TOP∧
| SYSTEM | |
| MB FORM FACTOR | Mini-ITX |
| CPU | Intel® LGA1700 12/13/14th Gen Socket Processor (Formerly Alder Lake-S, TDP 65W) |
| CHIPSET | Intel® H610 |
| MEMORY | 2 x DDR4 3200MHz, Dual Channel SO-DIMM, up to 64GB |
| BIOS | AMI Flash ROM |
| WATCHDOG TIMER | 255 Levels |
| SECURITY | TPM2.0 (Optional) |
| DIMENSION (W X D) | 170.0 (W) x 170.0 (D) mm (6.7″ x 6.7″) |
| OS SUPPORT | Windows® 11 (64bit) Windows® 10 (64bit) Linux |
| POWER | |
| POWER REQUIREMENT | DC-in 12~19V |
| POWER ON MODE | AT / ATX |
| CONNECTOR | DC Jack |
| DISPLAY | |
| GPU | Intel® HD Graphics |
| LVDS | 1 x LVDS (Max. Resolution: 2560 x 1600 @60Hz) |
| eDP | 1 x eDP (Max Resolution: 1920 x 1080@60Hz) |
| DP | 1 x DP1.4 (Max Resolution: 7680 x 4320@60Hz) |
| HDMI | 1 x HDMI 2.0 (Max Resolution: 4096 x 2160@60Hz) |
| MULTIPLE DISPLAY | Support 3 Displays |
| AUDIO | |
| CODEC | Realtek Audio Codec |
| Line-out | 1 x Audio Jack for Line-Out |
| MIC-in | 1 x Audio Jack for MIC-In |
| AMPLIFIER | 3W |
| LAN | |
| ETHERNET | 2 x RJ45 for Realtek® RTL8111H GbE |
| USB PORT | |
| USB | 2 x USB 3.2 Gen 2x1 (10Gbps, Formerly USB 3.1 Gen 2) Internal Header for 2 x USB 3.2 Internal Header for 5 x USB 2.0 |
| SERIAL PORT | |
| COM | Internal Header for 2 x RS-232 Internal Header for 2 x RS-232/422/485 Internal Header for 2 x RS-232 with 5V/12V header |
| INTERNAL I/O | |
| GPIO | 8-Bit (5V) |
| SMBUS | Yes |
| FAN | 1 x CPU Fan Header (Smart Fan) 1 x System Fan Header |
| STORAGE | |
| ADDITIONAL | 1 x Chassis Intrusion 1 x FP_Audio 1 x 2pin Power Connector 1 x 4pin Speaker header (for 3W Amplifier, PH2.0) 1 x 4pin Speaker header (for Buzzer, PH2.54) 1 x FP_JW 1 x LVDS/EDP + Inverter 1 x AT Mode Selection |
| SATA | 2 x SATA III 1 x SATA Power Connector |
| EXPANSION | |
| M.2 | 1 x M-Key 2242/2280 (PCIe 3.0 x4) 1 x E-Key 2230 (CNVi/PCIe x1/USB2.0) Support WiFi/BT Module |
| ENVIRONMENT & CERTIFICATION | |
| SHOCK | 15G, 11ms duration |
| VIBRATION | 1 Grms/ 5~ 500Hz/ Operation |
| OPERATING TEMPERATURE | 0°C ~ 60°C (32°F ~ 140°F) |
| STORAGE TEMPERATURE | -20°C ~ 70°C (-4°F ~ 158°F) |
| OPERATING HUMIDITY | 10 ~ 90% Relative Humidity, Non-condensing |
| CERTIFICATION | CE/FCC Class A LVD |
| ESG DECLARATION | EU RoHS China RoHS REACH |
TOP∧
| PART NUMBER | DESCRIPTION | QTY |
| LI25-H6100L Series | LI25-H6100L Series M/B | 1 |
| F04-MB-092-F | I/O shield | 1 |
| G01-SATA3-BL-1F | SATA Cable | 1 |
| G01-COM-H2M22-1F | COM Cable | 2 |
TOP∧
| PART NUMBER | LI25-H6100L | LI25-H6100L2 |
| CPU | Intel® Socket LGA1700 CPU | Intel® Socket LGA1700 CPU |
| SECURITY | TPM2.0 | |
| POWER REQUIREMENT | DC-in 12~19V | DC-in 12~19V |
| GPU | Intel® HD Graphics | Intel® HD Graphics |
| LVDS | 1 x LVDS | 1 x LVDS |
| eDP | 1 x eDP | 1 x eDP |
| DP | 1 x DP | 1 x DP |
| HDMI | 1 x HDMI | 1 x HDMI |
| MULTIPLE DISPLAY | Support 3 Displays | Support 3 Displays |
| ETHERNET | 2 x GbE | 2 x GbE |
| USB | 2 x USB 3.2 Gen.2 | 2 x USB 3.2 Gen.2 |
| USB | 2 x USB 3.2 | 2 x USB 3.2 |
| USB | 5 x USB 2.0 | 5 x USB 2.0 |
| COM | 6 x COM | 6 x COM |
| SATA | 2 x SATA III | 2 x SATA III |
| M.2 | 1 x M-Key 2242/2280 | 1 x M-Key 2242/2280 |
| M.2 | 1 x E-Key 2230 | 1 x E-Key 2230 |
| OPERATING TEMPERATURE | 0°C ~ 60°C (32°F ~ 140°F) | 0°C ~ 60°C (32°F ~ 140°F) |
TOP∧
 |
TOP∧
 |