MI09-30

Mini-ITX Motherboard with Intel® LGA1200 10/11th Gen Socket Processor with H470 Chipset

Features

  • Powered by Intel® LGA1200 10/11th Gen Socket Processor (Formerly Comet Lake-S, TDP 65W)
  • Triple Display Outputs: Supports 1 x 4K DP, 1 x 4K HDMI, and 1 x LVDS
  • Storage Expansion: 4 x SATA III, 1 x M.2 M-key (SATA/PCIe)
  • Additional Expansion: 1 x M.2 E-key 2230 (PCIe x1/USB 2.0) supporting CNVi, 1 x PCIe x4
  • Flexible Connectivity: 3 x USB 3.2 Gen 2, 3 x USB 3.2 Gen 1, 5 x USB 2.0, 1 x RS232/422/485
  • Security-Enhanced Design: Includes optional TPM 2.0 support

　Inquiry

Category:
SYSTEM
MB FORM FACTORThin Mini-ITX
CPUIntel® LGA1200 10/11th Gen Socket Processor (Formerly Comet Lake-S, TDP 65W)
CHIPSETIntel® H470
MEMORY2 x DDR4 2933/2666/2400MHz, Dual Channel SO-DIMM, up to 64GB
BIOSAMI 128Mb Flash ROM
WATCHDOG TIMER255 Levels
SECURITYTPM2.0 (Optional)
DIMENSION (W X D)170.0 (W) x 170.0 (D) mm (6.7″ x 6.7″)
OS SUPPORTWindows® 10 (64bit)
Linux
POWER
POWER REQUIREMENTDC-in 12~19V
POWER ON MODEAT / ATX
CONNECTORDC Jack
DISPLAY
GPUIntel® HD Graphics
LVDS1 x LVDS (Max. Resolution: 1920 x 1200 @60Hz)
DP1 x DP (Max Resolution: 4096 x 2304@60Hz)
HDMI1 x HDMI 1.4 (Max Resolution: 4096 x 2160@30Hz)
MULTIPLE DISPLAYSupport 3 Displays
AUDIO
CODECRealtek Audio Codec
Line-out1 x Audio Jack for Line-Out
MIC-in1 x Audio Jack for MIC-In
LAN
ETHERNET1 x RJ45 for Intel® I219-V GbE
USB PORT
USB3 x USB 3.2 Gen 2x1 (10Gbps, Formerly USB 3.1 Gen 2)
1 x USB 3.2 Gen 1x1 Type-C (5Gbps)
Internal Header for 2 x USB 3.2
Internal Header for 5 x USB 2.0
SERIAL PORT
COMInternal Header for 1 x RS-232/422/485
INTERNAL I/O
ADDITIONAL1 x Audio Header
1 x AT Mode Selection
STORAGE
SATA4 x SATA III
1 x SATA Power Connector
RAIDRAID 0, 1, 5, 10
EXPANSION
M.21 x M-Key 2242/2260/2280 (SATA/PCIe interface)
1 x E-Key 2230 (USB 2.0/PCIe x1) Support CNVi
PCIe1 x PCIe x4
ENVIRONMENT & CERTIFICATION
SHOCK15G, 11ms duration
VIBRATION1 Grms/ 5~ 500Hz/ Operation
OPERATING TEMPERATURE0°C ~ 60°C (32°F ~ 140°F)
STORAGE TEMPERATURE-20°C ~ 85°C (-4°F ~ 185°F)
OPERATING HUMIDITY10 ~ 90% relative humidity, non-condensing
CERTIFICATIONCE/FCC Class A
LVD
ESG DECLARATIONChina RoHS
EU RoHS
REACH
PART NUMBERDESCRIPTIONQTY
MI09-30 / MI09-32MI09-30 / MI09-32 M/B1
F04-MB-085-FMI09 I/O Shield1
G01-COM-H2M22-1FCOM Cable1
G01-PW4PS-2S-322FSATA Power Cable1
G01-SATA3-BL-1FSATA Cable1
PART NUMBERMI09-30MI09-32
CPUIntel® Socket LGA1200 CPUIntel® Socket LGA1200 CPU
SECURITYTPM2.0
POWER REQUIREMENTDC-in 12~19VDC-in 12~19V
GPUIntel® HD GraphicsIntel® HD Graphics
LVDS1 x LVDS1 x LVDS
DP1 x DP1 x DP
HDMI1 x HDMI1 x HDMI
MULTIPLE DISPLAYSupport 3 DisplaysSupport 3 Displays
ETHERNET1 x GbE1 x GbE
USB3 x USB 3.2 Gen 23 x USB 3.2 Gen 2
USB1 x USB 3.2 Type C1 x USB 3.2 Type C
USB2 x USB 3.22 x USB 3.2
USB5 x USB 2.05 x USB 2.0
COM1 x RS-232/422/4851 x RS-232/422/485
SATA4 x SATA III4 x SATA III
M.21 x M-Key 2242/2260/22801 x M-Key 2242/2260/2280
M.21 x E-Key 22301 x E-Key 2230
PCIE1 x PCIE x41 x PCIE x4
OPERATING TEMPERATURE0°C ~ 60°C (32°F ~ 140°F)0°C ~ 60°C (32°F ~ 140°F)

Note: All specifications are subject to change without notice.

MI09-30

    Subject

    Company(required)

    Name(required)

    Email(required)

    Content