HBFBZ10

紧凑型无风扇系统，采用Intel® Celeron® J6412与4个 2.5GbE

特点

  • 采用Intel® J6412 SoC 高性能处理器（Elkhart Lake）
  • 高速网络：4 x 2.5GbE，实现稳定可靠的连接
  • 灵活的内存支持：1 x DDR4 3200MHz SODIMM，最高支持 32GB
  • 全面的 I/O：2 x USB 3.1、1 x HDMI® 和 1 x COM（RJ45型式）
  • 储存与扩充：1 x M.2 M-Key 2242、1 x M.2 E-Key 2230和1 x M.2 B-Key 3042
  • 增强的安全性：支持可选的 TPM 2.0，以增强数据保护
  • 紧凑型无风扇设计：节省空间的设计，具有壁挂兼容性

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Category:
SYSTEM
MB FORM FACTOROthers
CPUOnboard Intel® Celeron® Processor J6412 (Formerly Elkhart Lake, TDP 10W)
CHIPSETIntel® SoC
MEMORY1 x DDR4 3200MT/s, Single Channel SO-DIMM, up to 32GB
BIOSAMI Flash ROM
WATCHDOG TIMER255 Levels
SECURITYTPM2.0 (Optional)
OS SUPPORTWindows® 11 (64bit)
Windows® 10 (64bit)
Linux
POWER
POWER REQUIREMENTDC-in 12V
POWER ON MODEAT / ATX
DISPLAY
GPUIntel® HD Graphics
HDMI®1 x HDMI® 2.0 (Max Resolution: 4096 x 2160@60Hz)
LAN
ETHERNET4 x RJ45 for Intel® I226-V 2.5GbE
SYSTEM I/O
REAR PANEL I/O4 x RJ45
1 x COM (RJ45 Type)
1 x DC-in Jack (12V)
1 x GND Hold
1 x WIFI Antenna Hole
FRONT PANEL I/O1 x Power Button
1 x Power LED
1 x Reset Button
1 x USB 3.1
1 x USB 2.0
1 x HDMI®
1 x WIFI Antenna Hole
STORAGE
eMMCOnboard 64GB eMMC 5.1 (optional)
EXPANSION
M.21 x M-key 2242 (PCIe Gen.3 x2/SATA interface) support NVME, (co-layout M.2 B-key)
1 x E-Key 2230 (USB 2.0/PCIe 3.0 x1)
1 x B-key 3042/3052 (USB3.1 interface) co-layout M.2 M-key
SIM1 x SIM Card Slot
MECHANICAL
MOUNTINGWall Mount
DIMENSIONS (W x D x H)125.0 (W) x 109.2 (D) x 39.5 (H) mm
ENVIRONMENT & CERTIFICATION
SHOCK15G, 11ms duration
VIBRATION1 Grms/ 5~ 500Hz/ Operation
OPERATING TEMPERATURE-20°C ~ 60°C (-4°F ~ 140°F)
STORAGE TEMPERATURE-40°C ~ 85°C (-40°F ~ 185°F)
OPERATING HUMIDITY10 ~ 95% @ 40°C, Non-condensing
STORAGE HUMIDITY0 ~ 95% Relative Humidity, Non-condensing
CERTIFICATIONCE/FCC Class A
LVD
ESG DECLARATIONEU RoHS
China RoHS
ErP
PART NUMBERDESCRIPTIONQTY
HBFBZ10 seriesIntel Elkhart Lake SoC Processor J6412 CPU1
LCSCHBJC3XX-FBarebone Screw Pack1
L01AS050-FAdapter DC12V_40W1
Change according to shipping areaPower Cord1
HCSFBMWM01B-FFB Wall Mount1
J05-ANT-GX57245-FAntenna 2G4/5G 2.8dBi GX572450001SM (Wifi Series only)1
PART NUMBERHBFBZ10-6412-BHBFBZ10I-6412-B-A1HBFBZ10-6412-E-A1HBFBZ10I-6412-E-A1HBFBZ10-6412-T-A1HBFBZ10I-6412-T-A1
CPUIntel® Celeron® J6412Intel® Celeron® J6412Intel® Celeron® J6412Intel® Celeron® J6412Intel® Celeron® J6412Intel® Celeron® J6412
SECURITYTPM2.0TPM2.0
POWER REQUIREMENTDC-in 12VDC-in 12VDC-in 12VDC-in 12VDC-in 12VDC-in 12V
GPUIntel® HD Graphics, shared memoryIntel® HD Graphics, shared memoryIntel® HD Graphics, shared memoryIntel® HD Graphics, shared memoryIntel® HD Graphics, shared memoryIntel® HD Graphics, shared memory
HDMI1 x HDMI®1 x HDMI®1 x HDMI®1 x HDMI®1 x HDMI®1 x HDMI®
ETHERNET4 x 2.5GbE4 x 2.5GbE4 x 2.5GbE4 x 2.5GbE4 x 2.5GbE4 x 2.5GbE
I/O1 x USB 3.11 x USB 3.11 x USB 3.11 x USB 3.11 x USB 3.11 x USB 3.1
I/O1 x USB 2.01 x USB 2.01 x USB 2.01 x USB 2.01 x USB 2.01 x USB 2.0
I/O1 x COM (RJ45 Type)1 x COM (RJ45 Type)1 x COM (RJ45 Type)1 x COM (RJ45 Type)1 x COM (RJ45 Type)1 x COM (RJ45 Type)
I/O1 x DC Jack1 x DC Jack1 x DC Jack1 x DC Jack1 x DC Jack1 x DC Jack
I/O1 x Power Button + Power LED1 x Power Button + Power LED1 x Power Button + Power LED1 x Power Button + Power LED1 x Power Button + Power LED1 x Power Button + Power LED
I/O1 x Reset1 x Reset1 x Reset1 x Reset1 x Reset1 x Reset
I/O2 x SMA2 x SMA2 x SMA2 x SMA2 x SMA2 x SMA
I/O1 x GND Hold1 x GND Hold1 x GND Hold1 x GND Hold1 x GND Hold1 x GND Hold
eMMCeMMC 64GBeMMC 64GBeMMC 64GBeMMC 64GB
M.21 x M-Key 22421 x M-Key 22421 x M-Key 22421 x M-Key 22421 x M-Key 22421 x M-Key 2242
M.21 x E-Key 22301 x E-Key 22301 x E-Key 22301 x E-Key 22301 x E-Key 22301 x E-Key 2230
M.21 x B-Key 3042/30521 x B-Key 3042/30521 x B-Key 3042/30521 x B-Key 3042/30521 x B-Key 3042/30521 x B-Key 3042/3052
OTHERWiFiWiFiWiFi
OPERATING TEMPERATURE-20°C ~ 60°C (-4°F ~ 140°F)-20°C ~ 60°C (-4°F ~ 140°F)-20°C ~ 60°C (-4°F ~ 140°F)-20°C ~ 60°C (-4°F ~ 140°F)-20°C ~ 60°C (-4°F ~ 140°F)-20°C ~ 60°C (-4°F ~ 140°F)
IO图
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注意：所有规格如有更改，恕不另行通知。

HBFBZ10

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