MI02-30

Mini-ITX Motherboard with Intel® LGA1200 10/11th Gen Socket Processor, Supporting Wide-Range DC-in 12-28V

Features

  • Powered by Intel® LGA1200 10/11th Gen Socket Processor with H470 Chipset (Comet Lake-S, TDP 65W)
  • Triple display outputs via 2 x 4K HDMI, 1 x 4K DP, 1 x LVDS, and 1 x 4K eDP
  • Dual Ethernet ports with 1 x Intel® 2.5GbE and 1 x Intel® GbE for reliable networking
  • Flexible storage options with 1 x SATA III and 1 x M.2 M-key (SATA/NVMe) supporting RAID
  • Additional expansion via 1 x PCIe x16, 1 x M.2 E-key, 1 x M.2 B-key, and 1 x Nano SIM card slot
  • Comprehensive I/O including 10 USB (4 x USB 3.2 Gen2), 4 x COM, and 1 GPIO
  • Wide-range power support with DC-in 12-28V
  • Optional onboard TPM 2.0 support for enhanced data security

Categories: , Tag:
SYSTEM
MB FORM FACTORMini-ITX
CPUIntel® LGA1200 10/11th Gen Socket Processor (Formerly Comet Lake-S, TDP 65W)
CHIPSETIntel® H470
MEMORY2 x DDR4 2933/2666/2400MHz, Dual Channel SO-DIMM, up to 64GB
Actual memory support depends on the specific CPU and model
BIOSAMI 256Mb Flash ROM
WATCHDOG TIMER255 Levels
SECURITYTPM2.0
DIMENSION (W X D)170.0 (W) x 170.0 (D) mm (6.7″ x 6.7″)
OS SUPPORTWindows® 11 (64bit)
Windows® 10 (64bit)
Linux
POWER
POWER REQUIREMENTDC-in 12~28V
POWER ON MODEAT / ATX
CONNECTORDC Jack
DISPLAY
GPUIntel® HD Graphics
LVDS1 x LVDS (Max. Resolution: 1920 x 1200 @60Hz)
eDP1 x eDP (Max Resolution: 4096 x 2304@60Hz)
DP1 x DP (Max Resolution: 4096 x 2304@60Hz)
HDMI2 x HDMI 1.4 (Max Resolution: 4096 x 2160@30Hz)
MULTIPLE DISPLAYSupport 3 Displays
AUDIO
CODECRealtek Audio Codec
Line-out1 x Audio Jack for Line-Out
MIC-in1 x Audio Jack for MIC-In
LAN
ETHERNET1 x RJ45 for Intel® I219-V GbE
1 x RJ45 for Intel® I226-V 2.5GbE
USB PORT
USB4 x USB 3.2 Gen 2x1 (10Gbps, Formerly USB 3.1 Gen 2)
Internal Header for 2 x USB 3.2
Internal Header for 4 x USB 2.0
SERIAL PORT
COMInternal Header for 4 x RS-232/422/485
INTERNAL I/O
GPIO8-Bit
SMBUSYes
ADDITIONAL1 x Chassis Intrusion
1 x Audio Header
1 x eDP
1 x LVDS
1 x AT Mode Selection
STORAGE
SATA1 x SATA III
RAIDRAID 0/1
EXPANSION
M.21 x M-key 2280 (SATA/PCIex4) support NVMe
1 x E-Key 2230 (USB 2.0/PCIe x1) Support CNVi
1 x B-key 3042/3052 (USB3.0/PCIe x1) support W/SIM card slot
PCIE1 x PCIE x16
SIM1 x Nano SIM Card Slot
ENVIRONMENT & CERTIFICATION
SHOCK15G, 11ms duration
VIBRATION1 Grms/ 5~ 500Hz/ Operation
OPERATING TEMPERATURE0°C ~ 60°C (32°F ~ 140°F)
STORAGE TEMPERATURE-20°C ~ 85°C (-4°F ~ 185°F)
OPERATING HUMIDITY10 ~ 90% Relative Humidity, Non-condensing
CERTIFICATIONCE/FCC Class A
LVD
ESG DECLARATIONEU RoHS
China RoHS
REACH
PART NUMBERDESCRIPTIONQTY
MI02-30 SeriesMI02-30 / MI02-32 M/B1
F04-MB-083-1FMI02 I/O shield1
G01-SATA3-BL-1FSATA Cable1
G01-COM-H2M22-1FCOM Cable2
G01-PW4PS-2S-323FSATA Power Cable1
PART NUMBERMI02-30-A1MI02-32-A1
CPUIntel® Socket LGA1200 CPUIntel® Socket LGA1200 CPU
SECURITYTPM2.0
POWER REQUIREMENTDC-in 12~28VDC-in 12~28V
GPUIntel® HD GraphicsIntel® HD Graphics
LVDS1 x LVDS1 x LVDS
eDP1 x eDP1 x eDP
DP1 x DP1 x DP
HDMI2 x HDMI2 x HDMI
MULTIPLE DISPLAYSupport 3 DisplaysSupport 3 Displays
ETHERNET1 x 2.5GbE1 x 2.5GbE
ETHERNET1 x GbE1 x GbE
USB4 x USB 3.2 Gen 24 x USB 3.2 Gen 2
USB2 x USB 3.22 x USB 3.2
USB4 x USB 2.04 x USB 2.0
COM4 x RS-232/422/4854 x RS-232/422/485
SATA1 x SATA III1 x SATA III
M.21 x M-Key 22801 x M-Key 2280
M.21 x E-Key 22301 x E-Key 2230
M.21 x B-Key 3042/30521 x B-Key 3042/3052
PCIE1 x PCIE x161 x PCIE x16
SIM1 x Nano SIM Card Slot1 x Nano SIM Card Slot
OPERATING TEMPERATURE0°C ~ 60°C (32°F ~ 140°F)0°C ~ 60°C (32°F ~ 140°F)

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