SoC-N3160
Intel® Braswell N3160 SoC processor, DDR3L up to 8GB, 2* HDMI, 1*DP, 12V DC-in
Features
1. Intel® Braswell N3160 SoC Processor 1.6GHz (up to 2.24GHz)
2. 1* DDR3L-1600MHz SO-DIMM up to 8GB
3. 2* Realtek RTL8119I GbE
4. 1* COM, 1* SIM card holder, 1* half size Mini PCIe slot (for mini-PCIe WiFi module)
5. 2* HDMI, 1* DP, support Triple Independent Displays
6. 12V DC-in, DC12V_40W Adapter
Compact Legacy
New Model: BFTADN1-N97-N
Intel® Braswell N3160 SoC processor, DDR3L up to 8GB, 2* HDMI, 1*DP, 12V DC-in
Features
1. Intel® Braswell N3160 SoC Processor 1.6GHz (up to 2.24GHz)
2. 1* DDR3L-1600MHz SO-DIMM up to 8GB
3. 2* Realtek RTL8119I GbE
4. 1* COM, 1* SIM card holder, 1* 2.5SATA Bay, 1* half size Mini PCIe slot (for mini-PCIe WiFi module)
5. 2* HDMI, 1* DP, support Triple Independent Displays
6. 12V DC-in, DC12V_40W Adapter
SoC-N3160
Intel® Braswell N3160 SoC processor, DDR3L up to 8GB, 2* HDMI, 1*DP, 12V DC-in
Features
1. Intel® Braswell N3160 SoC Processor 1.6GHz (up to 2.24GHz)
2. Support 1* DDR3L-1600MHz SO-DIMM up to 8GB
3. 2* Realtek RTL8119I GbE
4. 1* COM, 1* SIM card holder, 1* half size Mini PCIe slot (for mini-PCIe WiFi module)
5. 2* HDMI, 1* DP, support Triple Independent Displays
6. 12V DC-in, DC12V_40W Adapter
SoC-J3455
Intel® Apollo Lake J3455 SoC Processor, PICO form factor Fanless system
Features
1. Intel® Apollo Lake J3455 SoC Processor
2. 1* DDR3L 1866MHz SO-DIMM Up to 8 GB
3. 1* HDMI, 2* USB 3.0, 2* USB 2.0, 1* RJ45, 1* Micro SIM card slot
4. 1* Mini PCIe (full size), 1* M.2 M-key (2242)
5. 12V DC-in
Intel Atom® Processor
Embedded Box PC with Intel® Celeron® Processor N3350/N4200 Features
- Powered by Intel® Celeron® Processor N3350/N4200 (Formerly Apollo Lake, TDP 6W)
- Storage Options: 1 x M.2 M-key (2242, SATA interface), 1 x 2.5" SATA device
- Expansion Slot: 1 x Full-size Mini PCIe (for WiFi)
- Comprehensive I/O: 2 x USB 3.0, 1 x HDMI, 1 x GbE, 1 x Micro SIM Card
- Designed for easy Wall Mount, VESA Mount and Din Rail installation
Intel® Mobile SoC Processor
Intel® Comet Lake-U 5205U SoC Processor, support 4K resolution
Features
1. Intel® Comet Lake-U 5205U SoC Processor
2. 2* SO-DIMM DDR4-2400MHz up to 64GB
3. 2* USB2.0, 4* USB3.1, 1* HDMI, 1* DP, 2* RJ45
4. Support Max. 4K display resolution
5. Adapter DC12V_90W
6. Support TPM2.0
Socket-Q470E
New Model: HBJC150I225-Q670B 1U Rackmount System featuring Intel® 6th/7th Gen LGA1151 Socket Processor with Triple Display Support Features
- Processor: Supports Intel® 6th/7th Gen LGA1151 Socket Processors (up to 65W TDP)
- Triple Display Support: 1 x 4K DisplayPort, 2 x 4K HDMI
- Dual High-Speed Networking: 1 x Intel® i219-LM GbE and 1 x Intel® i226-V 2.5GbE
- Comprehensive I/O Ports: 4 x USB 3.2 Gen2, 2 x USB 3.2, 2 x USB 2.0, 2 x COM Ports
- Power Supply: Compact and reliable 1U FLEX 250W
Intel® Mobile SoC Processor
Aluminum Die-Cast Panel PC series, 15.0" TFT Fanless Touch Panel Computer with Intel® Tiger Lake 6305E 1.8GHz Dual Cores Processor
Features
1. 15.0”350 nits TFT LCD with LED backlight
2. 10-points Multi Capacitive Touch
3. Support Open frameless design
4. A true Flat, easy-to-clean front surface with edge-to-edge design
5. Aluminum Die-Cast Panel PC series, support for easy HDD and DARM installation
6. Support Cable less design
7. 12-36V DC-input Support, with Electrical Over Stress(EOS), OVP design
8. VESA Support 100x100mm
Intel® Mobile SoC Processor
Aluminum Die-Cast Panel PC, 15.0" TFT Fanless Touch Panel Computer with Intel® i5-1135G7 Processor Features
- 15.0" 350-nit TFT LCD with LED Backlight
- 10-Point Multi-Capacitive Touch Support
- Powered by Intel® i5-1135G7: 11th Gen Core™ (Tiger Lake-U) with 15W TDP.
- Bright Display: 15.0" 350 nits TFT LCD with LED backlight and 10-point multi capacitive touch.
- Supports Open Frameless Design for Easy Installation Across Various Applications
- Storage & Expansion: 1 SATA III, M.2 M-key, M.2 E-key, M.2 B-key, and nano SIM card slot.
- Wide Power Input: 12-36V DC input with EOS and OVP protection.
- Fanless and VESA Support: Fanless design with VESA 100x100mm mount compatibility.
SoC-J3455
Intel® Apollo Lake SoC processor, DDR3L up to 8GB, 1* HDMI, 9~36V DC-in
Featrues
1. Intel® Apollo Lake SoC Processor (Default: J3455)
2. Support 1 * SO-DIMM DDR3L-1866MHz up to 8GB
3. 6* USB, 2* LAN, 1* HDMI, 1* MIC, 1* Line out
4. All-aluminum body, produced by casting process
5. DC12V_90W Adapter
Compact Legacy
New Model: HBFDF835-5205-V
Intel® Kaby Lake-U Processor, Support two DDR4 2133MHz up to 32GB
Features
1. Intel® Kaby Lake-U Processor
2. Support 2* SO-DIMM DDR4-2133, up to 32GB memory
3. 1* Full size Mini-PCIe shared with mSATA, 1* Half size Mini-PCIe, 1* mSATA shared with Full size Mini-PCIe
4. 4* USB2.0, 4* USB3.0, 1* HDMI, 1* DP, 2* RJ45, 4* COM (Max), 1* MIC-in, 2* Line-out
5. DC-12V_60W Adapter
Intel® Desktop Socket Processor
Mini-ITX Motherboard powered by Intel® LGA1200 10th Gen Socket Processor with ATX power support Features
- Powered by Intel® LGA1200 10th Gen Socket Processor (Comet Lake-S, TDP 65W) with Q470 Chipset
- Triple Display Support: Supports 2 x HDMI, 1 x eDP, and 1 x DP with 4K resolution
- Dual Ethernet: Includes 1 x Intel GbE and 1 x Intel 2.5GbE for fast and reliable networking
- Storage: Features 4 x SATA III with RAID 0, 1, 5, 10 support and 1 x M.2 M-key (SATA/PCIe x4)
- Expansion Options: Provides 1 x M.2 E-key and 1 x PCIe x16 Slot
- Comprehensive I/O: Includes 4 x USB 3.2 Gen2, 2 x USB 3.2 Gen1, 2 x USB 2.0, and 2 x RS232/422/485
- Optional Onboard TPM 2.0 Support for enhanced security
Intel Atom® Processor
Fanless Compact Box PC with Intel® Braswell N3160 Features
- Powered by Intel® Celeron® N3160 Processor (Braswell, TDP 6W)
- Dual Display: Supports HDMI and DP outputs
- Expandable Connectivity: 1 x SATA, 1 x M.2 (M-key 2242), 1 x mini-PCIe slot for add-ons
- Comprehensive I/O: 6 x USB, 5 x COM, HDMI, DP, dual LAN, MIC, and Line-Out
- Wide Power Range: DC 9~36V input
- Versatile Mounting: Fanless compact design supports Wall Mount and DIN rail installation
- Optional TPM 2.0 support
Daughter Card
M.2 B-key 4* COM (RS232/422/485) card
Features
1. FINTEK F81504U
2. FINTEK F81439AN
3. Support 5V/12V TTL
4. M.2 B-key 3042 size
Intel Atom® Processor
Intel® Bay Trail N2930 SoC QC Processor, 2* HDMI, 1* COM, 1* USB3.0, 3* USB2.0, 2* Realtek® GbE, 1* half size Mini PCIe, 1* DDR3L, Support Wide Voltage 9~24V DC-in
Features
1. Intel® Bay Trail N2930 SoC processor
2. 1* DDR3L 1333MHz Single Channel up to 8GB
3. Realtek ALC887 HD Audio CODEC, 2-CH
4. 2 * HDMI
5. 1 * SATAII
6. 1 * USB3.0, 3 * USB2.0, 1 * COM Port, 2 * Realtek® RTL8119I GbE
7. 9~24V Wide range DC-in PWR jack
8. NUC Form Factor (101mm x 101mm)
Intel® Desktop Socket Processor
Fanless System with Intel® 8th/9th Gen CPU, H310 Chipset, 12–24V DC-in Support Features
- Powered by Intel® 8th/9th Gen LGA1151 Socket Processor (Coffee Lake, Max 35W)
- Dual Channel DDR4, up to 32GB
- Dual Networking: 1 x GbE, 1 x 2.5GbE for fast, reliable connections
- Versatile Display Options: 1 x HDMI (4K), 1 x VGA, and Optional eDP (4K) for flexible display setups
- Comprehensive I/O: 4 x RS232, 4 x USB 3.0
- Storage & Expansion: 1 x SATA III (6Gb/s), 1 x M.2 M-key, 1 x M.2 E-Key, and 1 x PCIe x4 slot
- Wide Voltage Power Input: 12–24V DC-in for industrial applications
AMD Processor
AMD RYZEN Embedded R-Series R1305G CPU, DDR4 up to 32GB
Features
1. AMD RYZEN R1305G 1.5GHz/DC Core Processor
2. 2* DDR4 2400MHz up to 32GB
3. 2* Realtek® RTL8111H GbE
4. 2* SATA III (6Gb/s), 1* M.2 M key (PCIe x2)
5. 3* DP(DP0 Co-lay eDP, DP1 Co-lay LVDS)
6. 2* RS232/422/485, 4* RS232, 2* USB3.2 (Gen1), 8* USB2.0
7. 1* M.2 B key support 4G/5G Module
8. 12~28V DC-in
9. MINI ITX Form Factor (170 *170 mm)
10. JLI1U-62 support TPM2.0 (option)
SoC-N6210
New Model: BFTADN1-N97-N or BFDADN1-N97-N
Intel® Elkhart Lake SoC Processor, DDR4 3200MHz up to 32GB
Features
1. Intel Elkhart Lake SoC Processor
2. 1* DDR4 3200MHz SO-DIMM up to 32GB
3. 1* HDMI, 2* USB3.1, 1* USB-C, 2* RJ45, 1* COM
4. Support 9~36V wide voltage input
5. DC12V_40W Adapter
New Model: BFTADN1-N97-N or BFDADN1-N97-N
New Model: BFTADN1-N97-N or BFDADN1-N97-N
Intel® Apollo Lake Processor, DDR3L SODIMM up to 8GB
Features
1. Intel® Apollo Lake Processor
2. Supports 1 * DDR3L-1866MHz SO-DIMM up to 8GB
3. 2 * USB2.0, 4* USB3.0, 2* DP, 2* RJ45, Micro SD slot, 1* RS232 (RJ45 Type)
4. DC 12V_60W Adapter
New Model: BFTADN1-N97-N or BFDADN1-N97-N
Performance Legacy
New Model: HBJC501I25-H610 Fanless embedded system with Intel® LGA1151 CPU supports triple display and DC-in 9~24V Features
- Powered by Intel® LGA1151 Socket 6th & 7th Generation Pentium, Core i3, i5, and i7 Processors (TDP 35W).
- Supports Dual DDR4 SODIMM Up to 32GB
- Dual GbE Ethernet Ports provide high-speed and reliable networking
- Triple Display Support: 1 x HDMI, 2 x DP, with 4K resolution capability
- Comprehensive I/O: 4 x USB 3.0, 2 x USB 2.0,6 x COM Ports
- Fanless black aluminum enclosure with support for wall mounting and DIN rail mounting
EOL
AiSEMI simple - Fast Body Temperature Measurement System
Features
1. Measurement at 0.5m in 1 second
2. 256-point Array Accurate Detection
3. Touch-Free Social Distance
4. Support Multi-lingual Voice Prompts
Others
AiSEMI multi - AI Thermal Imaging Multi-person Temperature Screening System
Features
1. AI Face Recognition and Tracking Technology
2. Infrared Thermal Imaging Technology
3. Support Advertisement Mode
4. Synchronous Temperature Screening for 8~10 People
5. Wide-ranging non-contact Temperature Screening
6. Abnormal Warning Function
7. HBJC921R3288-2H System is required
Access Control System
AiSEMI ONE LITE - Smart Temperature Screening and Digital Signage System
Features
1. World Premiere Smart Temperature Screening and Digital Signage System with VOx (Vanadium Oxide) Sensor Element
2. Temperature Screening at 1.5m in 0.6 second
3. Support High Temperature Warning
4. 10.1″ Display and Digital Signage System
5. Support Advertisement Mode
Access Control System
AiSEMI one vox - Smart Attendance and Temperature Screening System
Features
1. World Premiere Smart Attendance System and Temperature Screening System with VOx (Vanadium Oxide) Sensor Element
2. Fast Response, High Accuracy and Good Temperature Stability
3. On-Premise Network to Secure Personal Data
4. Efficient Attendance System
5. Face Recognition Access Control System
6. Support Multi-door (6 doors) Access Control Management
7. 10.1" Welcome Board and Signage
8. 10,000 Face Database and 100,000 Measurement Data Capacity
9. Support Multi-Factor Authentication
9 Support Multi-Factor Authentication
AMD Processor
AMD™ RYZEN™ Embedded V-Series V1605B CPU, DDR4 up to 32GB
Features
1. AMD™ RYZEN™ V1605B 2.0GHz/QC Core Processor
2. 2* DDR4 2400MHz up to 32GB
3. 2* Realtek® RTL8111H GbE
4. 2* SATA III (6Gb/s), 1* M.2 M key (PCIe x2)
5. 4* DP(DP0 Co-lay eDP, DP1 Co-lay LVDS)
6. 2* RS232/422/485, 4* RS232, 2* USB3.2 (Gen1), 8* USB2.0
7. 1* M.2 E key, 1* M.2 B key support 4G/5G Module
8. 12~28V DC-in
9. MINI ITX Form Factor (170 *170 mm)
10. JLI1U-22 support TPM2.0 (option)
Others SBC Legacy
Ethernet Ports for JNF9HG-2930
Features
1. PCIe x 1, 2.0 (5GT/s) rate
2. Chipset: Asmedia 1806 PCIe switch, Intel i211AT GbE
3. Feature: 4 * Intel GbE, support Wake on LAN S1/S3/S4/S5 mode
4. Application: VPN, UTM Network bandwidth controller, Mail spam
5. Dimension: 170 * 81.9 mm
SoC-N6210
New Model: JPIC-ADN1
PICO-ITX size Motherboard with Intel® Elkhart Lake Processor, support DDR4 up to 32GB, 1* M.2 (M-key), 1* M.2 (E-key), support dual display (1* HDMI and 1*eDP)
Features
1. Intel® Elkhart Lake SoC Processor
2. 1* DDR4 3200MHz SO-DIMM up to 32GB
3. 1* HDMI, 1* eDP
4. 1* COM, 2* USB3.1 (Gen.2) Type-A, 2* USB2.0, 1* USB3.1 (Gen.2) Type-C
5. 1* M.2 M-key 2242 (SATA/PCIe Gen.3 x2 interface) support NVME, 1* M.2 E-key 2230 (USB2.0/PCIe Gen.3 x1 interface)
6. Onboard 64GB eMMC option (MP01-62104)
7. 12V DC-in
New Model: JPIC-ADN1
Intel® Mobile SoC Processor
5.5" Motherboard with Intel® Gen 11 SoC Processor, Triple Display Support, and 12-36V Wide Range DC Input Features
- Powered by Intel® Core i5-1135G7 SoC Processor (Tiger Lake)
- Enhanced Memory Capacity: 2 x DDR4 3200MHz SO-DIMM up to 64GB
- Dual High-Speed Networking: 1 x Intel® i219-LM GbE and 1 x Intel® i225-V 2.5GbE
- Triple Display Support: HDMI 2.0, eDP, and LVDS for versatile display options
- Comprehensive I/O Ports: 2 RS232, 2 RS232/422/485, 2 USB3.2 Gen2, 5 USB2.0, and 1 Mixture Header
- Storage & Expansion: 1 x SATA III, 1 x M.2 M-Key, 1 x M.2 E-Key, 1 x M.2 B-Key
- Wide Power Input: 12~36V DC-in for industrial-grade applications
Intel® Mobile SoC Processor
5.5" Motherboard with Intel® Gen 11 SoC Processor, Triple Display Support, and 12-36V Wide Range DC Input Features
- Powered by Intel® 6305E SoC Processor (Tiger Lake, TDP 15W)
- Enhanced Memory Capacity: 2 x DDR4 3200MHz SO-DIMM up to 64GB
- Dual High-Speed Networking: 1 x Intel® i219-LM GbE and 1 x Intel® i225-V 2.5GbE
- Triple Display Support: HDMI 2.0, eDP, and LVDS for versatile display options
- Comprehensive I/O Ports: 2 RS232, 2 RS232/422/485, 2 USB3.2 Gen2, 5 USB2.0, and 1 Mixture Header
- Storage & Expansion: 1 x SATA III, 1 x M.2 M-Key, 1 x M.2 E-Key, 1 x M.2 B-Key
- Wide Power Input: 12~36V DC-in for industrial-grade applications
Intel® Mobile SoC Processor
Intel® Whiskey Lake-U CPU, DDR4 up to 64GB, 1* GbE, 1* 2.5GbE, support Wide Voltage 12~36V DC-in
Features
1. Intel® 8th Gen Whiskey Lake-U 1.6GHz/QC Core MCP Processor
2. 2* DDR4 2400MHz, up to 64GB
3. 1* Intel®I219LM GbE, 1* Intel® i225-V 2.5GbE
4. 1* SATA III (6Gb/s), 1* M.2 (M-key), 1* M.2 E-key Support CNVi, 1* M.2 B-key Support 4G/5G Module
5. 1* HDMI/DP + 1* eDP
6. 2* RS232/422/485, 2* USB3.0, 3* USB2.0
7. 12~36V DC in
8. 3.5” Form Factor (146 *102 mm)
9. JLF0DV-42 support TPM2.0 (option)