HBJC153I23

MB FORM FACTOR

Mini-ITX

CPU

Intel® LGA1700 Socket, 12/13/14th gen processors (Max. TDP 65W)
For additional compatible CPUs, please contact regional sales

CHIPSET

Intel® Q670E

MEMORY

2 x Intel® 12th/13th/14th CPU supports DDR5 4800MHz Dual Channel SO-DIMM, up to 96GB max
2 x Intel® 13th/14th CPU supports DDR5 5600MHz Dual Channel SO-DIMM, up to 64GB max
Actual memory support depends on the specific CPU and model

BIOS

AMI Flash ROM

WAKE ON LAN

Yes

WATCHDOG TIMER

255 Levels

SECURITY

TPM2.0

RTC BATTERY

Lithium Battery

OS SUPPORT

Windows® 11 (64bit)
Linux

POWER REQUIREMENT

1U FLEX 400W ATX PWR (4+24 pin)
MB : ATX Power Input (24pin ATX + 4pin 12V)

POWER ON MODE

ATX (Default) Mode

GPU

Intel® UHD Graphics, shared memory

HDMI

1 x HDMI (Max Resolution: 1920×1080@60Hz)

ETHERNET

7 x RJ45 for Intel® i225-V 2.5GbE
1 x RJ45 for Intel® i225-LM 2.5GbE

REAR PANEL I/O

AC input CON
Power on/off SW

FRONT PANEL I/O

8 x RJ45
2 x USB 3.2(Gen.2)
2 x USB3.2 (Gen.1)
1 x RS-232
1 x HDMI
1 x Alarm LED
1 x Power LED
1 x Power Switch

SATA

2 x 2.5″ SATA 6Gb/s internal drive bay (only Support 2.5″ HDD with a hight ≤ 10mm)

M.2

1 x M-key 2242/2280 (PCIe Gen.4×4 w/SATA interface)
1 x M-key 2280 (PCIe Gen.4×4 w/SATA interface) support NVMe
1 x E-Key 2230 (USB 2.0/PCIe x1) Support CNVi
1 x B-key 3042 (USB3.2 Gen.1/USB2.0/PCIe x1 interface) support 4G Module

PCIE

1 x PCIE x4

SIM

1 x SIM Card Slot

DIMENSIONS (W x H x D)

430.0 (W) x 252.0 (D) x 44.0 (H) mm

SHOCK

15G, 11ms duration

VIBRATION

1 Grms/ 5~ 500Hz/ Operation

OPERATING TEMPERATURE

0°C ~ 50°C (32°F ~ 122°F)

STORAGE TEMPERATURE

-40°C ~ 85°C (-40°F ~ 185°F)

OPERATING HUMIDITY

10 ~ 95% @ 40°C, Non-condensing

CERTIFICATION

CE/FCC Class A
LVD

ESG DECLARATION

EU RoHS
China RoHS
ErP

Part Number

Description

QTY per Board

HBJC153I23 Series

HBJC153I23

1

F07-FN9025-F

LGA1700 CPU FAN

1

G01-GPIO9-M30D-F

COM Cable, L=30cm

1

G01-2X10A-HDMI-1F

HDMI Cable, L=25cm

1

Change according to shipping area

Power Cord

1

LCSCJC150-F

Screw Pack

1

Part Number

HBJC153I23-Q670B

HBJC153I23-Q670G4

HBJC153I23-Q670B4

CPU

Intel® Processor Q670E

Intel® Processor Q670E

Intel® Processor Q670E

MEMORY

2 x DDR5 SO-DIMM, up to 96GB

2 x DDR5 SO-DIMM, up to 96GB

2 x DDR5 SO-DIMM, up to 96GB

SECURITY

TPM2.0 (Optional)

TPM2.0 (Optional)

TPM2.0 (Optional)

GPU

Intel® UHD Graphics, shared memory

Intel® UHD Graphics, shared memory

Intel® UHD Graphics, shared memory

HDMI

1 x HDMI

1 x HDMI

1 x HDMI

ETHERNET

8 x 2.5GbE

8 x 2.5GbE

8 x 2.5GbE

I/O

AC input CON
1 x Power Switch
8 x RJ45
2 x USB 3.2 Gen 2
2 x USB 3.2 Gen 1
1 x RS-232
1 x HDMI
1 x Alarm LED
1 x Power LED
1 x Power Switch

AC input CON
1 x Power Switch
8 x RJ45
2 x USB 3.2 Gen 2
2 x USB 3.2 Gen 1
1 x RS-232
1 x HDMI
1 x Alarm LED
1 x Power LED
1 x Power Switch

AC input CON
1 x Power Switch
8 x RJ45
2 x USB 3.2 Gen 2
2 x USB 3.2 Gen 1
1 x RS-232
1 x HDMI
1 x Alarm LED
1 x Power LED
1 x Power Switch

SATA

2 x 2.5” SATA HDD

2 x 2.5” SATA HDD

2 x 2.5” SATA HDD

M.2

1 x M-Key 2242/2280
1 x M-Key 2280
1 x E-Key 2230
1 x B-Key 3042

1 x M-Key 2242/2280
1 x M-Key 2280
1 x E-Key 2230
1 x B-Key 3042

1 x M-Key 2242/2280
1 x M-Key 2280
1 x E-Key 2230
1 x B-Key 3042

PCIE

1 x PCIE x4

1 x PCIE x4

1 x PCIE x4

USB

3 x USB 3.2

3 x USB 3.2

3 x USB 3.2

OTHER

—

4-port PCIe LAN Card

4-port Bypass LAN Card

OPERATING TEMPERATURE

0°C ~ 50°C (32°F ~ 122°F)

0°C ~ 50°C (32°F ~ 122°F)

0°C ~ 50°C (32°F ~ 122°F)