HBJC150I225

1U Rackmount: Supports Intel® LGA 1700 Socket for 12th, 13th, and 14th Gen Processors, with Up to 96GB DDR5 RAM

Features

  • Supports Intel® 12th/13th/14th Gen Processors: LGA1700 Socket (Max 65W TDP).
  • Support Intel® LGA1700 12/13/14th Gen Socket Processor (Formerly Alder Lake-S, TDP 65W)
  • DDR5 Memory: 2x 4800MHz/5600MHz SO-DIMM up to 96GB.
  • Triple Display Support: 1x DP, 1x HDMI, 1x VGA.
  • Dual Ethernet Ports: 1GbE and 2.5GbE for faster networking
  • Comprehensive I/O: 8x USB, 1x MIC, 1x Line-out, 1x Line-in, 2x COM
  • Onboard TPM 2.0 (optional): Enhanced data security.
  • 1U FLEX 400W Power Supply: Efficient power for rackmount systems.

　Inquiry

Category:
SYSTEM
MB FORM FACTORMini-ITX
CPUIntel® LGA1700 12/13/14th Gen Socket Processor (Formerly Alder Lake-S, TDP 65W)
CHIPSETIntel® Q670E/H610/H610E
MEMORY2 x DDR5 4800MHz SO-DIMM, up to 96GB
2 x DDR5 5600MHz SO-DIMM, up to 64GB (Intel® 13th/14th Gen CPU)
BIOSAMI Flash ROM
SECURITYTPM2.0
RTC BATTERYLithium Battery
OS SUPPORTWindows® 11 (64bit)
Linux
POWER
POWER REQUIREMENTATX Power Supply
1U FLEX 400W ATX PWR (4+24 pin)
POWER ON MODEATX (Default) Mode
DISPLAY
GPUIntel® UHD Graphics
DP1 x DP1.4a (Max Resolution: 4096 x 2304@60Hz)
HDMI1 x HDMI 2.0b (Max Resolution: 4096 x 2160@60Hz)
VGA1 x VGA (Max Resolution: 1920 x 1080 @60Hz)
MULTIPLE DISPLAYSupport 3 Displays
AUDIO
CODECRealtek Audio Codec
LAN
ETHERNET1 x Intel® i219-LM GbE + 1 x Intel® i225-V 2.5GbE (Q670)
1 x Intel® i219-V GbE + 1 x Intel® i225-V 2.5GbE (H610)
SYSTEM I/O
REAR PANEL I/O2 x RJ45
6 x USB 3.2 Gen.2 (HBJC150I225-Q670)
4 x USB 3.2 Gen.2 + 2 x USB2.0 (HBJC150I225-H610)
1 x HDMI
1 x DP
1 x VGA
2 x COM
1 x Line-in
1 x Line-out
1 x MIC-in
FRONT PANEL I/O1 x Power Button
1 x Reset Button
2 x USB 2.0
1 x Power LED
1 x HDD LED
STORAGE
SATA2 x SATA III (6 Gb/s) 2.5” Device, (HBJC150I225-Q670 support RAID 0, 1)
EXPANSION
M.21 x M-key 2280 (PCIe Gen.3 x4 interface) support NVMe
1 x M-Key 2242 (PCIe Gen.4 x4/SATA interface) support NVMe (HBJC150I225-Q670 only)
1 x E-Key 2230 (USB 2.0/PCIe 3.0 x1) Support CNVi
1 x B-key 3042 (PCIe Gen.3 x1/USB3.2 Gen.2/USB2.0 interface) (HBJC150I225-Q670 only)
1 x B-key 3042 (PCIe Gen.3 x1 interface) (HBJC150I225-H610 only)
PCIe1 x PCI Express x16 (Gen.4)
SIM1 x SIM Card Slot
OTHERS
OTHER1 x GPIO (8 Bit)
MECHANICAL
DIMENSIONS (W x D x H)430.0 (W) x 252.0 (D) x 44.0 (H) mm
GROSS WEIGHT5.2 kg
NET WEIGHT4.2 kg
ENVIRONMENT & CERTIFICATION
SHOCK15G, 11ms duration
VIBRATION1 Grms/ 5~ 500Hz/ Operation
OPERATING TEMPERATURE0°C ~ 50°C (32°F ~ 122°F)
STORAGE TEMPERATURE-40°C ~ 85°C (-40°F ~ 185°F)
OPERATING HUMIDITY10 ~ 90% @ 40°C, Non-condensing
CERTIFICATIONCE/FCC Class A
LVD
ESG DECLARATIONEU RoHS
China RoHS
ErP
PART NUMBERDESCRIPTIONQTY
Change according to shipping areaPower Cord1
LCSCJC150-FScrew Pack1
G01-SATA3-BL-1FSATA Cable1
F07-FN9025-F90x25mm LGA1700 CPU FAN Module1
PART NUMBERHBJC150I225-Q670BA1HBJC150I225-H610BA1
CPUIntel® Socket LGA1700 CPUIntel® Socket LGA1700 CPU
POWER REQUIREMENTATX Power SupplyATX Power Supply
GPUIntel® UHD GraphicsIntel® UHD Graphics
DP1 x DP1 x DP
HDMI1 x HDMI1 x HDMI
VGA1 x VGA1 x VGA
MULTIPLE DISPLAYSupport 3 DisplaysSupport 3 Displays
ETHERNET2 x GbE2 x GbE
I/O2 x RJ452 x RJ45
I/O6 x USB 3.2 Gen 26 x USB 3.2 Gen 2
I/O2 x USB 2.02 x USB 2.0
I/O1 x HDMI1 x HDMI
I/O1 x DP1 x DP
I/O1 x VGA1 x VGA
I/O2 x COM2 x COM
I/O1 x Line-in1 x Line-in
I/O1 x Line-out1 x Line-out
I/O1 x MIC-in1 x MIC-in
I/O1 x Power Button1 x Power Button
I/O1 x Reset1 x Reset
I/O1 x Power LED1 x Power LED
I/O1 x HDD LED1 x HDD LED
SATA2 x SATA III2 x SATA III
M.21 x M-Key 22421 x M-Key 2242
M.21 x M-Key 22801 x M-Key 2280
M.21 x E-Key 22301 x E-Key 2230
PCIE1 x PCIE x161 x PCIE x16
OPERATING TEMPERATURE0°C ~ 50°C (32°F ~ 122°F)0°C ~ 50°C (32°F ~ 122°F)

Note: All specifications are subject to change without notice.

HBJC150I225

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