SoC-J6412
3.5" Motherboard with Intel® SoC Processor, Dual 2.5GbE LAN, Triple Display Support, 12-24V DC-in
Features
● Powered by Intel® J6412 SoC Processor (Elkhart Lake)
● Dual DDR4 3200MHz SO-DIMM: Maximize multitasking performance
● Dual 2.5GbE LAN: High-speed networking connection
● Triple Display Support: 2 x HDMI 2.0b, 1 x eDP/ LVDS for versatile multi-display setups
● Comprehensive I/O: 2 x COM, 3 x USB 3.1 Gen 2, 5 x USB 2.0 ports
● Flexible Expansion: 1 x M.2 E-key 2230, 1 x M.2 B-key 3042 w/SIM slot
● Storage Options: 1 x SATA III, Optional 64GB eMMC, 1 x M.2 M-key 2242/2280
● Reliable DC Input: 12V–24V range, ideal for industrial environments
SoC-155H
Preliminary
Slim Mini-ITX with Intel® Core™ Ultra 7 Processor Intel® SoC
Features
● Onboard Intel® Core™ Ultra 7 Processor 155H (Formerly Meteor Lake, TDP 15W)
● 2 x DDR5 5600MHz, Dual Channel SO-DIMM, up to 96GB
● 4 x HDMI 2.1 (Max Resolution: 4096 x 2160@60Hz), Support 4 Display
● 1 x M-Key 2242 (PCIe 4.0 x 4) Support NVMe
● 1 x M-Key 2242/2280 (PCIe 4.0 x4 + SATA3) Support NVMe
● 1 x B-Key 3042/3052 (PCIe Gen.3 x1/USB3.2 Gen.2/USB2.0 interface) support 4G/5G Module
● 1 x E-Key 2230 (USB 2.0/PCIe x1) Support CNVi
● DC-in 12~36V
SoC-N97
Pico-ITX Motherboard with Intel® N-series Processors, Dual Display Support, and Nano SIM Slot
Features
● Powered by Low Power Intel® N-series SoC Processors (formerly Alder Lake)
● High-Performance Memory: Supports DDR5 SO-DIMM
● Dual Display Support: 1 x HDMI for 4K display and 1 x LVDS Co-lay with eDP
● Storage & Expansion: 1 x SATA3, 1 x M.2 E-Key, 1 x B+M Key paired with 1 x SIM for 4G/5G
● Comprehensive I/O: 2 x USB 3.2 Gen2, 4 x USB 2.0, 2 x RS-232/422/485
● Ultra Compact Pico-ITX: 100 x 72mm motherboard
● Enhanced Security: Supports Intel fTPM
SoC-155U
Preliminary
Features
1. Onboard Intel® 14th Gen Core™ Ultra 7 155U (Formerly Meteor Lake-U, TDP 15W)
2. 2 x DDR5 5600MHz Dual CH SO-DIMM up to 96GB
SoC-1335UE
3.5" SBC with Intel® 13th Generation Core™ i5-1335UE
Features
1. Onboard Intel® 13th Gen Core™ i5-1335UE (Formerly Raptor Lake-P, TDP 15W)
2. 4 x Intel 2.5GbE LAN
3. Optional Dual 802.3at PoE (Max. Output 40W)
SoC-N97
Mini-ITX with Intel® Processor N-series Processors (formerly Alder Lake-N)
Features
1. 1 x DDR5 SODIMM Slot, up to 32GB
2. Three Independent Display: 1 x HDMI 2.0b, 1 x VGA, 1 x LVDS/eDP
3. 2 x 1GbE
4. 2 x USB3.2 Gen1, 7 x USB2.0
5. 1 x M.2 2242/2280 M-key, 1 x M.2 2230 E-key, 1 x M.2 3042/3052 B-key
6. 1 x PCI, 1 x SATAIII
7. ATX Power
SoC-1335U
3.5” SubCompact Board with 13th Generation Intel® Core™ i7/i5/i3 Processor SoC
Features
1. 2 x DDR5 SODIMM Slot, up to 64GB
2. 2 x 2.5GbE
3. 1 x SATA3, 1 x M.2 M-key (2242/2280)
4. 1 x M.2 E-key(2230), 1 x M.2 B-key(3042/3052)
5. 3 x USB 3.2 Gen2, 4 x USB2.0, 1 x USB Type C
6. 2 x RS232/422/485, 2 x RS232
7. 2 x HDMI, 2 x DP, 1 x Type C DP, 1 x LVDS
8. DC Input 12~36V
SoC-N97
NUC with Intel® Processor N-series Processors (formerly Alder Lake N)
Features
1. 1 x DDR5 SODIMM Slot, up to 32GB
2. 1 x HDMI 2.0b, 1 x DP1.4, 2 x Type C DP
3. 2 x 2.5GbE
4. 4 x USB 3.2 Gen2 (2 x Type-A, 2 x Type-C DP ALT Mode), 3 x USB2
5. 1 x RS232/422/485
6. 1 x M.2 2260/2280 M-key, 1 x M.2 2230 E-key
7. DC Input 12~19V
SoC-J6412
Embedded board with Intel® Celeron® Processor J6412 (formerly Elkhart Lake)
Features
1. 1 x DDR4 SODIMM Slot, up to 32GB
2. 1 x HDMI 2.0, 1 x LVDS or eDP
3. 2 x 2.5GbE
4. 2x USB 3.2 Gen1, 3 x USB2.0
5. 1x RS232/422/485, 1 x RS232
6. 1 x M.2 M-key 2280, 1 x M.2 E-key 2230
SoC-J6412
Thin Mini-ITX with Intel® Celeron® Processor J6412 (formerly Elkhart Lake)
Features
1. 1 x DDR4 SODIMM Slot, up to 32GB
2. 1 x HDMI 2.0b, 1 x LVDS, 1 x eDP
3. 2 x 2.5GbE
4. 4 x USB 3.2 Gen1, 5 x USB2.0
5. 2 x RS485, 4 x RS232
6. 1 x M.2 2242/2280 M-key, 1 x M.2 2230 E-key
7. 1 x PCI-E3.0 x4
SoC-N6210
PICO-ITX with Intel® Atom® x6000E series, Celeron® N series (formerly Elkhart Lake)
Features
1. LPDDR4x 4GB onboard memory
2. 1 x HDMI 2.0b, 1 x LVDS/eDP
3. 2 x GbE
4. 1 x USB 3.1 Gen2, 1 x USB3.1 Gen2 Type-C, 3 x USB2.0
5. 1 x M.2 B-key (SATA/PCIe 3.0x1/USB3.1 interface) support NVME
6. 1 x M.2 E-key (USB2.0/PCIe 3.0x1 interface)
7. 2 x COM(RS232/422/485), 1 x GPIO
8. Support RVP, OCP, and OVP design
SoC-N97
Mini-ITX with Intel® Processor N-series Processors (formerly Alder Lake-N)
Features
1. 1 x DDR5 SODIMM Slot, up to 32GB
2. 2 x HDMI 2.0b, 1 x Type-C DP, 1 x LVDS/eDP
3. 2 x 2.5GbE
4. 1 x USB 3.2 Gen2, 1 x USB3.2 Gen2 Type-C, 6 x USB2.0
5. 1 x RS232/422/485, 5 x RS232
6. 1 x SATAIII, 1 x M.2 2242/2280 M-key, 1 x M.2 2230 E-key, 1 x M.2 3042/3052 B-key
7. DC Input 12~28V
8. Support RVP, OCP, and OVP design
SoC-Others
PCIe x8 Slot / 2* HAILO-8 AI processor
Features
1. 2* Hailo-8™ AI processor
2. Enabling real-time, low latency and high-efficiency AI inferencing on edge devices
3. Powered by 2* 26 TOPS Hailo-8™ AI Processor with best-inclass power efficiency
4. Precautions : ADPIE8AIHLB cannot be sold separately, it must be used together with the MI3H motherboard.
SoC-Others
PCIe x8 Slot / 2* HAILO-8 AI Processor
Features
1. 2* Hailo-8™ AI Processor
2. Enabling real-time, low latency and high-efficiency AI inferencing on edge devices
3. Powered by 2* 26 TOPS Hailo-8™ AI Processor with best-inclass power efficiency
4. Precautions : ADPIE8AIHLA cannot be sold separately, it must be used together with the MA3H motherboard.
Socket-H110
Intel® Sky Lake-S H110 chipset, supports LGA1151 CPU, On board DDR4 up to 16GB
Features
1. Intel® LGA1151 Socket supports 6/7th Gen Core Processor
2. Intel® Sky Lake-S H110
3. On board 8GB DDR4 Dram (Max 16GB)
4. 1* Intel® i225-V 2.5GbE, 1* Intel® i219-LM GbE
5. 1* M.2 M-Key (2242/2280,SATAIII)
6. 4* SATA III (6Gb/s,SATA4 Co-lay M Key)
7. 1* DVI-D, 1* HDMI, Output
8. 2* RS232/422/485, 4* RS232, 4* USB3.0, 6* USB2.0
9. 16bit GPIO
10. Support Onboard TPM2.0 (option)
11. 24 + 4 Pin ATX Power Input
12. ATX Form Factor (305x220mm)
SoC-N97
3.5" SubCompact Board with Intel® Processor N-series Processors (formerly Alder Lake N)
Features
1. 1 x DDR5 4800MHz SO-DIMM up to 32GB
2. 2 x Intel i225V 2.5GbE
3. 2 x HDMI 2.0b, 1 x eDP (co-layout LVDS), 1 x LVDS w/Inverter
4. 1 x SATAIII (6Gb/s), 6 x COM
5. 1 x USB3.2 (Gen.2) Type-A, 8 x USB2.0, 1 x USB Type-C (ALT mode)
6. 1 x M.2 M-key(2280) support NVMe, 1 x M.2 E-key(2230) support CNVi
7. Support 12~28V DC-in
8. Support RVP, OCP, and OVP design
Socket-B760
305x220mm size with 14th/13th/12th Intel® Core™ i9/i7/ i5 /i3, Celeron & Pentium® LGA1700 Socket Processor, DDR5 up to 96GB, support 3 display
Features
1. Intel® 14th/13th/12th LGA1700 Socket Processor (Max.125W TDP)
2. Intel® Alder Lake-S B760 Chip
3. 2* DDR5 4800MHz UDIMM up to 96GB
4. 1* VGA, 1* HDMI, 1* DP, 1* LVDS/EDP(Option)
5. 1* 2.5GbE, 1* GbE
6. 6* COM, 6* USB3.2 (Gen.1), 6* USB2.0, 2* USB2.0 Type-A (Vertical)
7. 2* M.2 M-key (2280, NVMe, PCI-Ex2/PCI-Ex4 Interface), 1* M.2 E-key (2230, CNVi/PCI-Ex1 Interface)
8. 1* PCI-Ex16 (Gen.4), 2* PCI-Ex4 (Gen.3), 4* PCI
9. Onboard TPM2.0 (Option)
10. ATX Power
Socket-H610E
305x220mm size with 14th/13th/12th Intel® Core™ i9/i7/ i5 /i3, Celeron & Pentium® LGA1700 Socket Processor, DDR5 up to 96GB, support 3 display
Features
1. Intel® 14th/13th/12th LGA1700 Socket Processor (Max.125W TDP)
2. Intel® Alder Lake-S H610/H610E Chip
3. 2* DDR5 4800MHz UDIMM up to 96GB
4. 1* VGA, 1* HDMI, 1* DP, 1* LVDS/EDP(Option)
5. 1* 2.5GbE, 1* GbE
6. 6* COM, 4* USB3.2 (Gen.1), 6* USB2.0, 2* USB2.0 Type-A (Vertical)
7. 1* M.2 M-key (2280, NVMe, PCI-Ex2 Interface), 1* M.2 E-key (2230, CNVi Interface)
8. 1* PCI-Ex16 (Gen.4), 2* PCI-Ex4 (Gen.3), 4* PCI
9. Onboard TPM2.0(Option)
10. ATX Power
SoC-J6412
Thin Mini-ITX with Intel® Celeron® Processor J6412 (formerly Elkhart Lake)
Features
1. Intel® Elkhart lake J6412 SoC Processor (2.0GHz/QC)
2. 1* DDR4 3200MHz SO-DIMM up to 32GB
3. 6* 2.5 GbE (LAN3/4/5/6 Support PoE, 802.3af/at compliance)
4. 2* USB3.2 (Gen.1), 4* USB2.0
5. 4* COM (COM1: RS232 for RJ45, COM2: RS232/422/485, COM3/4: RS232)
6. 1* M.2 M-key (2242 SATA interface), 1* SATAIII
7. Onboard TPM2.0 (Option)
8. On board 64GB eMMC (Optional)
9. 12V DC-in12V DC-in
SoC-6305E
Intel® 11th Tiger Lake-UP3 Core SoC Processor, DDR4 up to 32GB, 1* GbE, 1* RJ11, support triple display
Features
1. Intel® 11th Tiger Lake-UP3 SoC Processor (6305E 1.8GHz/DC)
2. 1* DDR4 3200MHz SO-DIMM up to 32GB
3. 1* HDMI, 1* LVDS/eDP, 1* eDP
4. 1* Realtek® RTL8111H GbE
5. 4* USB3.2 (Gen.1), 7* USB2.0, 3* RS232, 1* RJ11
6. 1* M.2 M-key (2242/2280, PCIe x4), 1* M.2 E-key (2230), 1* SATAIII
7. Onboard TPM2.0 (Option)
8. 12-24V DC-in
SoC-6305E
Intel® 11th Tiger Lake-UP3 Core SoC Processor, DDR4 up to 32GB, 2* GbE, support triple display
Features
1. Intel® 11th Tiger Lake-UP3 SoC Processor (Default: 6305E 1.8GHz/DC)
2. 1* DDR4 3200MHz SO-DIMM up to 32GB
3. 1* HDMI, 1* LVDS/eDP, 1* eDP
4. 2* Realtek® RTL8111H GbE
5. 4* USB3.2 (Gen.1), 5* USB2.0, 9* COM (COM4/5 Support RS232/422/485)
6. 1* M.2 M-key (2242/2280, PCIe x4), 1* M.2 E-key (2230), 1* SATAIII
7. Onboard TPM2.0 (Option)
8. 12-24V DC-in
Socket-H610
Intel® 14/13/12th Core i9/i7/ i5 /i3, Celeron & Pentium® LGA1700 Socket Processor, DDR5 up to 96GB, support 3 display
Features
1. Intel® 14/13/12th LGA1700 Socket Processor (Max.65W TDP)
2. Intel® Alder Lake-S H610 chipset
3. 2* DDR5 5600MHz UDIMM up to 96GB
4. 2* HDMI, 1* VGA
5. 2* REALTEK® RTL8111H GbE
6. 4* USB3.2 (Gen.1), 8* USB2.0, 10* COM(RS232, COM1/2 Co-lay 422/485)
7. 1* M.2 M-key 2242/2280 (PCI-Ex4), 1* M.2 E-key 2230, 2* SATA3 (6Gb/s)
8. Onboard TPM2.0 (Option)
9. ATX Power
SoC-1335UE
Mini-ITX with 13th Generation Intel® Core™ i5 Processors (formerly Raptor Lake)
Features
1. 13th Generation Intel® Core™ i5 Processors SoC
2. 2 x DDR5 5200MHz SODIMM up to 64GB
3. 2 x 2.5GbE support vPro Essentials, 1 x SATAIII, GPIO, SMBUS, PS/2
4. 2 x USB 3.2 Gen2, 2 x USB3.2 Gen2 Type-C, 7 x USB2.0
5. 2 x RS232/422/485, 4 x RS232
6. 1 x M.2 2242/2280 M-key, 1 x M.2 2242 E-key, 1 x M.2 2230 E-key, 1 x M.2 3042/3052 B-key
7. 2 x HDMI, 2 x Type-C DP, 1 x LVDS/eDP
8. DC Input 12-24V
9. Support RVP, OCP, and OVP design
SoC-1135G7
Intel® 11th Gen. Tiger Lake-UP3 SoC Processors, M.2 PCIe 4.0 x4 support NVMe, 4* USB3.2, 2* 2.5GbE
Features
1. Intel® Tiger Lake-UP3 SoC Processor (TDP 12~28W)
2. 1* DDR4-3200MHz SO-DIMM up to 32GB
3. 2* Intel i225-V 2.5GbE
4. 1* VGA,1* HDMI2.0b, 1* eDP, 1* 24-bits LVDS
5. 2* RS232, 2* RS232/422/485, 2* USB3.2 (Gen2), 2* USB3.2 (Gen1), 2* USB2.0
6. 1* M.2 M-key (2242/2280, 1* M.2 E-key(2230), 1* M.2 B-key (3042/3052), 1* SATAIII (6Gb/s)
7. 2* Mixture Header (2* UART, 3* USB2.0, 1* LPC, 1* GPIO(8bit), 1* PCI-Ex1)
8. Onboard TPM 2.0 (option)
9. 12~24V DC-in
SoC-Others
M.2 E-key 2230 CAN Card
Features
1. FINTEK F81604N
2. FINTEK F81251S
3. Support 2* CAN
4. Support optical isolation ±58V
5. Industrial Temperature (-30°C to +80°C)
6. Compliant with EN61000-4-2 (ESD) Air-15kV, Contact-8kV
7. M.2 E key 2230 size
Socket-Q470E
Intel® Comet Lake-S Q470E chipset, support LGA1200 processor (Max. 65W), DDR4 up to 64GB
Features
1.Intel® LGA1200 Socket supports 10/11th Gen. Core Processor (Max 65W)
2. Intel® Comet Lake-S Q470E chipset
3. 2* DDR4 3200/2933MHz up to 64GB
4. 1* Intel®i226-V 2.5GbE, 1* Intel® i219-LM GbE
5. 1* M.2 M-Key (PCI-Ex4), 1* M.2 E-Key (CNVi/PCI-Ex1/USB2.0), 1* M.2 B-Key (PCI-Ex1/USB3.2/USB2.0)
6. 1* SATA III (6Gb/s), 1* PCI-E x16 slot
7. 1* DP (Co-lay VGA), 2* HDMI, 1* LVDS/eDP Output
8. 2* RS232/422/485, 4* RS232, 6* USB3.2 (Gen1), 4* USB2.0
9. Support Onboard TPM2.0 (LI21-Q470E2, option)
10. 12-28V DC-in
11. Thin Mini-ITX Form Factor (170x170mm)
Socket-H420E
Intel® Comet Lake-S H420E chipset, support LGA1200 processor (Max. 65W), DDR4 up to 64GB
Features
1.Intel® LGA1200 Socket supports 10/11th Gen. Core Processor (Max 65W)
2. Intel® Comet Lake-S H420E chipset
3. 2* DDR4 2933/2666MHz up to 64GB
4. 1* Intel®i226-V 2.5GbE, 1* Intel® i219-LM GbE
5. 1* M.2 M-Key (PCI-Ex4), 1* M.2 E-Key (USB2.0/PCI-Ex1), 1* M.2 B-Key(USB3.2/USB2.0)
6. 1* SATA III (6Gb/s), 1* PCI-E x16 slot
7. 1* DP (Co-lay VGA), 2* HDMI, 1* LVDS/eDP Output
8. 2* RS232/422/485, 4* RS232, 4* USB3.2 (Gen1), 4* USB2.0
9. Support Onboard TPM2.0 (LI21-H420E2, option)
10. 12-28V DC-in
11. Thin Mini-ITX Form Factor (170x170mm)
Socket-H610
170x170mm size with 14th/13th/12th Intel® Core™ i9/i7/ i5 /i3, Celeron, Pentium® LGA1700 Socket Processor, DDR4 up to 64GB, support 3 display, 2* RJ45, 6* COM
Features
1. Intel® 14th/13th/12th LGA1700 Socket Processor (Max. 65W TDP)
2. Intel® Alder Lake-S H610 Chipset
3. 2* DDR4 3200MHz UDIMM up to 64GB
4. 1* HDMI, 1* DP, 1* LVDS or eDP
5. 2* GbE
6. 2* USB3.2 (Gen.2), 2* USB3.2(Gen.1), 5* USB2.0, 6* COM
7. 1* M.2 M-key, 2242/2280(PCI-Ex4), 1* M.2 E-key, 2230, 2* SATAIII (6Gb/s)
8. Onboard TPM2.0 (Option)
9. 19V DC-in
Socket-H610
170x170mm size with 14/13/12th Intel® Core™ i9/i7/ i5 /i3, Celeron, Pentium® LGA1700 Socket Processor, DDR4 up to 64GB, support 3 display
Features
1. Intel® 14/13/12th LGA1700 Socket Processor (Max. 65W TDP)
2. Intel® Alder Lake-S H610 Chipset
3. 2* DDR4 3200MHz UDIMM up to 64GB
4. 1* HDMI, 1* DP, 1* LVDS or eDP
5. 1* GbE
6. 2* USB3.2 (Gen.2), 2* USB3.2(Gen.1), 5* USB2.0, 2* RS232
7. 1* M.2 M-key, 2242/2280(PCI-Ex4), 1* M.2 E-key, 2230, 2* SATAIII (6Gb/s)
8. Onboard TPM2.0 (Option)
9. 12~19V DC-in
Socket-Q670E
Intel Q670E Chipset support LGA 1700 socket for the Intel® 14th/13th/12th Gen (Raptor Lake-S/Alder Lake-S) i9/i7/i5/i3 processor, support DDR5-4800MHz up to 96GB, Support Max. 65W TDPs under 180A
Features
1. Intel® 14th/13th/12th LGA1700 Socket Processor (Max. 65W TDPs under 180A)
2. 2* DDR5 4800MHz SO-DIMM up to 96GB
3. 2* 10/100/1000/2500 Base-T Ethernet
4. 2* M.2 M-key support NVMe, 1* M.2 E-key supports CNVio, 1* M.2 B-key supports 4G/5G module, Single PCI Express x16(Gen.4) support Max. 70W
5. 2* HDMI, 2* DP, 1* LVDS/eDP support Quad displays
6. 2* RS232/422/485, 4* RS232, 4* USB3.2(Gen.2), 2* USB3.2 (Gen.1), 4* USB2.0
7. 2* SATAIII ports up to 6Gb/s support RAID 0/1
8. Support JetBIOS SW back up tool
9. Support onboard TPM2.0 option (Only MI215Q6702 Series)
10. Support wide voltage 12V~36V DC-in
11. Support RVP, OCP, and OVP design