HB368F21-6412-AI

Compact Edge AI System with Intel® J6412 SoC Processor and Integrated Hailo-8™ AI Accelerator

Features

  • Efficient Processing: Powered by Intel® J6412 SoC Processor (Elkhart Lake, TDP 10W)
  • Integrated AI Acceleration: Features Hailo-8™ M.2 M-key module delivering 26 TOPS for AI applications
  • Triple Display Support: Equipped with 3 x DisplayPort outputs supporting 4K Resolution
  • Comprehensive I/O: Includes 2 x USB 3.2 Gen2, 4 x USB 2.0, and 1 Phoenix Port (1 GPIO, 2 RS232/422/485)
  • Storage & Expansion: On-board eMMC, 1 x M.2 E-Key, 1 x M.2 M-Key, 1 x M.2 B-Key, and 1 SIM card slot
  • Compact Design: Supports Wall Mount and DIN Rail for Space-Saving Installation
  • Wide Range DC-In: Supports 12~36V input for versatile power options

　Inquiry

Category:
SYSTEM
MB FORM FACTOR3.5"
CPUOnboard Intel® Celeron® Processor J6412 (Formerly Elkhart Lake, TDP 10W)
For additional compatible CPUs, please contact regional sales
CHIPSETIntel® SoC
MEMORY1 x DDR4 3200MHz, Single Channel SO-DIMM, up to 32GB
BIOSAMI Flash ROM
WATCHDOG TIMER255 Levels
SECURITYTPM2.0
OS SUPPORTWindows® 11 (64bit)
Windows® 10 (64bit)
Linux
POWER
POWER REQUIREMENTDC-in 12~36V
40W Adapter: AC90~240V, DC12V/3.3A
POWER ON MODEAT / ATX
DISPLAY
GPUIntel® HD Graphics, shared memory
DP3 x DP (Max Resolution: 4096 x 2160@60Hz)
MULTIPLE DISPLAYSupport 3 Displays
LAN
ETHERNET2 x RJ45 for Realtek® RTL8119I GbE
SYSTEM I/O
REAR PANEL I/O2 x RJ45
2 x USB3.1 (Gen.2)
1 x USB 2.0
1 x 8-bit GPIO (Phoenix Connector 2 x 9 PIN)
2 x RS-232/422/485 (Phoenix Connector 2 x 9 PIN)
1 x DC12-36V
1 x GND Hold
FRONT PANEL I/O1 x Power LED
1 x Power Button
4 x USB 2.0
1 x Audio (Line-out + MIC-in)
1 x Line-in
3 x DP
STORAGE
eMMCeMMC 64GB (optional)
EXPANSION
M.21 x B-key 3042 (USB3.0 interface)
1 x E-Key 2230 (USB 2.0/PCIe 3.0 x1)
1 x M-Key 2242/2280 (SATA/PCIe 3.0 x2) Support NVMe
SIM1 x SIM Card Slot
OTHERS
OTHER1 x Hailo-8 M.2 M KEY module (AI Accelerator)
MECHANICAL
MOUNTINGWall Mount, DIN Rail Clip
DIMENSIONS (W x D x H)160.2 (W) x 106.0 (D) x 43.5 (H) mm
GROSS WEIGHT1.52 kg
NET WEIGHT1.01 kg
ENVIRONMENT & CERTIFICATION
OPERATING TEMPERATURE-20°C ~ 70°C (-4°F ~ 158°F)
STORAGE TEMPERATURE-40°C ~ 85°C (-40°F ~ 185°F)
OPERATING HUMIDITY10 ~ 90% Relative Humidity, Non-condensing
STORAGE HUMIDITY0 ~ 95% Relative Humidity, Non-condensing
CERTIFICATIONCE/FCC Class A
LVD
ESG DECLARATIONEU RoHS
China RoHS
ErP
PART NUMBERDESCRIPTIONQTY
HB368F21 seriesHB368F21 series1
HCSFBMWM01B-FPower cord1
HCS3XXDINRAILPS-FDIN RAIL clip KITS1
L01AS052-FAdapter DC12V_60W1
Change according to shipping areaPower cord1
LCSCHBJC3XX-FScrew Pack1
J05-ANT-GX57245-FAntenna 2G4/5G 2.8dBi (WiFi Series only)1
PART NUMBERDESCRIPTIONQTY
—DIN RAIL MODULE1
PART NUMBERHB368F21-6412-AIHB368F21I-6412-AI
CPUIntel® Celeron® J6412Intel® Celeron® J6412
SECURITYTPM2.0TPM2.0
POWER REQUIREMENTDC-in 12~36VDC-in 12~36V
GPUIntel® HD Graphics, shared memoryIntel® HD Graphics, shared memory
DP3 x DP (Max Resolution: 4096×2160@60Hz)3 x DP (Max Resolution: 4096×2160@60Hz)
MULTIPLE DISPLAYSupport 3 DisplaysSupport 3 Displays
ETHERNET2 x GbE2 x GbE
I/O2 x RJ452 x RJ45
I/O2 x USB 3.2 Gen 22 x USB 3.2 Gen 2
I/O5 x USB 2.05 x USB 2.0
I/O2 x RS-232/422/4852 x RS-232/422/485
I/O1 x GPIO1 x GPIO
I/O1 x Audio (Line-out, MIC)1 x Audio (Line-out, MIC)
I/O1 x Line-in1 x Line-in
I/O1 x GND Hold1 x GND Hold
I/O1 x DC Jack1 x DC Jack
eMMCeMMC 64GBeMMC 64GB
M.21 x E-Key 22301 x E-Key 2230
M.21 x B-Key 2242/3042/30521 x B-Key 2242/3042/3052
M.21 x Hailo-8 M KEY module1 x Hailo-8 M KEY module
OTHERWiFi
OPERATING TEMPERATURE-20°C ~ 70°C (-4°F ~ 158°F)-20°C ~ 70°C (-4°F ~ 158°F)

Note: All specifications are subject to change without notice.

HB368F21-6412-AI

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