LA34-H6100

ATX Board with Intel® 14th/13th/12th Gen LGA1700 Socket Processor, DDR5 up to 96GB, and Triple Display Support

Features

  • Power by Intel® 14th/13th/12th Gen LGA1700 Socket CPU (up to 125W TDP) with H610/H610E Chipset
  • High-Performance Memory: 2 x DDR5 4800MHz UDIMM, up to 96GB
  • Triple Display Support: 1 x VGA, 1 x LVDS/eDP, 1 x HDMI, 1 x DP, supporting up to 4K/8K resolution
  • Reliable Networking: 1 x 2.5GbE, 1 x GbE for high-speed connectivity
  • Comprehensive I/O: 6 x COM, 4 x USB 3.2, 6 x USB 2.0, and 2 x USB 2.0 (Vertical)
  • Storage & M.2 Expansion: 4 x SATA III, 1 x M.2 M-key, 1 x M.2 E-key
  • PCI Expansion Slots: 1 x PCIe x16 (Gen 4), 2 x PCIe x4 (Gen 3), 4 x PCI
  • Power Input: Standard ATX Power

Categories: ,
SYSTEM
MB FORM FACTORATX
CPUIntel® LGA1700 12/13/14th Gen Socket Processor (Formerly Alder Lake-S, TDP 125W)
CHIPSETIntel® H610/H610E
MEMORY2 x DDR5 4800MHz, Dual Channel SO-DIMM, up to 96GB
BIOSAMI Flash ROM
WATCHDOG TIMER255 Levels
SECURITYTPM2.0
DIMENSION (W X D)305.0 (W) x 220.0 (D) mm (12" x 8.7")
OS SUPPORTWindows® 11 (64bit)
Windows® 10 (64bit)
Linux
POWER
POWER REQUIREMENTATX Power Supply
POWER ON MODEAT / ATX
CONNECTOR24+8-pin ATX PWR
DISPLAY
GPUIntel® HD Graphics
LVDS1 x LVDS (Max. Resolution: 1920 x 1080 @60Hz, Co-lay eDP)
DP1 x DP1.4 (Max Resolution: 7680 x 4320@60Hz)
HDMI1 x HDMI 2.0 (Max Resolution: 4096 x 2304@60Hz)
VGA1 x VGA (Max Resolution: 2560 x 1600 @60Hz)
MULTIPLE DISPLAYSupport 3 Displays
AUDIO
CODECRealtek Audio Codec
Line-in1 x Audio Jack for Line-In
Line-out1 x Audio Jack for Line-Out
MIC-in1 x Audio Jack for MIC-In
LAN
ETHERNET1 x RJ45 for Intel® I226-V 2.5GbE
1 x RJ45 for Intel® I219-V GbE
USB PORT
USB4 x USB 3.2 Gen 1x1 (5Gbps, Formerly USB 3.1 Gen 1)
2 x USB 2.0
Internal Header for 4 x USB 2.0
Internal USB Type A (Vertical) for 2 x USB 2.0
SERIAL PORT
COM2 x DB-9 for RS-232/422/485
Internal Header for 4 x RS-232
INTERNAL I/O
GPIO16 bit GPIO (5V) Co-lay LPT
SMBUSYes
FAN1 x CPU Fan Header (Smart Fan)
2 x System Fan Header
STORAGE
ADDITIONAL1 x Chassis intrusion
1 x FP_Audio
1 x PS/2
1 x LVDS/EDP + Inverter (Option for Factory)
SATA4 x SATA III
1 x SATA Power Connector
EXPANSION
M.21 x M-Key 2242/2280 (PCIe 3.0 x2)
1 x E-Key 2230 (USB2.0) Support CNVi
PCIE1 x PCI Express x16 (Gen.4)
2 x PCIe 3.0 x4
4 x PCI
ENVIRONMENT & CERTIFICATION
SHOCK15G, 11ms duration
VIBRATION1 Grms/ 5~ 500Hz/ Operation
OPERATING TEMPERATURE-10°C ~ 60°C (14°F ~ 140°F) with 0.5 m/s airflow
STORAGE TEMPERATURE-20°C ~ 70°C (-4°F ~ 158°F)
OPERATING HUMIDITY10 ~ 90% Relative Humidity, Non-condensing
CERTIFICATIONCE/FCC Class A
LVD
ESG DECLARATIONEU RoHS
China RoHS
PART NUMBERDESCRIPTIONQTY
LA34-H6100 SeriesLA34-H6100 Series M/B1
F04-MB-060-FI/O Shield1
G01-SATA3-BL-1FSATA III Cable 50cm2
G01-COM9X2-30A-1FCable and COM9x2 K=10 30cm1
PART NUMBERDESCRIPTIONQTY
G01-SATA3-BL-1FSATA III Cable 50cm1
G01-COM9X2-30A-1F1 x Cable and COM9x2 K=10 30cm1
PART NUMBERLA34-H6100LA34-H6102
CPUIntel® Socket LGA1700 CPUIntel® Socket LGA1700 CPU
SECURITYTPM2.0 (dTPM)
POWER REQUIREMENTATX Power SupplyATX Power Supply
GPUIntel® UHD GraphicsIntel® UHD Graphics
LVDS1 x LVDS/eDP1 x LVDS/eDP
DP1 x DP1 x DP
HDMI1 x HDMI1 x HDMI
VGA1 x VGA1 x VGA
MULTIPLE DISPLAYSupport 3 DisplaysSupport 3 Displays
ETHERNET1 x 2.5GbE1 x 2.5GbE
ETHERNET1 x GbE1 x GbE
USB4 x USB 3.24 x USB 3.2
USB8 x USB 2.08 x USB 2.0
COM2 x RS-232/422/4852 x RS-232/422/485
COM4 x RS-2324 x RS-232
SATA4 x SATA III4 x SATA III
M.21 x M-Key 2242/22801 x M-Key 2242/2280
M.21 x E-Key 22301 x E-Key 2230
PCIE1 x PCIE x161 x PCIE x16
PCIE2 x PCIE x42 x PCIE x4
PCIE4 x PCI4 x PCI
OPERATING TEMPERATURE-10°C ~ 60°C (14°F ~ 140°F) with 0.5 m/s airflow-10°C ~ 60°C (14°F ~ 140°F) with 0.5 m/s airflow

LA34-H6100

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