New Model: HB651I215 Fanless Embedded System featuring Intel® 13th Gen Core™ i5-1335U Processor supports DC-in 12~36V Features

• Efficient Performance: Powered by Intel® Processor i5-1335U (Raptor Lake-P) with 15W TDP.
• Quad Display Support: Dual HDMI and Dual DP for 4K Resolution.
• Advanced Memory: Supports up to 64GB DDR5 via 2 SO-DIMM slots.
• High-Speed Networking: Dual 2.5GbE Ports for Fast, Stable Connections
• Comprehensive I/O: 4 USB 3.2 Gen2, 6 USB 2.0, and 5 COM Ports for Versatile Connectivity
• Flexible Storage & Expansion: 2 M.2 M-key, 1 M.2 E-key, 1 M.2 B-key, and 1 SIM card slot for enhanced expansion.
• Security Ready: Optional TPM 2.0 for added security.
• Wide Power Support: Wide DC input range (12-36V) for diverse installation environments.

New Model: BFDADN1-N97-N AMD RYZEN V1605B Processor, Support DDR4 2400MHz up to 32GB, Support 4* 4K Display, support wide voltage for Multiple Manufacturing application Features 1. AMD RYZEN V1605B 2.0GHz/QC Core Processor 2. 2* DDR4 2400MHz up to 32GB 3. 1* 2.5”SATA, 1* M.2 E-key, 1* M.2 M-key, 1* M.2 B-key 4. Support 4* DP 5. 2* COM (Max : 6* COM), 2* LAN, 2* USB3.2, 4* USB2.0, 1* Line in, 1* Line out, 1* Mic 6. Mini ITX Form Factor (170 *170 mm) 7. Support TPM2.0 (optional) 8. DC12~28V input 　

New Model: HBJC903I39 Intel® Elkhart Lake J6412 CPU, DDR4 up to 32GB, 12V DC-in Features 1. Intel® Elkhart Lake J6412 2.0GHz/QC Core MCP Processor (Turbo 2.6GHz) 2. Support DDR4 3200/2933 up to 32GB 3. 2* Intel ® I225-V 2.5GbE 4. 1* SATA III (6Gb/s), 1* M.2 M key (NVMe/SATA) 5. 1* M.2 E key (support WIFI/BT Module) 6. 1* M.2 B key (support 4G/5G Module) 7. 1* VGA, 1* HDMI 8. 2* USB3.1(Gen.1), 4* USB2.0, 2* RS485, 2* RS232 9. Fanless cooling design 10. 12V DC-in 　

Fanless Compact Box PC with Intel® Braswell N3160 Features

• Powered by Intel® Celeron® N3160 Processor (Braswell, TDP 6W)
• Dual Display: Supports HDMI and DP outputs
• Expandable Connectivity: 1 x SATA, 1 x M.2 (M-key 2242), 1 x mini-PCIe slot for add-ons
• Comprehensive I/O: 6 x USB, 5 x COM, HDMI, DP, dual LAN, MIC, and Line-Out
• Wide Power Range: DC 9~36V input
• Versatile Mounting: Fanless compact design supports Wall Mount and DIN rail installation
• Optional TPM 2.0 support

New Model: HBJC501I25-H610 Fanless embedded system with Intel® LGA1151 CPU supports triple display and DC-in 9~24V Features

• Powered by Intel® LGA1151 Socket 6th & 7th Generation Pentium, Core i3, i5, and i7 Processors (TDP 35W).
• Supports Dual DDR4 SODIMM Up to 32GB
• Dual GbE Ethernet Ports provide high-speed and reliable networking
• Triple Display Support: 1 x HDMI, 2 x DP, with 4K resolution capability
• Comprehensive I/O: 4 x USB 3.0, 2 x USB 2.0,6 x COM Ports
• Fanless black aluminum enclosure with support for wall mounting and DIN rail mounting

Intel® LGA1151 CPU, DDR4 2400/2666MHz up to 64GB Features 1. Fanless Black Aluminum Enclosure 2. Support Intel LGA1151 Coffee Lake Processors 3. Supports DDR4 2400/2666MHz SODIMM up to 64GB 4. Supports up to 3 Displays, 1* HDMI, 2* DP 5. 1* 2.5” SATAIII 6Gb/s Internal Drive bay 6. 1* M.2(M-key, 2242/2260/2280, Support NVMe) slot for SSD 7. Support onboard TPM 2.0 　

New Model: HB651I215 Compact Fanless System with Intel® LGA1200 Socket 10th/11th Gen Processor and H470 Chipset Features

• Powered by Intel® LGA1200 10th/11th Gen Socket Processor (Comet Lake-S, TDP 35W)
• Dual Display Support: 1 x DP and 1 x HDMI for 4K Resolution
• Comprehensive I/O: 3 x USB 3.2 Gen2, 1 x USB 3.2 (Type-C), 4 x USB 2.0, 1 x GbE, 1 x COM
• Storage and Expansion: 1 x SATA III, 1 x M.2 M-key, and 1 x M.2 E-key
• Supports Wall Mount for Easy Installation
• Optional TPM 2.0 Support

Robust Din-rail Fanless System with Intel® Whiskey Lake Mobile U i5-8265U processor, 6* GbE Features 1. Intel Gen. 8th/10th Core i U-Series CPU 2. 2* SO-DIMM DDR4 2400/2133 Dram (Max 64GB) 3. 2* RS232/422/485, 6* GbE 4. 16-bit GPIO 5. Support 4G/5G (M.2 B Key + Nano SIM Holder) Module, Wi-Fi6 Module (M.2 E Key) 6. 12~36V DC-in with OCP/OVP 7. Remote Power Switch Design 　

Robust Din-rail Fanless System with Intel® Whiskey Lake Mobile U i5-8265U processor, support PoE and GPIO isolation Features 1. Intel Gen. 8th/10th Core i U-Series CPU 2. 2* SO-DIMM DDR4 2400/2133 Dram (Max 64GB) 3. 2* RS232/422/485, 2* GbE, 4* PoE GbE 4. 16-bit GPIO 5KV optical isolation 5. Support 4G/5G (M.2 B Key + Nano SIM Holder) Module, Wi-Fi6 Module (M.2 E Key) 6. 12~36V DC-in with OCP/OVP 7. Remote Power Switch Design 　

Intel® Core i7~Celeron Series Automation Computers with 1* PCIe expansion slot, 2* PCI slots, 1* extend slot and 1* Mini PCIe slot Features 1. Intel® LGA 1151 Socket Core i7/i5/i3 Processor (Max 45W) 2. Support 2* DDR4 2133/1866 SO-DIMM (Max 32GB) 3. 2* Intel® 10/100/1000Base-T Ethernet (i219LM +i211AT) 4. 2* RS-232/422/485 ports with automatic flow control 5. VGA / HDMI support two independent displays 6. 4* USB3.0, 4* USB2.0, 1* PCIe x16 slot + 2* PCI slots or 3* PCI slots 7. Thumb screw for easy maintenance and expansion card installations 8. The lead switch is convenient for the actual field operation 9. 19V DC-in 　

Intel® Q170 chipset, LGA1151 processor, 1* PCI-E expansion slot, 2* PCI slots, 1* extend slot and 1* Mini PCIe slot Features 1. Intel® LGA 1151 Socket Core i7/i5/i3 Processor (Max 54W) 2. Support 2*DDR4 2133/1866 SO-DIMM (Max 32GB) 3. 2 x Intel® 10/100/1000Base-T Ethernet (i219LM +i211AT) 4. 2 x RS-232/422/485 ports with automatic flow control 5. VGA, HDMI, DP support 3 x independent displays 6. 6 x USB3.0, 1 x PCI-E x16 slot, 2 x PCI slots, 1 x extend slot 7. The extend slot can be used to extend 14 x USB3.0 or 4 x GbE or other functional interfaces 8. Thumb screw for easy maintenance and expansion card installation 9. The lead switch is convenient for the actual field operation 10. Support Intel® vPro (by CPU) 11. 9~36V wide input voltage can meet the needs of different industries