HBJC153I23

1U Rackmount, Intel® Q670E Chipset, supports up to 96GB DDR5 memory, with 8x 2.5GbE ports for high-speed networking

Features

  • Supports Intel® 12th/13th Gen Processors: LGA1700 Socket for powerful performance.
  • Power by Intel® Q670E Chipset: Ensures stability and efficiency.
  • DDR5 Memory: 2x 4800MHz/5600MHz SO-DIMM up to 96GB.
  • 8 x 2.5GbE Ethernet Ports: Faster networking and data transfers.
  • RAID Support: 2x 2.5” SATA HDD with RAID 0, 1.
  • Versatile Expansion: 1x M.2 (2242/2280), 1x M.2 (2280), 1x M.2 (E-key), 1x M.2 (B-key), 1x PCIe x4.
  • Comprehensive I/O:2x USB 3.2 Gen 2, 2x USB 3.2 Gen 1, 2x COM, 1x HDMI.
  • 1U FLEX 400W Power Supply: Efficient power for rackmount systems.

　Inquiry

Category:
SYSTEM
MB FORM FACTORMini-ITX
CPUIntel® LGA1700 12/13/14th Gen Socket Processor (Formerly Alder Lake-S, TDP 65W)
For additional compatible CPUs, please contact regional sales
CHIPSETIntel® Q670E
MEMORY2 x Intel® 12th/13th/14th CPU supports DDR5 4800MHz Dual Channel SO-DIMM, up to 96GB max
2 x Intel® 13th/14th CPU supports DDR5 5600MHz Dual Channel SO-DIMM, up to 64GB max
BIOSAMI Flash ROM
WAKE ON LANYes
WATCHDOG TIMER255 Levels
SECURITYTPM2.0
RTC BATTERYLithium Battery
OS SUPPORTWindows® 11 (64bit)
Linux
POWER
POWER REQUIREMENT1U FLEX 400W ATX PWR (4+24 pin)
MB : ATX Power Input (24pin ATX + 4pin 12V)
POWER ON MODEATX (Default) Mode
DISPLAY
GPUIntel® UHD Graphics, shared memory
HDMI1 x HDMI (Max Resolution: 1920 x 1080@60Hz)
LAN
ETHERNET7 x RJ45 for Intel® i225-V 2.5GbE
1 x RJ45 for Intel® i225-LM 2.5GbE
SYSTEM I/O
REAR PANEL I/OAC input CON
Power on/off SW
FRONT PANEL I/O8 x RJ45
2 x USB 3.2(Gen.2)
2 x USB3.2 (Gen.1)
1 x RS-232
1 x HDMI
1 x Alarm LED
1 x Power LED
1 x Power Switch
STORAGE
SATA2 x 2.5" SATA 6Gb/s internal drive bay (only Support 2.5" HDD with a hight ≤ 10mm)
EXPANSION
M.21 x M-key 2242/2280 (PCIe Gen.4×4 w/SATA interface)
1 x M-key 2280 (PCIe Gen.4×4 w/SATA interface) support NVMe
1 x E-Key 2230 (USB 2.0/PCIe x1) Support CNVi
1 x B-key 3042 (USB3.2 Gen.1/USB2.0/PCIe x1 interface) support 4G Module
PCIE1 x PCIE x4
SIM1 x SIM Card Slot
MECHANICAL
DIMENSIONS (W x D x H)430.0 (W) x 252.0 (D) x 44.0 (H) mm
ENVIRONMENT & CERTIFICATION
SHOCK15G, 11ms duration
VIBRATION1 Grms/ 5~ 500Hz/ Operation
OPERATING TEMPERATURE0°C ~ 50°C (32°F ~ 122°F)
STORAGE TEMPERATURE-40°C ~ 85°C (-40°F ~ 185°F)
OPERATING HUMIDITY10 ~ 95% @ 40°C, Non-condensing
CERTIFICATIONCE/FCC Class A
LVD
ESG DECLARATIONEU RoHS
China RoHS
ErP
PART NUMBERDESCRIPTIONQTY
HBJC153I23 SeriesHBJC153I231
F07-FN9025-FLGA1700 CPU FAN1
G01-GPIO9-M30D-FCOM Cable, L=30cm1
G01-2X10A-HDMI-1FHDMI Cable, L=25cm1
Change according to shipping areaPower Cord1
LCSCJC150-FScrew Pack1
PART NUMBERHBJC153I23-Q670B-A1HBJC153I23-Q670G4A1HBJC153I23-Q670B4A1
CPUIntel® Socket LGA1700 CPUIntel® Socket LGA1700 CPUIntel® Socket LGA1700 CPU
SECURITYTPM2.0 (Optional)TPM2.0 (Optional)TPM2.0 (Optional)
GPUIntel® UHD Graphics, shared memoryIntel® UHD Graphics, shared memoryIntel® UHD Graphics, shared memory
HDMI1 x HDMI1 x HDMI1 x HDMI
ETHERNET8 x 2.5GbE8 x 2.5GbE8 x 2.5GbE
I/OAC input CONAC input CONAC input CON
I/O1 x Power Switch1 x Power Switch1 x Power Switch
I/O8 x RJ458 x RJ458 x RJ45
I/O2 x USB 3.2 Gen 22 x USB 3.2 Gen 22 x USB 3.2 Gen 2
I/O2 x USB 3.2 Gen 12 x USB 3.2 Gen 12 x USB 3.2 Gen 1
I/O1 x RS-2321 x RS-2321 x RS-232
I/O1 x HDMI1 x HDMI1 x HDMI
I/O1 x Alarm LED1 x Alarm LED1 x Alarm LED
I/O1 x Power LED1 x Power LED1 x Power LED
I/O1 x Power Switch1 x Power Switch1 x Power Switch
SATA2 x 2.5” SATA HDD2 x 2.5” SATA HDD2 x 2.5” SATA HDD
M.21 x M-Key 2242/22801 x M-Key 2242/22801 x M-Key 2242/2280
M.21 x M-Key 22801 x M-Key 22801 x M-Key 2280
M.21 x E-Key 22301 x E-Key 22301 x E-Key 2230
M.21 x B-Key 30421 x B-Key 30421 x B-Key 3042
PCIE1 x PCIE x41 x PCIE x41 x PCIE x4
OTHER4-port PCIe LAN Card4-port Bypass LAN Card
OPERATING TEMPERATURE0°C ~ 50°C (32°F ~ 122°F)0°C ~ 50°C (32°F ~ 122°F)0°C ~ 50°C (32°F ~ 122°F)

Note: All specifications are subject to change without notice.

HBJC153I23

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