HBJC150I225

MB FORM FACTOR

Mini-ITX

CPU

Intel® LGA1700 Socket, 12/13/14th gen processors (Max. TDP 65W)

CHIPSET

Intel® Q670E/H610/H610E

MEMORY

2 x Intel® 12th/13th/14th CPU supports DDR5 4800MHz Dual Channel SO-DIMM, up to 96GB max
2 x Intel® 13th/14th CPU supports DDR5 5600MHz Dual Channel SO-DIMM, up to 64GB max
Actual memory support depends on the specific CPU and model

BIOS

AMI Flash ROM

SECURITY

TPM2.0

RTC BATTERY

Lithium Battery

OS SUPPORT

Windows® 11 (64bit)
Linux

POWER REQUIREMENT

1U FLEX 400W ATX PWR (4+24 pin)

POWER ON MODE

ATX (Default) Mode

GPU

Intel® UHD Graphics

DP

1 x DP1.4a (Max Resolution: 4096 x 2304@60Hz)

HDMI

1 x HDMI 2.0b (Max Resolution: 4096 x 2160@60Hz)

VGA

1 x VGA (Max Resolution: 1920 x 1080 @60Hz)

MULTIPLE DISPLAY

Support 3 Displays

CODEC

Realtek ALC888S

ETHERNET

1 x Intel® i219-LM GbE + 1 x Intel® i225-V 2.5GbE (Q670)
1 x Intel® i219-V GbE + 1 x Intel® i225-V 2.5GbE (H610)

REAR PANEL I/O

2 x RJ45
6 x USB 3.2 Gen.2 (HBJC150I225-Q670)
4 x USB 3.2 Gen.2 + 2 x USB2.0 (HBJC150I225-H610)
1 x HDMI
1 x DP
1 x VGA
2 x COM
1 x Audio (Line-in, Line out, MIC)

FRONT PANEL I/O

1 x Power Button
1 x Reset Button
2 x USB 2.0
1 x Power LED
1 x HDD LED

SATA

2 x SATA3

M.2

1 x M-key 2280 (PCIe Gen.3 x4 interface) support NVMe
1 x M-Key 2242 (PCIe Gen.4 x4/SATA interface) support NVMe (HBJC150I225-Q670 only)
1 x E-Key 2230 (USB 2.0/PCIe 3.0 x1) Support CNVi
1 x B-key 3042 (PCIe Gen.3 x1/USB3.2 Gen.2/USB2.0 interface) (HBJC150I225-Q670 only)
1 x B-key 3042 (PCIe Gen.3 x1 interface) (HBJC150I225-H610 only)

PCIE

1 x PCI Express x16 (Gen.4)

SIM

1 x SIM Card Slot

OTHER

1 x GPIO (8 Bit)

DIMENSIONS (W x H x D)

430.0 (W) x 252.0 (D) x 44.0 (H) mm

GROSS WEIGHT

5.2 KG

NET WEIGHT

4.2 KG

SHOCK

15G, 11ms duration

VIBRATION

1 Grms/ 5~ 500Hz/ Operation

OPERATING TEMPERATURE

0°C ~ 50°C (32°F ~ 122°F)

STORAGE TEMPERATURE

-40°C ~ 85°C (-40°F ~ 185°F)

OPERATING HUMIDITY

10 ~ 90% @ 40°C, Non-condensing

CERTIFICATION

CE/FCC Class A
LVD

ESG DECLARATION

EU RoHS
China RoHS
ErP

Part Number

Description

QTY per Board

Change according to shipping area

Power Cord

1

LCSCJC150-F

Screw Pack

1

G01-SATA3-BL-1F

SATA Cable

1

F07-FN9025-F

90x25mm LGA1700 CPU FAN Module

1

Part Number

HBJC150I225-Q670B

HBJC150I225-H610B

CPU

Intel® Processor Q670E

Intel® Processor H610

MEMORY

2 x DDR5 SO-DIMM, up to 96GB

2 x DDR5 SO-DIMM, up to 96GB

SECURITY

TPM2.0 (Optional)

TPM2.0 (Optional)

GPU

Intel® UHD Graphics

Intel® UHD Graphics

DP

1 x DP

1 x DP

HDMI

1 x HDMI

1 x HDMI

VGA

1 x VGA

1 x VGA

MULTIPLE DISPLAY

Support 3 Displays

Support 3 Displays

ETHERNET

2 x GbE

2 x GbE

I/O

2 x RJ45
6 x USB 3.2 Gen 2
1 x HDMI
1 x DP
1 x VGA
2 x COM
1 x Audio (Line-in, Line-out, MIC)
2 x USB 2.0
1 x USB 3.0
1 x Power Button
1 x Reset
1 x Power LED
1 x HDD LED

2 x RJ45
4 x USB 3.2 Gen 2
1 x HDMI
1 x DP
1 x VGA
2 x COM
1 x Audio (Line-in, Line-out, MIC)
2 x USB 2.0
1 x USB 3.0
1 x Power Button
1 x Reset
1 x Power LED
1 x HDD LED

SATA

2 x SATA3

2 x SATA3

M.2

1 x M-Key 2242
1 x M-Key 2280
1 x E-Key 2230

1 x M-Key 2280
1 x E-Key 2230
1 x B-Key 3042

PCIE

1 x PCIE x16

1 x PCIE x16

OPERATING TEMPERATURE

0°C ~ 50°C (32°F ~ 122°F)

0°C ~ 50°C (32°F ~ 122°F)