-key (USB 2.0/PCIe Gen.3 x1), 1 x M.2 B-key (USB 3.1/PCIe Gen.3 x1), 1 x SIM card slot
- Comprehensive I/O: 1 x USB 3.2 Gen 2, 3 x USB 2.0, 4 x COM ports
- Secure Data Protection: Supports optional TPM 2.0
- Optional 64GB onboard eMMC storage
Intel Atom® Processor
Mini-ITX Motherboard with Intel® Celeron® Processor J6412 and with Intel® SoC Chipset Features
- Powered by Intel® Celeron® Processor J6412 (Formerly Elkhart Lake, TDP 10W)
- High-Speed Networking: 6 x 2.5GbE Ethernet ports for enhanced connectivity
- Expandability: 1 x M.2 E-key (2230), 1 x M.2 B-key (3042), 1 x PCIe x1 slot, 1 x SIM card slot
- Flexible Storage Options: 1 x SATA III, 1 x M.2 M-key (2242) with NVMe support
- Comprehensive I/O: 1 x USB 3.2 Gen 2, 3 x USB 2.0, 4 x COM ports
- Secure Data Protection: Supports optional TPM 2.0
- Optional 64GB onboard eMMC storage
Intel® Mobile SoC Processor
15.6" Fanless Touch Panel PC with Intel® Core™ i5-1135G7 Processor, Supports Wide Voltage DC-in 12~36V Features
- 15.6" TFT LCD, 200-nit Brightness with LED Backlight
- 10-Point Multi-Touch Capacitive Panel
- Processor: Powered by Intel® Core™ i5-1135G7 (11th Gen Tiger Lake-U, 15W TDP)
- Design: Open Frameless Architecture, Fanless Cooling System
- I/O Ports: 1 x HDMI, 2 x RJ45 LAN, 2 x USB 3.2 Gen2, 4 x USB 2.0, 4 x COM ports
- Power Supply: 12-36V DC Input with Electrical Over Stress (EOS) and Over-Voltage Protection (OVP)
- Mounting: VESA Mount Compatibility (100x100mm)







