HBJC501I25-H610

Intel® Alder Lake-S Chip, Support LGA1700 CPU, DDR4 up to 64GB, Support 12~19V DC-in

Features
1. Intel® 12th/13th/14th LGA1700 Socket Core I3,I5,I7 Pentium Processor (Max 35W) ; Intel® Alder Lake-S H610 Chip
2. 2 x DDR4 3200MHz up to 64GB
3. 2 x Realtek® RTL8111H GbE
4. 1 x SATA III (6Gb/s), 1 x M.2 (M key 2242/2280, NVMe)
5. 1 x M.2 E key(2230, CNVi/PCI-Ex1/USB2.0)
6. 2 x RS232, 2 x RS232/422/485 (Support 5V/12V TTL), 4 x USB3.2 (Gen1), 2 x USB2.0
7. 1x HDMI, 1x DP
8. Support Fanless cooling design
9. 12~19V DC-in

　Certification

Categories: ,


Application｜Specifications｜Packing List｜Ordering Information｜IO Diagram

Application TOP∧

● IoT Solution
● Automation Industry
● Network security

Specifications TOP∧
SYSTEM

CPU

Intel® LGA1700 Socket Core I3,I5,I7 Pentium Processor (Max 35W)

CHIPSET

Intel® Alder Lake-S H610 Chip

SYSTEM MEMORY

2 x DDR4-3200MHz up to 64GB

DISPLAY INTERFACE

1 x HDMI2.0 (Max Resolution: 4096×2160@60Hz)
1 x DP1.4 (Max Resolution: 7680×4320@60Hz)

STORAGE DEVICE

1 x 2.5” SATA 6Gb/s internal drive bay(only support 2.5″ HDD with a hight ≤ 10mm)
1 x M.2 M-key (2242/2280 PCI-Ex4 Gen.3 interface, NVMe)

ETHERNET

2 x Realtek® RTL8111H GbE

Front I/O

—

Rear I/O

2 x SMA Antenna Hole
1 x Power Button, Power LED
1 x DC jack
1 x HDMI
1 x DP
2 x USB2.0
2 x RJ45
4 x USB3.2 Gen.1
1 x Line-out
1 x MIC
GND Hold
2 x RS232
2 x RS232/422/485

EXPANSION

1 x M.2 E key (2230, CNVi/PCI-Ex1/USB2.0) for WIFI/BT Module

INDICATOR

—

OS SUPPORT

Windows® 10
Windows® 11
Linux
POWER SUPPLY

POWER REQUIREMENT

MB: DC Input 12~19V
Adapter: AC100~240V / DC19V_6.32A_120W
MECHANICAL

MOUNTING

Desktop, Wallmount, Din Rail

DIMENSIONS (W x H x D)

264.0(W) x 199.4 (D) x 58.0 (H) mm (7.92” x 5.98″ x 1.74”)

GROSS WEIGHT

—

NET WEIGHT

—
ENVIRONMENT & CERTIFICATION

OPERATING TEMPERATURE

-10°C ~ 50°C (14°F ~ 123°F)
(Under the condition of using M.2 interface SSD)

STORAGE TEMPERATURE

-20°C ~ 60°C (-4°F ~ 141°F)

OPERATING HUMIDITY

10 ~ 90% @ 40°C, non-condensing

ANTI-VIBRATION

—

ANTI-SHOCK

—

CERTIFICATION

CE/FCC Class A, LVD

* Specifications subject to change without notice, not responsible for typographical errors. Does not include HDD or OS.

Packing List TOP∧

Part Number

Description

QTY per Board

—

HBJC501I25-H610

1

HCS5XXMWM01B-1F

Wallmount

2

L01AS056-1F

Adapter DC19V_120W

1

LCSCHBFDXXX-F

Screw Package

1

Change according to shipping area

Power cord

1
Ordering Information TOP∧

Part Number

HBJC501I25-H610

HBJC501I25-H6102

HBJC501I25W-H610

LAN

2

2

2

USB3.2

4

4

4

USB2.0

2

2

2

RS-232

2

2

2

RS-232/422/485

2

2

2

AUDIO

Mic-in
Line-out

Mic-in
Line-out

Mic-in
Line-out

STORAGE

1 x 2.5” SATA-III
1 x M.2 M (2242/2280)

1 x 2.5” SATA-III
1 x M.2 M (2242/2280)

1 x 2.5” SATA-III
1 x M.2 M (2242/2280)

DISPLAY

1 x HDMI2.0
1 x DP1.4

1 x HDMI2.0
1 x DP1.4

1 x HDMI2.0
1 x DP1.4

EXPANSION

1 x M.2 E (2230)

1 x M.2 E (2230)

1 x M.2 E (2230)

MOUNTING

Wallmount

Wallmount

Wallmount

POWER

12~19V

12~19V

12~19V

OPERATION TEMPERATURE

-10°C ~ 50°C (14°F ~123°F)

-10°C ~ 50°C (14°F ~123°F)

-10°C ~ 50°C (14°F ~123°F)

TPM

—

2.0

—

WiFi

—

—

Yes

eMMC

—

—

—
IO Diagram TOP∧

　Rear    

    Subject

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    Content

    HBJC501I25-H610

      Subject

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      Content

      Model

      HBJC501I25-H610
      Dimensions

      264 x 199.4 x 58mm
      Chassis Volume

      3.1L
      MB Model

      LI25-H6100L
      CPU Generation

      Alder Lake S
      CPU/Chipset

      H610
      CPU Core/Frequency

      Depend on compatible CPU
      DRAM/MAX

      2*DDR4-3200/64GB
      Front IO

      NA
      Rear IO

      1H/1DP/6U/2L/4C/1LO/1M
      Internal

      NA
      Expansion

      1M2E
      Storage

      1M2M/1*2.5 DRIVE
      MB Power

      DC12~19V