11th Tiger Lake Board

Intel® 11th Tiger Lake-UP3 Core SoC Processor, DDR4 up to 32GB, 1* GbE, 1* RJ11, support triple display Features 1. Intel® 11th Tiger Lake-UP3 SoC Processor (6305E 1.8GHz/DC) 2. 1* DDR4 3200MHz SO-DIMM up to 32GB 3. 1* HDMI, 1* LVDS/eDP, 1* eDP 4. 1* Realtek® RTL8111H GbE 5. 4* USB3.2 (Gen.1), 7* USB2.0, 3* RS232, 1* RJ11 6. 1* M.2 M-key (2242/2280, PCIe x4), 1* M.2 E-key (2230), 1* SATAIII 7. Onboard TPM2.0 (Option) 8. 12-24V DC-in  Certification

Intel® 11th Tiger Lake-UP3 Core SoC Processor, DDR4 up to 32GB, 2* GbE, support triple display Features 1. Intel® 11th Tiger Lake-UP3 SoC Processor (Default: 6305E 1.8GHz/DC) 2. 1* DDR4 3200MHz SO-DIMM up to 32GB 3. 1* HDMI, 1* LVDS/eDP, 1* eDP 4. 2* Realtek® RTL8111H GbE 5. 4* USB3.2 (Gen.1), 5* USB2.0, 9* COM (COM4/5 Support RS232/422/485) 6. 1* M.2 M-key (2242/2280, PCIe x4), 1* M.2 E-key (2230), 1* SATAIII 7. Onboard TPM2.0 (Option) 8. 12-24V DC-in  Certification

SoC-1135G7

LE30 Series

Intel® 11th Gen. Tiger Lake-UP3 SoC Processors, M.2 PCIe 4.0 x4 support NVMe, 4* USB3.2, 2* 2.5GbE Features 1. Intel® Tiger Lake-UP3 SoC Processor (TDP 12~28W) 2. 1* DDR4-3200MHz SO-DIMM up to 32GB 3. 2* Intel i225-V 2.5GbE 4. 1* VGA,1* HDMI2.0b, 1* eDP, 1* 24-bits LVDS 5. 2* RS232, 2* RS232/422/485, 2* USB3.2 (Gen2), 2* USB3.2 (Gen1), 2* USB2.0 6. 1* M.2 M-key (2242/2280, 1* M.2 E-key(2230), 1* M.2 B-key (3042/3052), 1* SATAIII (6Gb/s) 7. 2* Mixture Header (2* UART, 3* USB2.0, 1* LPC, 1* GPIO(8bit), 1* PCI-Ex1) 8. Onboard TPM 2.0 (option) 9. 12~24V DC-in  Certification

SoC-1135G7

JLZ0FV-90 Series

Intel® Gen. 11 Tiger Lake-UP3 SoC Processor, 1135G7 chipset, M.2 PCIe 4.0 x4 supports NVMe, 4* COM, 2* USB3.2 (Gen2), 1* GbE, 1* 2.5GbE Features 1. Intel® Tiger Lake-UP3 SoC Processor (TDP 12~28W) 2. 2* DDR4 3200MHz SO-DIMM up to 64GB 3. 1* Intel i219-LM GbE, 1* Intel i225-V 2.5GbE 4. 1* HDMI2.0, 1* eDP, 1* LVDS 5. 2* RS232, 2* RS232/422/485, 2* USB3.2 (2代), 5* USB2.0 6. 1* SATAIII, 1* SIM card slot 7. 1* M.2 M-key (2242/2280), PCIe 4.0 x4 interface supports NVMe 8. 1* M.2 E-key (2230), USB2.0/PCIe x1 interface supports CNVi 9. 1* M.2 B-key (3042/3052/6570), USB3.2/USB2.0 /PCIe x1 interface supports 4/5G Module 10. 1* Mixture Header (2* UART, 2* USB2.0, 1* LPC, 1* GPIO) 11. Onboard TPM 2.0 (JLZ0FV-92 option) 12. 12~36V DC-in  Certification

SoC-6305E

JLZ0FV-00 Series

Intel® Gen. 11 Tiger Lake-UP3 SoC Processor, 6305E chipset, M.2 PCIe 4.0 x4 supports NVMe, 4* COM, 2* USB3.2 (Gen2), 1* GbE, 1* 2.5GbE Features 1. Intel® Tiger Lake-UP3 SoC Processor (TDP 15W) 2. 2* DDR4 3200MHz SO-DIMM up to 64GB 3. 1* Intel i219-LM GbE, 1* Intel i225-V 2.5GbE 4. 1* HDMI2.0, 1* eDP, 1* LVDS 5. 2* RS232, 2* RS232/422/485, 2* USB3.2 (Gen2), 5* USB2.0 6. 1* SATAIII, 1* SIM card slot 7. 1* M.2 M-key (2242/2280), PCIe 4.0 x4 interface supports NVMe 8. 1* M.2 E-key (2230), USB2.0/PCIe x1 interface supports CNVi 9. 1* M.2 B-key (3042/3052/6570), USB3.2/USB2.0 /PCIe x1 interface supports 4/5G Module 10. 1* Mixture Header (2* UART, 2* USB2.0, 1* LPC, 1* GPIO) 11. Onboard TPM 2.0 (JLZ0FV-02 option) 12. 12~36V DC-in  Certification

SoC-1145G7E

MF05V Series

11th Gen. Intel® Tiger Lake-UP3 SoC Processors, support up to 4* independent 4K HDR Displays or 1* 8K SDR Displays, M.2 PCIE 4.0 x4 supports NVME, 4* COM, 4* USB3.2(Gen2), 1* 2.5GbE, 1* GbE Features 1. Intel® Tiger Lake-UP3 SoC Processor (TDP 12~28W) 2. 2* DDR4-3200MHz SO-DIMM up to 64GB 3. 1* Intel® i219-LM 1.0GbE, 1* Intel i225-V 2.5GbE 4. 2* HDMI, 2* DisplayPort, 1* eDP, 1* LVDS 5. 4* COM (COM1/COM2 support RS232/422/485), 4* USB3.2 (Gen.2), 4* USB2.0 6. 1* M.2 M-key 2242/2280, PCIe 4.0 x4 interface support NVME 7. 1* M.2 E-key 2230, USB2.0/PCIe x1 interface support CNVi 8. 1* SATAIII (6Gb/s) 9. MF05V22 / MF05V92 : Onboard TPM 2.0 (option)  Certification

SoC-1145G7E

MU10 Series

11th Gen. Intel® Tiger Lake-UP3 SoC Processors, support up to 4* independent 4K HDR or 1* 8K Displays, M.2 PCIe 4.0 x4 supports NVMe, 1* RS232, 2* USB3.2 (Gen. 2) Type-A, 1* USB3.2 (Gen. 2) Type-C, 2* USB3.2 (Gen. 2) Type-C support DP1.4 display, 1* 2.5GbE, 1* GbE Features 1. Intel® Tiger Lake-UP3 SoC Processor (TDP 15W) 2. 2* DDR4 3200MHz SO-DIMM up to 64GB 3. 1* Intel i219-LM 1.0GbE, 1* Intel i225V 2.5GbE 4. 2* HDMI, 2* DP1.4 (from USB3.2 (Gen.2) Type-C) 5. 1* RS232, 2* USB3.2 (Gen.2) Type-A, 1* USB3.2 (Gen.2) Type-C supports USB only, 2* USB3.2 (Gen. 2) Type-C support DP1.4 display 6. 1* M.2 M-key 2242/2280 (PCIe4.0 x4/SATAIII interface) support NVMe, 1* SATAIII 7. 1* M.2 E-key 2230 (USB2.0/PCIe x1 interface) support CNVi 8. 1* M.2 B-key 3042/3052 (USB3.1/USB2.0/PCIe 4.0x1 interface)  Certification

SoC-1145G7E

MF10 Series

11th Gen. Intel® Tiger Lake-UP3 SoC Processors, support up to 4* independent 4K HDR Displays, M.2 PCIe 4.0 x4 supports NVMe, 1* COM, 3* USB3.2 (Gen2), 2* USB Type-C, 1* 2.5GbE, 1* GbE Features 1. Intel® Tiger Lake-UP3 SoC Processor (TDP 12~28W) 2. 2* DDR4-3200MHz SO-DIMM up to 64GB 3. 1* Intel i219-LM 1.0GbE, 1* Intel i225V 2.5GbE 4. 2* HDMI, 2* DP1.4 (from Type-C), 1* eDP 5. 1* RS232, 3* USB3.2 (Gen.2), 5* USB2.0, 2* USB 3.2 (Gen. 2) Type-C support DP1.4 display output 6. 1* M.2 M-key 2242/2280, PCIe 4.0 x4/SATA interface support NVMe, 1* SATAIII (6Gb/s) 7. 1* M.2 E-key 2230, USB2.0/PCIe x1 interface support CNVi, 1* M.2 B-Key 3042/3052, USB3.1/USB2.0/PCIe x1 interface 8. MF10-22 / MF10-92: Onboard TPM 2.0 (option)  Certification