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SYSTEM | |
MB FORM FACTOR | Mini-ITX |
CPU | Intel® LGA1700 12/13/14th Gen Socket Processor (Formerly Alder Lake-S, TDP 65W) |
CHIPSET | Intel® Q670E/H610/H610E |
MEMORY | 2 x DDR5 4800MHz SO-DIMM, up to 96GB 2 x DDR5 5600MHz SO-DIMM, up to 64GB (Intel® 13th/14th Gen CPU) |
BIOS | AMI Flash ROM |
SECURITY | TPM2.0 |
RTC BATTERY | Lithium Battery |
OS SUPPORT | Windows® 11 (64bit) Linux |
POWER | |
POWER REQUIREMENT | ATX Power Supply 1U FLEX 400W ATX PWR (4+24 pin) |
POWER ON MODE | ATX (Default) Mode |
DISPLAY | |
GPU | Intel® UHD Graphics |
DP | 1 x DP1.4a (Max Resolution: 4096 x 2304@60Hz) |
HDMI | 1 x HDMI 2.0b (Max Resolution: 4096 x 2160@60Hz) |
VGA | 1 x VGA (Max Resolution: 1920 x 1080 @60Hz) |
MULTIPLE DISPLAY | Support 3 Displays |
AUDIO | |
CODEC | Realtek Audio Codec |
LAN | |
ETHERNET | 1 x Intel® i219-LM GbE + 1 x Intel® i225-V 2.5GbE (Q670) 1 x Intel® i219-V GbE + 1 x Intel® i225-V 2.5GbE (H610) |
SYSTEM I/O | |
REAR PANEL I/O | 2 x RJ45 6 x USB 3.2 Gen.2 (HBJC150I225-Q670) 4 x USB 3.2 Gen.2 + 2 x USB2.0 (HBJC150I225-H610) 1 x HDMI 1 x DP 1 x VGA 2 x COM 1 x Line-in 1 x Line-out 1 x MIC-in |
FRONT PANEL I/O | 1 x Power Button 1 x Reset Button 2 x USB 2.0 1 x Power LED 1 x HDD LED |
STORAGE | |
SATA | 2 x SATA III |
EXPANSION | |
M.2 | 1 x M-key 2280 (PCIe Gen.3 x4 interface) support NVMe 1 x M-Key 2242 (PCIe Gen.4 x4/SATA interface) support NVMe (HBJC150I225-Q670 only) 1 x E-Key 2230 (USB 2.0/PCIe 3.0 x1) Support CNVi 1 x B-key 3042 (PCIe Gen.3 x1/USB3.2 Gen.2/USB2.0 interface) (HBJC150I225-Q670 only) 1 x B-key 3042 (PCIe Gen.3 x1 interface) (HBJC150I225-H610 only) |
PCIE | 1 x PCI Express x16 (Gen.4) |
SIM | 1 x SIM Card Slot |
OTHERS | |
OTHER | 1 x GPIO (8 Bit) |
MECHANICAL | |
DIMENSIONS (W x H x D) | 430.0 (W) x 252.0 (D) x 44.0 (H) mm |
GROSS WEIGHT | 5.2 kg |
NET WEIGHT | 4.2 kg |
ENVIRONMENT & CERTIFICATION | |
SHOCK | 15G, 11ms duration |
VIBRATION | 1 Grms/ 5~ 500Hz/ Operation |
OPERATING TEMPERATURE | 0°C ~ 50°C (32°F ~ 122°F) |
STORAGE TEMPERATURE | -40°C ~ 85°C (-40°F ~ 185°F) |
OPERATING HUMIDITY | 10 ~ 90% @ 40°C, Non-condensing |
CERTIFICATION | CE/FCC Class A LVD |
ESG DECLARATION | EU RoHS China RoHS ErP |
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PART NUMBER | DESCRIPTION | QTY |
Change according to shipping area | Power Cord | 1 |
LCSCJC150-F | Screw Pack | 1 |
G01-SATA3-BL-1F | SATA Cable | 1 |
F07-FN9025-F | 90x25mm LGA1700 CPU FAN Module | 1 |
PART NUMBER | HBJC150I225-Q670BA1 |
CPU | Intel® Socket LGA1700 CPU |
POWER REQUIREMENT | ATX Power Supply |
GPU | Intel® UHD Graphics |
DP | 1 x DP |
HDMI | 1 x HDMI |
VGA | 1 x VGA |
MULTIPLE DISPLAY | Support 3 Displays |
ETHERNET | 2 x GbE |
I/O | 2 x RJ45 |
I/O | 6 x USB 3.2 Gen 2 |
I/O | 2 x USB 2.0 |
I/O | 1 x HDMI |
I/O | 1 x DP |
I/O | 1 x VGA |
I/O | 2 x COM |
I/O | 1 x Line-in |
I/O | 1 x Line-out |
I/O | 1 x MIC-in |
I/O | 1 x Power Button |
I/O | 1 x Reset |
I/O | 1 x Power LED |
I/O | 1 x HDD LED |
SATA | 2 x SATA III |
M.2 | 1 x M-Key 2242 |
M.2 | 1 x M-Key 2280 |
M.2 | 1 x E-Key 2230 |
PCIE | 1 x PCIE x16 |
OPERATING TEMPERATURE | 0°C ~ 50°C (32°F ~ 122°F) |
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