TOP∧
SYSTEM | |
MB FORM FACTOR | Mini-ITX |
CPU | Intel® LGA1151 8th Gen Socket Processor (Formerly Coffee Lake-S, TDP 35W) For additional compatible CPUs, please contact regional sales |
CHIPSET | Intel® Q170 |
MEMORY | 2 x DDR4 2133MHz, Dual Channel SO-DIMM, up to 32GB |
BIOS | AMI Flash ROM |
WAKE ON LAN | Yes |
WATCHDOG TIMER | 255 Levels |
RTC BATTERY | Lithium Battery |
OS SUPPORT | Windows® 10 (64bit) Windows® 8 / 8.1 (64bit) Windows® 7 (64bit) Windows® 7 (32bit) Linux |
POWER | |
POWER REQUIREMENT | DC-in 9~24V 19V/6.3A 120W Adapter |
DISPLAY | |
DP | 2 x DP (Max Resolution: 4096×2304@60Hz) |
HDMI | 1 x HDMI (Max Resolution: 4096 x 2160@24Hz) |
LAN | |
ETHERNET | 1 x RJ45 for Intel® i211-AT GbE 1 x RJ45 for Intel® I219-LM GbE |
SYSTEM I/O | |
REAR PANEL I/O | 4 x USB 3.0 1 x HDMI 2 x DP 2 x RJ45 1 x Audio (Line-in, Line out, MIC) 2 x RS-232/422/485 4 x RS-232 2 x WIFI Antenna Holes 1 x DC Jack |
FRONT PANEL I/O | 1 x Power Button 1 x HDD LED 2 x USB 2.0 |
STORAGE | |
SATA | 1 x 2.5" SATA 6Gb/s internal drive bay (only Support 2.5" HDD with a hight ≤ 10mm) |
MINI PCI-E | 1 x Full Size Mini-PCIe |
OTHERS | |
OTHER | WIFI (Optional) |
MECHANICAL | |
MOUNTING | Wall Mount, DIN Rail Clip |
DIMENSIONS (W x H x D) | 264.0 (W) x 199.4 (D) x 58.0 (H) mm (7.92" x 5.98" x 1.74") |
GROSS WEIGHT | 5 kg |
NET WEIGHT | 4.2 kg |
ENVIRONMENT & CERTIFICATION | |
SHOCK | 15G, 11ms duration |
VIBRATION | 1 Grms/ 5~ 500Hz/ Operation |
OPERATING TEMPERATURE | -20°C ~ 50°C (-4°F ~ 122°F) |
STORAGE TEMPERATURE | -10°C ~ 70°C (14°F ~ 158°F) |
OPERATING HUMIDITY | 10 ~ 90% Relative Humidity, Non-condensing |
STORAGE HUMIDITY | 0 ~ 95% Relative Humidity, Non-condensing |
CERTIFICATION | CE/FCC Class A LVD |
ESG DECLARATION | EU RoHS China RoHS ErP |
TOP∧
PART NUMBER | DESCRIPTION | QTY |
HBJC501F697 | HBJC501F697 SERIES | 1 |
L01AS056-F | Adapter 19V/6.32A 120W | 1 |
Change According to Shipping Area | Power Cord | 1 |
HCS5XXMWM01B-F | JC5XX Wall Mount / Black Color | 1 |
LCSCHBJC3XX-F | Screw Pack | 1 |
J05-ANT-GX57245-F | Antenna2G4/5G 2.8dBi GX572450001SM (WIFI MODEL Only) | 1 |
HCS3XXDINRAILPS-F | Din Rail Clip | 1 |
PART NUMBER | HBJC501F697-Q17-B |
CPU | Intel® Socket LGA1151 CPU |
POWER REQUIREMENT | DC-in 9~24V |
DP | 2 x DP |
HDMI | 1 x HDMI |
MULTIPLE DISPLAY | Support 3 Displays |
ETHERNET | 2 x GbE |
I/O | 4 x USB 3.0 |
I/O | 2 x USB 2.0 |
I/O | 6 x COM |
I/O | 1 x Line-out |
I/O | 1 x Line-in |
I/O | 1 x MIC-in |
I/O | 1 x DC Jack |
I/O | 1 x Power Button |
I/O | 1 x HDD LED |
I/O | 2 x SMA |
SATA | 1 x SATA III |
MINI PCI-E | 1 x Full mini PCIe |
OPERATING TEMPERATURE | -20°C ~ 50°C (-4°F ~ 122°F) |
TOP∧
![]() |
TOP∧
![]() |