MI215Q6700

Mini-ITX Motherboard with Intel® Q670E Chipset, LGA 1700 Socket for 12th/13th/14th Gen Processors, DDR5 up to 96GB, 12–36V DC-in

Features

  • Powered by Intel® 14th/13th/12th Gen LGA1700 Socket Processors (Raptor Lake-S/Alder Lake-S, Max 65W TDP)
  • High-Performance Memory: Dual DDR5 SO-DIMM, up to 96GB
  • Dual 2.5GbE LAN: High-speed networking
  • Quad Display Support: 2 x HDMI, 2 x DP, 1 x LVDS/eDP for 4K displays
  • Storage & Expansion: 2 x SATA, 2 x M.2 M-key, 1 x M.2 E-key, 1 x M.2 B-key for 4G/5G, 1 x PCIe x16 (Gen 4)
  • Comprehensive I/O: 2 x RS232/422/485, 4 x RS232, 4 x USB 3.2 Gen 2, 2 x USB 3.2, 4 x USB 2.0
  • Wide Range Power Input: DC-in 12V–36V for industrial use
  • Advanced Power Protection: Supports RVP, OCP, and OVP

　Inquiry

Category:
SYSTEM
MB FORM FACTORMini-ITX
CPUIntel® LGA1700 12/13/14th Gen Socket Processor (Formerly Alder Lake-S, TDP 65W)
CHIPSETIntel® Q670E
MEMORY2 x DDR5 4800MHz, Dual Channel SO-DIMM, up to 96GB
Actual memory support depends on the specific CPU and model
BIOSAMI Flash ROM
WATCHDOG TIMER255 Levels
SECURITYTPM2.0 (Optional)
DIMENSION (W X D)170.0 (W) x 170.0 (D) mm (6.7″ x 6.7″)
OS SUPPORTWindows® 11 (64bit)
Windows® 10 (64bit)
Linux
POWER
POWER REQUIREMENTDC-in 12~36V
POWER ON MODEAT / ATX
CONNECTORDC Jack
DISPLAY
GPUIntel® HD Graphics
LVDS1 x LVDS (Max. Resolution: 1920 x 1200 @60Hz, Co-lay eDP)
DP2 x DP1.4a (Max Resolution: 4096 x 2304@60Hz)
HDMI2 x HDMI 2.0b (Max Resolution: 4096 x 2160@60Hz)
MULTIPLE DISPLAYSupport 4 Displays
AUDIO
CODECRealtek Audio Codec
COMBO1 x Combo Audio Jack for Line-Out / Mic-In
AMPLIFIER3W
LAN
ETHERNET1 x RJ45 for Intel® I226-V 2.5GbE
1 x RJ45 for Intel® I226-LM 2.5GbE
USB PORT
USB4 x USB 3.2 Gen 2x1 (10Gbps, Formerly USB 3.1 Gen 2)
Internal Header for 2 x USB 3.2
Internal Header for 4 x USB 2.0
SERIAL PORT
COMInternal Header for 2 x RS-232/422/485
Internal Header for 4 x RS-232
INTERNAL I/O
GPIO8-Bit
SMBUSYes
ADDITIONAL1 x LVDS (co-layout eDP)
1 x Chassis Intrusion
1 x Audio Header
1 x AT Mode Selection
STORAGE
SATA2 x SATA III
1 x SATA Power Connector
RAIDRAID 0/1
EXPANSION
M.21 x M-Key 2242 (PCIe Gen.4 x4/SATA interface) support NVMe
1 x M-Key 2280 (PCIe Gen.3 x4/SATA interface) support NVMe
1 x E-Key 2230 (USB 2.0/PCIe x1) Support CNVio for Wi-Fi
1 x B-Key 3042/3052 (USB3.1/USB2.0/PCIe x1) for 4G/5G module
PCIe1 x PCIe x16 (Gen.4)
SIM1 x SIM Card Slot
ENVIRONMENT & CERTIFICATION
SHOCK15G, 11ms duration
VIBRATION1 Grms/ 5~ 500Hz/ Operation
OPERATING TEMPERATURE0°C ~ 60°C (32°F ~ 140°F)
STORAGE TEMPERATURE-20°C ~ 85°C (-4°F ~ 185°F)
OPERATING HUMIDITY10 ~ 90% Relative Humidity, Non-condensing
CERTIFICATIONCE/FCC Class A
LVD
ESG DECLARATIONEU RoHS
China RoHS
REACH
PART NUMBERDESCRIPTIONQTY
MI215Q6700 SeriesMI215Q6700 Series M/B1
F04-MB-098-FI/O Shield1
G01-COM-H2M22-1FCOM Cable2
G01-SATA3-BL-1FSATA III Cable1
G01-PW4PS-2S-323FSATA Power Cable1
PART NUMBERMI215Q6700-A1MI215Q6702-A1
CPUIntel® Socket LGA1700 CPUIntel® Socket LGA1700 CPU
SECURITYTPM2.0
POWER REQUIREMENTDC-in 12~36VDC-in 12~36V
GPUIntel® HD GraphicsIntel® HD Graphics
LVDS1 x LVDS/eDP1 x LVDS/eDP
DP2 x DP2 x DP
HDMI2 x HDMI2 x HDMI
MULTIPLE DISPLAYSupport 4 DisplaysSupport 4 Displays
ETHERNET2 x 2.5GbE2 x 2.5GbE
USB4 x USB 3.2 Gen 24 x USB 3.2 Gen 2
USB2 x USB 3.2 Gen 12 x USB 3.2 Gen 1
USB4 x USB 2.04 x USB 2.0
COM4 x RS-2324 x RS-232
COM2 x RS-232/422/4852 x RS-232/422/485
SATA2 x SATA III2 x SATA III
M.21 x M-Key 22421 x M-Key 2242
M.21 x M-Key 22801 x M-Key 2280
M.21 x E-Key 22301 x E-Key 2230
M.21 x B-Key 3042/30521 x B-Key 3042/3052
PCIE1 x PCIE x161 x PCIE x16
SIM1 x SIM Card Slot1 x SIM Card Slot
OPERATING TEMPERATURE0°C ~ 60°C (32°F ~ 140°F)0°C ~ 60°C (32°F ~ 140°F)

Note: All specifications are subject to change without notice.

MI215Q6700

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