TOP∧
SYSTEM | |
MB FORM FACTOR | Mini-ITX |
CPU | Intel® LGA1700 12/13/14th Gen Socket Processor (Formerly Alder Lake-S, TDP 65W) |
CHIPSET | Intel® Q670E |
MEMORY | 2 x DDR5 4800MHz SO-DIMM, up to 96GB 2 x DDR5 5600MHz SO-DIMM, up to 64GB (Intel® 13th/14th Gen CPU) |
BIOS | AMI 256Mb Flash ROM |
WATCHDOG TIMER | 255 Levels |
SECURITY | TPM2.0 |
DIMENSION (W X D) | 170.0 (W) x 170.0 (D) mm (6.7″ x 6.7″) |
OS SUPPORT | Windows® 11 (64bit) Windows® 10 (64bit) Linux |
POWER | |
POWER REQUIREMENT | ATX Power Supply |
POWER ON MODE | AT / ATX |
CONNECTOR | 24+4-pin ATX PWR |
DISPLAY | |
GPU | Intel® UHD Graphics |
LVDS | 1 x 24-bit Dual Channel LVDS (Max. Resolution: 1920 x 1200 @60Hz, Co-lay eDP) |
DP | 1 x DP 1.4a (Max Resolution: 8K@60Hz) |
HDMI | 1 x HDMI 2.0b (Max Resolution: 4096 x 2160@60Hz) |
VGA | 1 x VGA (Max Resolution: 1920 x 1080 @60Hz) |
MULTIPLE DISPLAY | Support 4 Displays |
AUDIO | |
CODEC | Realtek Audio Codec |
Line-in | 1 x Audio Jack for Line-In |
Line-out | 1 x Audio Jack for Line-Out |
MIC-in | 1 x Audio Jack for MIC-In |
LAN | |
ETHERNET | 1 x RJ45 for Intel® I226-V 2.5GbE 1 x RJ45 for Intel® I219-LM GbE |
USB PORT | |
USB | 6 x USB 3.2 Gen2 Internal Header for 2 x USB 3.2 Internal Header for 3 x USB 2.0 |
SERIAL PORT | |
COM | 1 x DB-9 for RS-232/422/485 1 x DB-9 for RS-232 Internal Header for 4 x RS-232 |
INTERNAL I/O | |
GPIO | 8-Bit |
SMBUS | Yes |
ADDITIONAL | 1 x Chassis Intrusion 1 x Audio Header 1 x PS/2 1 x LVDS (co-layout eDP) |
STORAGE | |
SATA | 4 x SATA III |
RAID | RAID 0, 1, 5, 10 |
EXPANSION | |
M.2 | 1 x M-key 2280 (SATA/PCIe Gen.3 x4 interface) 1 x M-Key 2242 (PCIe Gen.4 x4/SATA interface) support NVMe 1 x E-Key 2230 (USB 2.0/PCIe 3.0 x1) Support CNVi 1 x B-key 3042 (PCIe Gen.3 x1/USB3.2 Gen.2/USB2.0 interface) support 4G Module |
PCIE | 1 x PCIe x16 (Gen.4) |
SIM | 1 x SIM Card Slot |
ENVIRONMENT & CERTIFICATION | |
SHOCK | 15G, 11ms duration |
VIBRATION | 1 Grms/ 5~ 500Hz/ Operation |
OPERATING TEMPERATURE | 0°C ~ 60°C (32°F ~ 140°F) |
STORAGE TEMPERATURE | -20°C ~ 85°C (-4°F ~ 185°F) |
OPERATING HUMIDITY | 10 ~ 90% Relative Humidity, Non-condensing |
CERTIFICATION | CE/FCC Class A LVD |
ESG DECLARATION | EU RoHS China RoHS REACH |
TOP∧
PART NUMBER | DESCRIPTION | QTY |
MI225Q6700 Series | MI225Q6700 Series M/B | 1 |
F04-MB-073-1F | MI225 I/O Shield | 1 |
G01-SATA3-BL-1F | SATA Cable | 1 |
PART NUMBER | MI225Q6700-A1 | MI225Q6702-A1 |
CPU | Intel® Socket LGA1700 CPU | Intel® Socket LGA1700 CPU |
SECURITY | TPM2.0 | |
POWER REQUIREMENT | ATX Power Supply | ATX Power Supply |
GPU | Intel® UHD Graphics | Intel® UHD Graphics |
LVDS | 1 x LVDS/eDP | 1 x LVDS/eDP |
DP | 1 x DP | 1 x DP |
HDMI | 1 x HDMI | 1 x HDMI |
VGA | 1 x VGA | 1 x VGA |
MULTIPLE DISPLAY | Support 4 Displays | Support 4 Displays |
ETHERNET | 1 x GbE | 1 x GbE |
ETHERNET | 1 x 2.5GbE | 1 x 2.5GbE |
USB | 6 x USB 3.2 Gen 2 | 6 x USB 3.2 Gen 2 |
USB | 2 x USB 3.2 | 2 x USB 3.2 |
USB | 3 x USB 2.0 | 3 x USB 2.0 |
COM | 1 x RS-232/422/485 | 1 x RS-232/422/485 |
COM | 5 x RS-232 | 5 x RS-232 |
SATA | 4 x SATA III | 4 x SATA III |
M.2 | 1 x M-Key 2242 | 1 x M-Key 2242 |
M.2 | 1 x M-Key 2280 | 1 x M-Key 2280 |
M.2 | 1 x E-Key 2230 | 1 x E-Key 2230 |
M.2 | 1 x B-Key 3042/3052 | 1 x B-Key 3042/3052 |
PCIE | 1 x PCIE x16 | 1 x PCIE x16 |
SIM | 1 x SIM Card Slot | 1 x SIM Card Slot |
OPERATING TEMPERATURE | 0°C ~ 60°C (32°F ~ 140°F) | 0°C ~ 60°C (32°F ~ 140°F) |
TOP∧
![]() |
TOP∧
![]() |