LE30_IO
LE30_45D
LE30_Back_230705

LE30 Series

Intel® 11th Gen. Tiger Lake-UP3 SoC Processors, M.2 PCIe 4.0 x4 support NVMe, 4* USB3.2, 2* 2.5GbE

Features
1. Intel® Tiger Lake-UP3 SoC Processor (TDP 12~28W)
2. 1* DDR4-3200MHz SO-DIMM up to 32GB
3. 2* Intel i225-V 2.5GbE
4. 1* VGA,1* HDMI2.0b, 1* eDP, 1* 24-bits LVDS
5. 2* RS232, 2* RS232/422/485, 2* USB3.2 (Gen2), 2* USB3.2 (Gen1), 2* USB2.0
6. 1* M.2 M-key (2242/2280, 1* M.2 E-key(2230), 1* M.2 B-key (3042/3052), 1* SATAIII (6Gb/s)
7. 2* Mixture Header (2* UART, 3* USB2.0, 1* LPC, 1* GPIO(8bit), 1* PCI-Ex1)
8. Onboard TPM 2.0 (option)
9. 12~24V DC-in

　Certification

Categories: ,


Application｜I/O Diagram｜Specifications｜Standard Accessories｜Mechanical

　Applications TOP∧

● Panel PC
● Factory Automation

　I/O Diagram TOP∧
　Specifications TOP∧

Model

– LE30-1135G7 (Default: i5-1135G7)
– LE30-1135G72 (135G7, TPM2.0)
– LE30-1145G7E (i5-1145G7E)
– LE30-1145G7E2 (1145G7E, TPM2.0)
– LE30-6305E (6305E)
– LE30-6305E2 (6305E, TPM2.0)
– LE30-1115G4E (i3-1115G4E)
– LE30-1115G4E2 (i3-1115G4E, TPM2.0)

Form Factor

– 5.5” EPIC (168 * 120mm)

Processor System

– Default: Intel® Tiger Lake i5-1135G7 SoC Processor 2.4G/QC (TDP 12~28W)
– Intel® Tiger Lake6305E / i3-1115G4E / i5-1145G7E SoC Processor
– AMI Flash ROM BIOSS

Memory

– 1* DDR4-3200 Dual Channel SO-DIMM up to 32GB

Storage

– 1* M.2 M-key 2242/2280, PCIe 4.0 x4interface, support NVME/SATA (Jumper)
– 1* SATAIII

Expansion

– 1* M.2 E-key (2230) USB2.0/PCIex1 interface support CNVi
– 1* M.2 B-key(3042/3052) USB2.0/PCIex1 interface support 3G/4G Module)

Ethernet

– 2* Intel i225-V 2.5GbE

Graphics

– Intel® HD Graphics, shared memory
– 1* VGA (Max Resolution: 1920×1080@60Hz)
– 1* eDP (Max Resolution:4096×2304@30Hz)
– 1* LVDS (Max Resolution: 2560×1600@60Hz)
– 1* HDMI 2.0b (Max Resolution: 4096×2160@60Hz)
– Support three independent Displays

Audio

– HD audio: REALTEK codec
– 3W AMP speaker

Watchdog Timer

– From Super I/O to drag RESETCON#
– 256 segments (10sec ~ 255min)

Internal I/O

– 2* USB 2.0
– 1* VGA
– 1* LVDS / Inverter/ Light UP/Down
– 1* eDP
– 2* COM (RS232)
– 1* Audio Header
– 1* Speaker(3W)
– 1* SATAIII /SATA Power
– 2* Mixture Header(2* UART, 1* GPIO (8 bit), 3* USB2.0, 1* LPC, 1* PCI-Ex1)
– 1* Chassis intrusion
– 1* DC Header(DC 12-24V)
– 1* SMBUS
– 1* AT model
– Optional onboard TPM2.0

External I/O

– 2* USB3.2 (Gen2)
– 2* USB3.2 (Gen1)
– 1* HDMI
– 2* RJ45
– 2* COM(RS232/422/485)

Power

12~24V DC-in, ATX power in
– AT: Directly PWR on as Power input ready
– ATX: Press Button to PWR on after Power input ready

Compliance

– CE, FCC, LVD, RoHS, REACH (Option)

Temperature

– Operating Temperature: 0 ~ 60° C
– Storage Temperature: -20 ~ 70° C
– Humidity: 10% ~ 90% RH @40°C (non-condensing)

OS Support

– Windows 10, Windows 11, Linux

Warranty

– 2 Year limited warranty

  * Specifications subject to change without notice, not responsible for typographical errors. Does not include HDD or OS.

　Standard Accessories TOP∧

  Part Number

  Description

 

 LE30 Series M/B
　Mechanical TOP∧
Inquiry

    Subject

    Company(required)

    Name(required)

    Email(required)

    Content

    Model

    LE30 Series
    Dimensions

    168 x 120mm
    CPU Generation

    Tiger Lake
    CPU/Chipset

    1135G7
    CPU Core/Frequency

    4C/2.4GHz
    DRAM/MAX

    1*DDR4-3200
    Front IO

    NA
    Rear IO

    4U/1H/2L/2C
    Internal

    2U/1V/1LVDS/1eDP/2C/1A
    Expansion

    1M2E/1M2B
    Storage

    1SATA/1M2M
    Power

    DC 12~24V

    LE30 Series

      Subject

      Company(required)

      Name(required)

      Email(required)

      Content